Patents by Inventor Keiichi Yamaguchi
Keiichi Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240333243Abstract: A method of manufacturing a resonator element including a substrate having a thin-wall part and a thick-wall part, and an electrode part having an excitation electrode arranged in an excitation electrode placement area of the thin-wall part, a pad electrode arranged in a pad electrode placement area of the thick-wall part, and an extraction electrode which is configured to couple the excitation electrode and the pad electrode to each other, and which is arranged in an extraction electrode placement area of the substrate, includes a metal layer formation step of forming a metal layer on the substrate, a protective film formation step of forming a protective film in an area overlapping at least a part of the extraction electrode placement area in a plan view on the metal layer, and a metal layer etching step of etching the metal layer arranged in the excitation electrode placement area via the protective film to thereby reduce a wall thickness of the metal layer.Type: ApplicationFiled: March 27, 2024Publication date: October 3, 2024Inventors: Yusuke Yamamoto, Keiichi Yamaguchi, Ryuta Nishizawa
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Publication number: 20240333255Abstract: A resonator element includes a substrate including a thin-wall part and a thick-wall part, and an electrode part including an excitation electrode, a pad electrode, and an extraction electrode, wherein the electrode part includes a first electrode layer arranged in the pad electrode placement area and the first area on the substrate, a second electrode layer which is arranged in an area overlapping the first electrode layer on the first electrode layer, and which is larger in thickness than the first electrode layer, a third electrode layer which is arranged throughout an area overlapping the pad electrode placement area and the first area in a plan view on the second electrode layer, and an area overlapping the second area and the excitation electrode placement area in a plan view on the substrate, and which is smaller in thickness than the second electrode layer, and a fourth electrode layer which is arranged in an area overlapping the third electrode layer on the third electrode layer, and which is smallerType: ApplicationFiled: March 25, 2024Publication date: October 3, 2024Inventors: Yusuke Yamamoto, Keiichi Yamaguchi, Ryuta Nishizawa
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Patent number: 12088277Abstract: A vibration device includes a quartz substrate including a first vibration section, a second vibration section, and a third vibration section, a pair of first excitation electrodes formed at two principal surfaces of the quartz substrate, a pair of second excitation electrodes so formed as to sandwich the second vibration section in the thickness direction of the quartz substrate, and a pair of third excitation electrodes so formed as to sandwich the third vibration section in the thickness direction of the quartz substrate. At least one of the pair of second excitation electrodes is formed at a first inclining surface that inclines with respect to the two principal surfaces. At least one of the pair of third excitation electrodes is formed at a second inclining surface that inclines with respect to the two principal surfaces. The second inclining surface inclines with respect to the first inclining surface.Type: GrantFiled: May 18, 2021Date of Patent: September 10, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Ryuta Nishizawa, Atsushi Matsuo, Keiichi Yamaguchi, Taku Matsunaga
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Patent number: 11978614Abstract: A substrate processing apparatus includes a chamber having a plasma processing space, a sidewall of the chamber having an opening for transferring a substrate into the plasma processing space; and a shutter disposed at an inner side than the sidewall and configured to open or close the opening, the shutter having a flow path for a temperature-controlled fluid.Type: GrantFiled: June 17, 2020Date of Patent: May 7, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Yusuke Hayasaka, Jun Young Chung, Shuhei Yamabe, Keiichi Yamaguchi, Takehiro Tanikawa
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Publication number: 20240113692Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in a region of an element formation region other than a first groove formation region and a second groove formation region when a region of the quartz crystal substrate where the vibrator is formed is referred to as the element formation region, a region where the first groove is formed is referred to as the first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film, a second protective film formation step of forming a second protective film in the first groove formation region, and a second dry etching step of dry etching the quartz crystal substrateType: ApplicationFiled: September 27, 2023Publication date: April 4, 2024Inventors: Tsukasa Watanabe, Keiichi Yamaguchi, Shigeru Shiraishi, Ryuta Nishizawa
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Publication number: 20240113691Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in a second groove formation region when a region of the quartz crystal substrate where the vibrator is formed is referred to as an element formation region, a region where the first groove is formed is referred to as a first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, a second protective film formation step of forming, in the first groove formation region, a second protective film having a lower etching rate than the first protective film, a third protective film formation step of forming a third protective film in a region of the element formation region other than the first groove formation region and the second groove formation region, and a first dry etching stType: ApplicationFiled: September 27, 2023Publication date: April 4, 2024Inventors: Tsukasa Watanabe, Keiichi Yamaguchi, Shigeru Shiraishi, Ryuta Nishizawa
