Patents by Inventor Keiji Hannuki

Keiji Hannuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8053830
    Abstract: A semiconductor device including a semiconductor section including a semiconductor element and a recess formed in one of main surfaces and a metallic member at least a part of which is embedded in the recess. A void is formed in a region of the metallic member corresponding to the recess.
    Type: Grant
    Filed: July 8, 2008
    Date of Patent: November 8, 2011
    Assignee: Sanken Electric Co., Ltd.
    Inventors: Keiji Hannuki, Shuichi Kaneko
  • Publication number: 20090079085
    Abstract: A semiconductor device including a semiconductor section including a semiconductor element and a recess formed in one of main surfaces and a metallic member at least a part of which is embedded in the recess. A void is formed in a region of the metallic member corresponding to the recess.
    Type: Application
    Filed: July 8, 2008
    Publication date: March 26, 2009
    Applicant: Sanken Electric Co., Ltd.
    Inventors: KEIJI HANNUKI, SHUICHI KANEKO