Patents by Inventor Keiichirou GESHI

Keiichirou GESHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Layered body, and saw device
    Patent number: 11750171
    Abstract: A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 0.5 ?m or more and less than 15 ?m and the standard deviation of the grain sizes is less than 1.5 times the mean.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: September 5, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou Geshi, Masato Hasegawa, Shigeru Nakayama
  • Layered body, and saw device
    Patent number: 11699985
    Abstract: A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 15 ?m or more and less than 40 ?m and the standard deviation of the grain sizes is less than 1.5 times the mean.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 11, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou Geshi, Masato Hasegawa, Shigeru Nakayama
  • Layered body and saw device
    Patent number: 10979017
    Abstract: A layered body includes a ceramic substrate formed of a polycrystalline ceramic and having a supporting main surface and a piezoelectric substrate formed of a piezoelectric material and having a bonding main surface that bonds to the supporting main surface through Van der Waals force. The ceramic substrate includes a supporting main surface amorphous layer formed so as to include the supporting main surface. The piezoelectric substrate includes a bonding main surface amorphous layer formed so as to include the bonding main surface. The supporting main surface amorphous layer has a smaller thickness than the bonding main surface amorphous layer.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: April 13, 2021
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou Geshi, Ryota Yamaguchi, Masato Hasegawa
  • LAYERED BODY, AND SAW DEVICE
    Publication number: 20210104999
    Abstract: A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 0.5 ?m or more and less than 15 ?m and the standard deviation of the grain sizes is less than 1.5 times the mean.
    Type: Application
    Filed: September 21, 2018
    Publication date: April 8, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou GESHI, Masato HASEGAWA, Shigeru NAKAYAMA
  • LAYERED BODY, AND SAW DEVICE
    Publication number: 20200304099
    Abstract: A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 15 ?m or more and less than 40 ?m and the standard deviation of the grain sizes is less than 1.5 times the mean.
    Type: Application
    Filed: September 21, 2018
    Publication date: September 24, 2020
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou GESHI, Masato HASEGAWA, Shigeru NAKAYAMA
  • LAYERED BODY AND SAW DEVICE
    Publication number: 20200091891
    Abstract: A layered body includes a ceramic substrate formed of a polycrystalline ceramic and having a supporting main surface and a piezoelectric substrate formed of a piezoelectric material and having a bonding main surface that bonds to the supporting main surface through Van der Waals force. The ceramic substrate includes a supporting main surface amorphous layer formed so as to include the supporting main surface. The piezoelectric substrate includes a bonding main surface amorphous layer formed so as to include the bonding main surface. The supporting main surface amorphous layer has a smaller thickness than the bonding main surface amorphous layer.
    Type: Application
    Filed: March 12, 2018
    Publication date: March 19, 2020
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou GESHI, Ryota YAMAGUCHI, Masato HASEGAWA