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Publication number: 20240110786Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface that are in a front and back relationship, a first protective film formation step of forming a first protective film in an element formation region of the first surface, the first protective film having a first opening overlapping a first groove formation region and a second opening overlapping a second groove formation region, in which a region of the quartz crystal substrate where the vibrator is formed is referred to as the element formation region, a region where the first groove is formed is referred to as the first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film.Type: ApplicationFiled: September 27, 2023Publication date: April 4, 2024Inventors: Hiyori Sakata, Keiichi Yamaguchi, Ryuta Nishizawa, Shigeru Shiraishi
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Publication number: 20240113690Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first film formation step of forming a first stacked body by sequentially stacking a first underlying film, a second underlying film, and a first protective film at the first surface, a first patterning step of patterning the first stacked body in a manner in which the first underlying film, the second underlying film, and the first protective film remain in a region of an element formation region other than a first groove formation region and a second groove formation region, the first underlying film and the second underlying film remain in the first groove formation region, and the first underlying film remains in the second groove formation region, and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first stacked body.Type: ApplicationFiled: September 27, 2023Publication date: April 4, 2024Inventors: Tsukasa Watanabe, Keiichi Yamaguchi, Shigeru Shiraishi, Ryuta Nishizawa
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Publication number: 20240110787Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in an element formation region of the quartz crystal substrate at the first surface where the vibrator is formed; and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film. R1>R2, in which R1 is a thickness of the first protective film in a first groove formation region of the quartz crystal substrate where the first groove is formed and R2 is a thickness of the first protective film in the second groove formation region where the second groove is formed.Type: ApplicationFiled: September 27, 2023Publication date: April 4, 2024Inventors: Kosuke Ariizumi, Keiichi Yamaguchi, Shigeru Shiraishi, Ryuta Nishizawa
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Patent number: 11940275Abstract: A vibrator device includes a vibrator element, and a support substrate configured to support the vibrator element. The vibrator element includes a drive arm provided with a drive signal electrode and a drive constant-potential electrode, and a detection arm provided with a detection signal electrode and a detection constant-potential electrode. The support substrate includes a base, and a drive signal interconnection electrically coupled to the drive signal electrode, a drive constant-potential interconnection electrically coupled to the drive constant-potential electrode, and a detection signal interconnection electrically coupled to the detection signal electrode all provided to the base, and the drive arm includes a first surface located at the support substrate side, and a second surface located at an opposite side to the first surface. Further, the drive constant-potential electrode is disposed on the first surface, and the drive signal electrode is disposed on the second surface.Type: GrantFiled: April 12, 2022Date of Patent: March 26, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Seiichiro Ogura, Keiichi Yamaguchi, Ryuta Nishizawa
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Publication number: 20240080001Abstract: An electronic apparatus according to one embodiment, includes: a signal generator generating a first signal and a second signal; a first characteristic circuitry acquiring first and second distorted signals by giving first and second distortion characteristic to the first and second signals; a first time-characteristic circuitry acquiring a third distorted signal by giving a first time-characteristic to the first distorted signal and acquiring a fourth distorted signal by giving a second time-characteristic to the second distorted signal; a second characteristic circuitry acquiring a fifth distorted signal by giving a second distortion characteristic to the third distorted signal, and acquiring a sixth distorted signal by giving the second distortion characteristic to the fourth distorted signal; and a processing circuitry estimating at least one of the first distortion characteristic and the second distortion characteristic based on the first signal, the second signal, the fifth distorted signal, and the sixType: ApplicationFiled: March 7, 2023Publication date: March 7, 2024Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATIONInventors: Yoshimasa KIMOTO, Yoshimasa EGASHIRA, Keiichi YAMAGUCHI, Takayuki KATO
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Publication number: 20240080968Abstract: According to one embodiment, a circuit element includes a silicon substrate, a lower electrode, a dielectric film, and an upper electrode. The lower electrode is formed on a major surface of the silicon substrate by a doping process. The dielectric film is formed on the lower electrode. The upper electrode is formed on the dielectric film. The upper electrode includes a slit.Type: ApplicationFiled: February 22, 2023Publication date: March 7, 2024Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Hiroaki IKEUCHI, Keiichi YAMAGUCHI
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Publication number: 20240069057Abstract: An angular velocity detection element includes: a drive vibration arm configured to perform flexural vibration according to an applied drive signal; and a detection vibration arm configured to perform flexural vibration according to an applied angular velocity. Each of the drive vibration arm and the detection vibration arm has a bottomed groove portion along an extending direction. d2/t2>d1/t1, in which t1 is a thickness of the drive vibration arm, d1 is a depth of the groove portion of the drive vibration arm, t2 is a thickness of the detection vibration arm, and d2 is a depth of the groove portion of the detection vibration arm.Type: ApplicationFiled: August 28, 2023Publication date: February 29, 2024Inventors: Seiichiro OGURA, Keiichi YAMAGUCHI, Ryuta NISHIZAWA
