Abstract: There is provided a method for producing, at a high yield, a composition containing 3-chloro-4-methoxybenzylamine hydrochloride (CMBA-HCl) in which the purity of CMBA-HCl is high. This method comprises a chlorination step involving a chlorination reaction that generates CMBA-HCl from 4-methoxybenzylamine hydrochloride using hydrogen peroxide and hydrochloric acid. There is also provided a CMBA-HCl-containing composition which is produced by the aforementioned production method and in which the purity of CMBA-HCl is high.

Abstract: There is provided a method for producing, at a high yield, a composition containing 3-chloro-4-methoxybenzylamine hydrochloride (CMBA-HCl) in which the purity of CMBA-HCl is high. This method comprises a chlorination step involving a chlorination reaction that generates CMBA-HCl from 4-methoxybenzylamine hydrochloride using hydrogen peroxide and hydrochloric acid. There is also provided a CMBA-HCl-containing composition which is produced by the aforementioned production method and in which the purity of CMBA-HCl is high.

Abstract: There is provided a method for producing, at a high yield, a composition containing 3-chloro-4-methoxybenzylamine hydrochloride (CMBA-HCl) in which the purity of CMBA-HCl is high. This method comprises a chlorination step involving a chlorination reaction that generates CMBA-HCl from 4-methoxybenzylamine hydrochloride using hydrogen peroxide and hydrochloric acid. There is also provided a CMBA-HCl-containing composition which is produced by the aforementioned production method and in which the purity of CMBA-HCl is high.

Abstract: The present invention relates to a method for causing sodium sulfide or a mixture of sodium sulfide and sulfur to react with diazonium salt formed by diazotizing anthranilic acid, wherein the Na/S atomic ratio as calculated on the basis of the employed sodium sulfide and sulfur is adjusted to within the range of 1.33 to 2.0 during the reaction. Thus is made practicable the manufacture of thiosalicylic acid in a high yield without going through the individual route of isolating and reducing dithiosalicylic acid.

Abstract: The present invention relates to a method for causing sodium sulfide or a mixture of sodium sulfide and sulfur to react with diazonium salt formed by diazotizing anthranilic acid, wherein the Na/S atomic ratio as calculated on the basis of the employed sodium sulfide and sulfur is adjusted to within the range of 1.33 to 2.0 during the reaction. Thus is made practicable the manufacture of thiosalicylic acid in a high yield without going through the individual route of isolating and reducing dithiosalicylic acid.

Abstract: A method of separating 3-nitro-o-toluic acid and 5-nitro-o-toluic acid from a mixture of said isomers, comprising producing salts by adding an aromatic organic base, for example, aniline or pyridine, to the said mixture, separating said salts into solids and a mother liquor, by taking advantage of the difference in solubilities between the said salts to water or a mixed solvent consisting of water and a water-soluble organic compound, for example, methanol, and, further, recovering 3-nitro-o-toluic acid from the mother liquor and 5-nitro-o-toluic acid from the solids.

Abstract: Alkoxynaphthalenecarboxylic acid is produced by a process comprising the addition of 1,3-butadiene to alkoxyalkylbenzene to yield an adduct. The adduct is cyclized in the presence of an acid catalyst to alkoxyalkyltetralin. The tetralin derivative is then dehydrogenated to produce aloxyalkylnaphthalene, which is oxidized to alkoxynaphthalenecarboxylic acid.

Abstract: An improved process for manufacturing 5-hydroxyisophthalic acid by means of oxidizing 5-acyloxy-m-xylene or its oxidation intermediate with molecular oxygen in a solvent consisting of lower aliphatic carboxylic acid and acetic anhydride in the presence of catalyst consisting of heavy metal comprising cobalt as the main component, and a bromine compound, and hydrolyzing the product thereby obtained. The improvement is characterized in that the oxidation is carried out under a pressure of 2-15/cm.sup.2 gauge in the presence of an alkali metal compound corresponding to 0.1-1.1 gram atom in terms of alkali metal atom based upon 1 gram atom of the heavy metal used for the catalyst.The present invention produces a high-quality 5-hydroxyisophthalic acid having excellent color from 5-acyloxy-m-xylene.

Abstract: A contact ring having probe pins is mounted in the top surface of a casing, and a wafer holder table is placed below the contact ring. A holder member comprising a longitudinally extended cylindrical body are provided in such a manner as to be free to move into and out of a space between the probe pins and the wafer holder table, parallel to the upper surface of a wafer and along guide rails protruding from a casing. An image of the probe pins which act as contact means and an image of the electrode pads of an IC chip on the wafer are input to a camera that is provided in the holder member. With the probe apparatus of the present invention, it is possible to position the wafer while viewing these images, and there is no need to provide a region for separate positioning. This facilitates the design of a smaller probe apparatus.

Abstract: A probe card used in a probing test machine which send and receive test signals into circuits through pads of a semiconductor chip, thereby examining the electrical characteristics of the circuits. The probe card comprises a supporting plate, a flexible printed circuit base including a flexible film base material supported by the supporting plate, circuits printed on the film base material being connected electrically to a tester, contactors connected electrically to the printed circuits and adapted to be brought into contact with the pads in equally corresponding relation, and a cushioning medium designed so as to back up a section in which the contactors are mounted. When the contactors are brought into contact with the pads, individually, the cushioning medium undergoes an elastic deformation, so that the contact between the contactors and the pads is improved.

Abstract: A probe apparatus which has a probe card having a plurality of probes, a wafer holder located above or beside the probe card, for holding a wafer to be examined, a tester head electrically connected to the probes of the probe card, a tester electrically connected to the tester head, for detecting electrical characteristics of the wafer from the data output from the wafer, and a CCD camera arranged to oppose the object, for detecting the position of the wafer.

Abstract: A method of positioning a wafer when plural chips arranged on the semiconductor wafer are to be measured by a probe apparatus. The direction in which probes of the probe apparatus are set is measured via a dummy wafer and stored as data. The positioning of the wafer can be achieved by the operation of a table on which the wafer is mounted. When the wafer is to be positioned, the chips-lined direction on the wafer is rotated to align with the moving coordinates of the table and then with the probes-set direction. A probing direction in which wafers are successively moved and a reference position on the wafer are determined, and this reference position is aligned with the position of the probes. Measurement is carried out relative to every position of the chips calculated from the reference position, while moving the table along the probing direction.

Abstract: An automatic alignment method of the position of the probe tips and electric pads of wafer comprises the steps of recognizing and filing the position data of the pads of a new sort wafer and correction amount data between the position of the electrode pads and the probe tips equipped actually with the probe, determining and filing not less than 2 positions of electrode pads for an .theta. alignment of probe, detecting and outputting a height level data of a position of a dummy wafer, forming probe mark, detecting and outputting the positions, in X-, Y-axes, and .theta. direction offset between pads and tips, correcting these offset, repeated these check steps, saving final correction data, and using these data for aligning an actual wafer.