Abstract: Imaging device includes a compound eye optical system equipped with an array lens formed by arranging multiple lenses as an array in which the lenses have mutually different light axes; a lens frame having a top surface part that covers the portion of a first surface on the object side of the compound eye optical system which excludes the lenses, and a side surface part that supports the top surface part; and a solid-state imaging element that converts a photographic subject imaged by the compound eye optical system into electrical signals. The side surface part of the lens frame is adhered to the solid-state imaging element or to a member that is affixed to the solid-state imaging element, and the portion of the first surface of the compound eye optical system which excludes the lenses is adhered to the top surface part of the lens frame.

Abstract: The purpose of the present invention is to provide a lens unit which can create an effective light shield despite the simple process by which the lens unit is produced. A non-transmissive filler (BD) is filled and solidified in the gap between the outer periphery of a light shielding member (SH1) and the outer peripheries of a first lens (L1) and a second lens (L2).

Abstract: A method for producing a wafer lens provided with a lens portion made of a photo-curable resin on one face of a substrate. The method includes a dispensing step, a curing step and a releasing step. In the dispensing step, a photo-curable resin material is dispensed on at least one of (i) a mold having a molding surface in a shape corresponding to an optical surface shape of the lens portion and (ii) the one face of the substrate. The photo-curable resin material has a viscosity of 10000 cP or more at 25° C. In the dispensing step, the photo-curable resin material is heated so that the viscosity of the photo-curable resin material becomes between 1000 cP and 10000 cP, and dispensed.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.

Abstract: A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.

Abstract: A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plurality of processing sections have at least two specific processing sections for conducting a common type of processes, and the specific processing sections are disposed in a common area.

Abstract: An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

Abstract: An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

Abstract: A superconducting magnetic levitation apparatus for driving a floating body efficiently and controllably, for producing a strong driving force, and for generating a lifting magnetic field having a uniform intensity in a running direction and producing a guidance force in a lateral direction, to stably run the floating body. The superconducting magnetic levitation apparatus includes a lifting magnet for forming a track, a floating body made of a high-T.sub.c superconductor, and a cooling device for keeping the floating body at a superconducting state. A plurality of coils are disposed on the lifting magnet, to be used as propulsion electromagnets, for generating a magnetic field necessary for running the floating body, with each of the coils being a flat, air-core coil, and with the coils being excitable by a polyphase alternating current.

Abstract: A rotor of induction motor comprises a rotary shaft, a cylindrical rotor core fixedly secured on the rotary shaft, a conductive cover fixed on the outer circumferential surface of the rotor core, the conductive cover being formed of a composite material of magnetic material and electrically highly conductive material to have a circumferential permeability smaller than a radial permeability, and a magnetic skin made of a magnetic material and provided on the outer circumferential surface of the conductive cover, the magnetic skin having a circumferential permeability and an electrical conductivity which are set to be larger than the circumferential permeability and an electrical resistivity of the conductive cover, respectively, whereby a loss due to a spatial higher harmonics magnetic flux of higher order generated by a pulsating magnetic flux of slots in a stator of induction motor can be prevented.

Abstract: A camera has a shutter device driveable to undergo opening movement to open an aperture to effect exposure operation according to a given exposure value, and a motor actuatable to rotate at an unstable rotational speed for driving the shutter device. A detector operates after the motor starts rotating and before the shutter device undergoes its opening movement for detecting the rotational speed of the motor. A controller adjusts the shutter device in accordance with the detected rotational speed of the motor to thereby enable the shutter device to effect the exposure operation so as to accurately achieve the given exposure value.

Abstract: A magnetic wedge for use in an electromagnetic device, arranged at the opening portion of a core slot for receiving a winding, comprising a magnetic member consisting of a group of magnetic strips arranged in non-contact from one another and at a predetermined inclination angle for the depth direction of the core slot, and a plastic member for molding said magnetic member. Such a construction of the wedge permits the magnetic property at the opening portion of a core slot to be improved.