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Patent number: 11916538Abstract: A vibrator device includes a vibrating body having obverse and reverse principal surfaces and a side surface connecting the obverse and reverse principal surfaces to each other, a package configured to house the vibrating body, and a bonding material configured to fix the vibrating body to the package, wherein the vibrating body has a coupling part including a recess recessed from the side surface toward a center of the principal surfaces, and a protrusion protruding from a side surface of the recess, the protrusion is one of breaking-off parts with which a plurality of the vibrating bodies is broken off from a wafer to which the plurality of the vibrating bodies is coupled, and the bonding material has contact with a side surface of the protrusion in the recess.Type: GrantFiled: January 19, 2021Date of Patent: February 27, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Seiichiro Ogura, Keiichi Yamaguchi, Ryuta Nishizawa
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Publication number: 20240056053Abstract: A manufacturing method for a vibrator element includes a preparation step of preparing a quartz crystal substrate having a first substrate surface and a second substrate surface, a first protective film formation step of forming a first protective film in first groove formation areas of the first substrate surface, a second protective film formation step of forming a second protective film in an area except the first groove formation areas of a first vibrating arm formation area and a second vibrating arm formation area of the first substrate surface, and a first dry etching step of dry etching the quartz crystal substrate from the first substrate surface side via the first protective film and the second protective film and forming a first surface, first grooves, and outer shapes of the first vibrating arm and the second vibrating arm, wherein r1>r2, where an etching rate of the first protective film is r1 and an etching rate of the second protective film is r2.Type: ApplicationFiled: August 9, 2023Publication date: February 15, 2024Inventors: Keiichi YAMAGUCHI, Hiyori SAKATA, Shigeru SHIRAISHI, Ryuta NISHIZAWA
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Patent number: 11888464Abstract: A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.Type: GrantFiled: December 14, 2022Date of Patent: January 30, 2024Inventors: Seiichiro Ogura, Keiichi Yamaguchi, Masahiro Oshio, Takashi Yamazaki
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Publication number: 20230387885Abstract: A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.Type: ApplicationFiled: August 8, 2023Publication date: November 30, 2023Inventors: Seiichiro OGURA, Keiichi YAMAGUCHI, Masahiro OSHIO, Takashi YAMAZAKI
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Patent number: 11747350Abstract: A blood coagulation analyzing method according to one or more aspects may include: calculating a coagulation time based on data representing a coagulation curve of a change in an optical detection value of a blood specimen added with a reagent for starting a coagulation reaction; calculating an index value related to derivatives calculated concerning the coagulation curve represented by the data used in the calculating the coagulation time; and determining whether an early reaction error has occurred based on a comparison result obtained by comparing the index value to a predetermined threshold.Type: GrantFiled: September 26, 2019Date of Patent: September 5, 2023Assignee: SYSMEX CORPORATIONInventors: Hiroshi Kurono, Keiichi Yamaguchi
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Publication number: 20230188109Abstract: Provided is a method for manufacturing a vibrator element including a first vibration arm and a second vibration arm that each have a first surface and a second surface. The manufacturing method includes a preparation step of preparing a quartz crystal substrate, a first protective film forming step of forming a first protective film on a first substrate surface of the quartz crystal substrate, a first dry etching step of dry etching the quartz crystal substrate via the first protective film, a second protective film forming step of forming a second protective film on a second substrate surface of the quartz crystal substrate, and a second dry etching step of dry etching the quartz crystal substrate via the second protective film. Outer shapes of the first vibration arm and the second vibration arm are formed from the first surface to the second surface in the first dry etching step, and the outer shapes of the first vibration arm and the second vibration arm are not formed in the second dry etching step.Type: ApplicationFiled: December 8, 2022Publication date: June 15, 2023Inventors: Keiichi YAMAGUCHI, Hiyori SAKATA, Shigeru SHIRAISHI, Ryuta NISHIZAWA
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Publication number: 20230179164Abstract: A method for manufacturing a vibrator element includes a first protective film forming step of forming a first protective film on a first substrate surface of a quartz crystal substrate, a first dry etching step of dry etching the quartz crystal substrate from a first substrate surface side to form a first groove and outer shapes of a first and second vibration arms, a second protective film forming step of forming a second protective film on a second substrate surface of the quartz crystal substrate, and a second dry etching step of dry etching the quartz crystal substrate from a second substrate surface side to form a second groove and outer shapes of the first and second vibration arms. In the first dry etching step, the outer shapes of the first and second vibration arms are formed to be closer to the second substrate surface than is a position where a bottom surface of the second groove is formed.Type: ApplicationFiled: December 1, 2022Publication date: June 8, 2023Inventors: Keiichi YAMAGUCHI, Hiyori SAKATA, Shigeru SHIRAISHI, Ryuta NISHIZAWA