Patents by Inventor Keiji Horioka

Keiji Horioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5258332
    Abstract: A method for rounding the corners of trench formed on the silicon substrate with metal, metal silicide or polycrystalline silicon thin film or the step portions of lead layers is provided. The steps of rounding are performed by chemical dry etching using a gas mixture of fluorine and oxygen. The abundance ratio of oxygen is determined to be one or more with respect to the fluorine. This method contributes significantly to the prevention of leakage current and the enhancement of insulating effect in the case of forming trench capacitors or the like.
    Type: Grant
    Filed: March 8, 1993
    Date of Patent: November 2, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keiji Horioka, Haruo Okano, Hirotaka Nishino
  • Patent number: 5250137
    Abstract: A plasma treating apparatus includes an electrostatic chuck constructing an electrically conductive layer and insulating layers having the conductive layer sandwiched therebetween. A RF current supplied to a susceptor is prevented from flowing into the conductive layer of the chuck so as to suppress the RF current leakage from a cable connected to the conductive layer of the chuck for high voltage application.
    Type: Grant
    Filed: July 17, 1991
    Date of Patent: October 5, 1993
    Assignees: Tokyo Electron Limited, Kabushiki Kaisha Toshiba
    Inventors: Junichi Arami, Toshihisa Nozawa, Keiji Horioka, Katsuya Okumura
  • Patent number: 5240554
    Abstract: A method of manufacturing a semiconductor device includes the steps of forming a carbon film on a target film formed on a substrate, forming an organic film pattern on the carbon film, etching the carbon film using the organic film pattern as a mask to form a carbon film pattern, and heating the substrate, supplying an etching gas having halogen atoms to a reaction area where the substrate is stored, applying an electric field to the reaction area to generate a discharge, and anisotropically etching the silicon oxide film using the carbon film pattern as a mask and a plasma formed by the discharge.
    Type: Grant
    Filed: January 22, 1992
    Date of Patent: August 31, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masaru Hori, Hiroyuki Yano, Keiji Horioka, Hisataka Hayashi, Sadayuki Jimbo, Haruo Okano
  • Patent number: 5234527
    Abstract: A liquid level detecting device used in a vacuum processing apparatus, the device comprising a liquid container section, an inlet pipe for liquid supply connected to the liquid container section, and outlet pipe for discharging the liquid when the liquid in the liquid container section overflows a predetermined liquid level, a temperature measurement terminal provided in the liquid container section, for detecting the temperature of the liquid in the container section, means for heating or cooling the temperature measurement terminal, and a liquid level detecting section for detecting the surface level of the liquid on the basis of the difference between two temperatures of the liquid measured when the heating or cooling means is in contact with the liquid and when not in contact.
    Type: Grant
    Filed: July 17, 1991
    Date of Patent: August 10, 1993
    Assignees: Tokyo Electron Limited, Kabushiki Kaisha Toshiba
    Inventors: Toshihisa Nozawa, Junichi Arami, Yukimasa Yoshida, Keiji Horioka
  • Patent number: 4595601
    Abstract: An insulation layer is selectively formed by exposing the surface of a workpiece to an atmosphere comprising a mixture of a halogen-based gas and a raw gas containing a compoundable element chemically bondable with an element of a material constituting surface layer of the workpiece to form an insulating compound. The surface layer of the workpiece is formed of a non-insulating material, such as a metallic material or a semiconductor material. Light rays are directly irradiated on the selected region or regions of the surface of the workpiece through the atmosphere of the gaseous mixture, thereby dissociating said halogen-based gas. As a result, a layer comprising the insulating compound is formed on the selected region of the surface of the workpiece on which the light rays have been directly irradiated.
    Type: Grant
    Filed: May 20, 1985
    Date of Patent: June 17, 1986
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keiji Horioka, Haruo Okano, Makoto Sekine