Abstract: A measurement apparatus for measuring a thickness of a semiconductor wafer includes: an optical system configured to perpendicularly irradiate a sample wafer and a reference wafer with light, and receive interference signals of the light reflected on front and back surfaces of the respective wafers; a signal processor configured to perform frequency analysis of the interference signals received by the optical system to obtain peak positions of a point spread function of the respective wafers; and a calculator configured to calculate a thickness “tsample” of the sample wafer based on the peak position “x” of the sample wafer and the peak position “y” of the reference wafer obtained by the signal processor, and a thickness “treference” of the reference wafer.

Abstract: An optical system includes: a difference-frequency-light generator that multiplexes output lights from a signal-light light source and an excitation-light light source and inputs the output lights to a nonlinear optical material to generate and output a difference-frequency light having a wavenumber that corresponds to a wavenumber difference between light from the signal-light and from the excitation-light light source, where one of the signal-light source or the excitation-light source is a wavelength-sweeping light source; a splitter that splits a portion of light output from the wavelength-sweeping light source into a first and a second reference light; and an equal-wavenumber-signal generator that receives the first reference light, via an interferometer, to generate and output an equal-wavenumber signal that fluctuates in equal wavenumber intervals according to wavelength sweeping of the wavelength-sweeping light source.

Abstract: An actuator that can be driven at a reduced voltage and manufactured with ease, and a method for manufacturing the same are provided. The actuator includes second supporting portions 31 and 32 secured to a supporting substrate 4 through a spacer, fixed portions 33 and 34 secured to the supporting substrate 4 with no intervention of the spacer, fixed comb electrodes 331 and 341 integrally formed the fixed portions 33 and 34 and meshing with movable comb electrodes 211 and 212 in a spaced-apart relationship, and bridge portions 35 and 36 for connecting the fixed portions 33 and 34 to the second supporting portions 31 and 32.

Abstract: An actuator that can be driven at a reduced voltage and manufactured with ease, and a method for manufacturing the same are provided. The actuator includes second supporting portions 31 and 32 secured to a supporting substrate 4 through a spacer, fixed portions 33 and 34 secured to the supporting substrate 4 with no intervention of the spacer, fixed comb electrodes 331 and 341 integrally formed the fixed portions 33 and 34 and meshing with movable comb electrodes 211 and 212 in a spaced-apart relationship, and bridge portions 35 and 36 for connecting the fixed portions 33 and 34 to the second supporting portions 31 and 32.

Abstract: An actuator that can be driven at a reduced voltage and manufactured with ease, and a method for manufacturing the same are provided. The actuator includes second supporting portions 31 and 32 secured to a supporting substrate 4 through a spacer, fixed portions 33 and 34 secured to the supporting substrate 4 with no intervention of the spacer, fixed comb electrodes 331 and 341 integrally formed the fixed portions 33 and 34 and meshing with movable comb electrodes 211 and 212 in a spaced-apart relationship, and bridge portions 35 and 36 for connecting the fixed portions 33 and 34 to the second supporting portions 31 and 32.

Abstract: An actuator that can be driven at a reduced voltage and manufactured with ease, and a method for manufacturing the same are provided. The actuator includes second supporting portions 31 and 32 secured to a supporting substrate 4 through a spacer, fixed portions 33 and 34 secured to the supporting substrate 4 with no intervention of the spacer, fixed comb electrodes 331 and 341 integrally formed the fixed portions 33 and 34 and meshing with movable comb electrodes 211 and 212 in a spaced-apart relationship, and bridge portions 35 and 36 for connecting the fixed portions 33 and 34 to the second supporting portions 31 and 32.