Patents by Inventor Keiichirou Kata

Keiichirou Kata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-encapsulated semiconductor device
    Patent number: 6611063
    Abstract: A method for forming a mold-encapsulated semiconductor device includes the steps of mounting a semiconductor chip on a metallic plate having a metallic interconnect pattern thereon, encapsulating the semiconductor chip on the metallic interconnect pattern, removing the bottom of the metallic plate by etching to expose the metallic interconnect pattern, and forming external terminals on the bottom of the metallic interconnect pattern. The method reduces the thickness as well as the planar dimensions of the semiconductor device.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: August 26, 2003
    Assignee: NEC Electronics Corporation
    Inventors: Michihiko Ichinose, Tomoko Takizawa, Hirokazu Honda, Keiichirou Kata