Patents by Inventor Keiichi Yoshimoto

Keiichi Yoshimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11643485
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: May 9, 2023
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20220251268
    Abstract: A resin composition for injection molding or compression molding using an ethylene-based ionomer is excellent in impact strength, heat resistance, long-term durability, etc. The resin composition includes an ionomer in which, in a copolymer (P) containing a structural unit (A) derived from ethylene and/or an ?-olefin having 3 to 20 carbon atoms, and a structural unit (B) derived from a monomer having a carboxyl group(s) and/or a dicarboxylic anhydride group(s) as essential constitutional units, at least a part of the carboxyl groups and/or the dicarboxylic anhydride groups in the copolymer (P) being converted into a metal-containing carboxylic acid salt(s) containing at least one kind of a metal ion(s) selected from Group 1, Group 2 or Group 12 of the periodic table, and has a phase angle S at an absolute value G*=0.1 MPa of a complex modulus of elasticity measured by a rotary rheometer of 50 degrees to 75 degrees.
    Type: Application
    Filed: June 24, 2020
    Publication date: August 11, 2022
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Keiichi YOSHIMOTO, Masahiro UEMATSU, Kaoru YASUDA
  • Patent number: 10633471
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: April 28, 2020
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20200031965
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki ISHIHAMA, Ryousuke ASAKAWA, Tsutomu SAKURAGI, Tetsurou FUKUDA, Kazuya SAKATA, Masaru AOKI, Kenji KAWAGISHI, Keiichi YOSHIMOTO
  • Publication number: 20180237565
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 23, 2018
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki ISHIHAMA, Ryousuke ASAKAWA, Tsutomu SAKURAGI, Tetsurou FUKUDA, Kazuya SAKATA, Masaru AOKI, Kenji KAWAGISHI, Keiichi YOSHIMOTO
  • Patent number: 9975972
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: May 22, 2018
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20160244544
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt/of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: February 11, 2016
    Publication date: August 25, 2016
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki ISHIHAMA, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Patent number: 9309340
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 12, 2016
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20150045485
    Abstract: The present invention is to provide a polyethylene resin composition for container closures and a container closure exhibiting excellent mouldability, high flowability, excellent balance between rigidity and impact resistance, excellent stress cracking resistance, excellent sliding property, low odour level, harmlessness for food, decreased elongation at high temperatures and sterilizability by electron beam upon attachment of the closure to a container. The present invention is a polyethylene resin composition for a container closure, this composition having, relative to 100 parts by weight of a polyethylene resin, 0.01 to 0.50 parts by weight of a hindered amine compound and having the following properties (a) to (f): (a) a melt flow rate (MFR) of 0.5 to 10 g/10 min, a melt flow rate (HLMFR) of 100 to 500 g/10 min and HLMFR/MFR of 50 to 200; (b) a density of 0.956 to 0.
    Type: Application
    Filed: February 6, 2013
    Publication date: February 12, 2015
    Applicant: Japan Polyethylene Corporation
    Inventors: Daisuke Tsutimoto, Hiroya Yamamoto, Kunihiko Ibayashi, Keiichi Yoshimoto
  • Publication number: 20140194277
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: March 29, 2012
    Publication date: July 10, 2014
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20130280462
    Abstract: The polyethylene of the invention is polymerized using a chromium catalyst, and has a weight average molecular weight (Mw) of 30,000 or more at the maximum value in a branching degree distribution curve that shows a molecular weight dependency of short chain branches having 4 or more carbon atoms.
    Type: Application
    Filed: December 22, 2011
    Publication date: October 24, 2013
    Applicant: JAPAN POLYEHTYLENE CORPORATION
    Inventors: Yuuichi Kuzuba, Takashi Monoi, Satoshi Kanazawa, Kouichi Ogawa, Takaaki Hattori, Keiichi Yoshimoto