Patents by Inventor Keiichirou Koyashiki

Keiichirou Koyashiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9234080
    Abstract: There is disclosed a conductive resin composition, comprising: (a) a resin component, and (b) a fine carbon fiber dispersed in the resin component, wherein a graphite-net plane consisting solely of carbon atoms forms a temple-bell-shaped structural unit comprising closed head-top part and body-part with open lower-end, 2 to 30 of the temple-bell-shaped structural units are stacked sharing a common central axis to form an aggregate, and the aggregates are connected in head-to-tail style with a distance to form the fiber. The resin composition has high conductivity while maintaining the original physical properties of the resin.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: January 12, 2016
    Assignee: Ube Industries, Ltd.
    Inventors: Hideya Yoshitake, Masayuki Nishio, Tsunao Matsuura, Kenji Fukuda, Ken Nakamura, Keiichirou Koyashiki, Masaki Yoshio, Hirofumi Takemoto
  • Patent number: 4921745
    Abstract: A new honeycomb core structure of heat-resistant aromatic polyimide is disclosed. The structure comprises plural aromatic polyimide sheets wherein adjoining two aromatic polyimide sheets are combined to each other with a heat resistant adhesive at adhesive regions arranged between the two sheets at equal intervals and the adhesive regions on one side of any aromatic polyimide sheet are located at positions shifting from positions of adhesive regions arranged on another side of the sheet. The honeycomb structure is formed by extending the combined aromatic polyimide sheets in the direction vertical to the plane of the polyimide sheets.
    Type: Grant
    Filed: December 27, 1988
    Date of Patent: May 1, 1990
    Assignee: Ube Industries, Ltd.
    Inventors: Kazuhiko Mitsui, Kazuo Kumamoto, Keiichirou Koyashiki
  • Patent number: 4921744
    Abstract: A new honeycomb core structure of heat-resistant aromatic polyimide is disclosed. The structure comprises plural aromatic polyimide sheets having a second-order transition temperature in the range of 250.degree. C. to 400.degree. C. wherein adjoining aromatic polyimide sheets are adhered to each other by welding the two sheets in regions apart from each other at equal intervals and the welding regions on one side of any aromatic polyimide sheet are located at positions shifted from positions of welding regions arranged on another side of the sheet. The honeycomb structure is formed by extending the combined aromatic polyimide sheets in the direction vertical to the plane of the polyimide sheets while heating the sheets at a temperature higher than their second-order transition temperature.
    Type: Grant
    Filed: January 27, 1989
    Date of Patent: May 1, 1990
    Assignee: Ube Industries, Ltd.
    Inventors: Kazuhiko Mitsui, Kazuo Kumamoto, Keiichirou Koyashiki