Patents by Inventor Keiichiro Ota

Keiichiro Ota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230158878
    Abstract: A mounting structure is provided for mounting a battery pack on a floor of a vehicle cabin. The installation structure includes a bottom plate of a housing of the battery pack, cooling pipes provided inside or on a surface of the bottom plate for circulating coolant, and a plate-shaped underguard. The underguard has upwardly protruding ribs and downwardly protruding ribs that are alternately arranged. The cooling pipes are provided inside or on the surface of the bottom plate of the housing. The cooling pipes are arranged to face the downwardly protruding ribs. The underguard is attached to the housing such that a top plate of the upwardly protruding ribs and a bottom plate of the housing are spaced apart.
    Type: Application
    Filed: February 24, 2021
    Publication date: May 25, 2023
    Inventors: Keiichiro OTA, Hideki KOIKE, Shinichi MATANO
  • Patent number: 7080680
    Abstract: A heat sink has a panel body and a heat radiating portion. The panel body includes a working fluid circuit for circulating a working fluid in the panel body and has a heat receiving portion and a heat radiating portion substantially on the same plane. The heat radiating portion has an upper region and a lower region. The heat receiving portion is provided on a lateral side of the lower region of the heat radiating portion, and a plurality of radiating fins are provided on at least one surface of the heat radiating portion of the panel body. The working fluid circuit extends from the heat receiving portion to the lower region of the heat radiating portion and further to the upper region of the heat radiating portion, and the working fluid circuit in the lower region of the heat radiating portion has an average channel cross sectional area which is smaller than an average channel cross sectional area of the working fluid circuit in the heat receiving portion.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: July 25, 2006
    Assignee: Showa Denko K.K.
    Inventors: Keiichiro Ota, Shigeo Marugasa
  • Publication number: 20030056942
    Abstract: The invention provides a heat sink (1) comprising a heat sink main body (2) in the form of a vertical plate and having a heat receiving portion (3) and a heat radiating portion (4), and radiating fins (5). The heat sink main body (2) has a heat pipe portion (6) comprising a working fluid circuit (61) extending from the heat receiving portion (3) to a lower region (4a) of the heat radiating portion at the lateral side of the heat receiving portion (3) and further to an upper region (4b) of the heat radiating portion which region is positioned at a higher level than the heat receiving portion (3), the working fluid circuit (61) having a working fluid enclosed therein. The portion (61A) of the working fluid circuit provided in the lower region (4a) is smaller than the portion (61B) of the working fluid circuit provided in the heat receiving portion (3) in average channel cross sectional area.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 27, 2003
    Applicant: SHOWA DENKO K.K.
    Inventors: Keiichiro Ota, Shigeo Marugasa