Abstract: According to one embodiment, a semiconductor device includes a board including a controller and a memory, a connecting portion on the board, and a standby power source electrically connected to the connecting portion and removably attached to the board.

Abstract: A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

Abstract: A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.

Abstract: A compression resin sealing apparatus includes cooling means (64, 104) for each of an upper die (6) and a lower die (10). A gate nozzle (15) including cooling means (154a) is provided in the upper die (6). A cavity (106) for mounting a single substrate is provided in the lower die (10). In this apparatus, a liquid thermosetting resin material (R) in a required amount is supplied into the cavity (106) through the gate nozzle (15). Then, a substrate is supplied between the upper die (6) and the lower die (10), and the upper die (6) and the lower die (10) are clamped to each other. As a result, an electronic component on the substrate is immersed in the liquid thermosetting resin material (R) in the cavity (106). That is, compression resin molding is performed. Here, a temperature of the liquid thermosetting resin material (R) is controlled by the gate nozzle (15) and the cooling means (154a, 64, 104).

Abstract: A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

Abstract: A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

Abstract: An upper die has a cavity member constituting an inner bottom surface of a cavity, and a surrounding member. The cavity member is formed of a low adhesion material in accordance with the present invention, and includes a body portion and a surface layer formed on an undersurface of the body portion exposed to a fluid resin. The body portion is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.

Abstract: A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.

Abstract: A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

Abstract: A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.

Abstract: A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

Abstract: A semiconductor device including a plurality of flash memories, a connector for establishing connection with a host apparatus, a cache memory for data transmission between the flash memories and the host apparatus, a drive control circuit that controls the data transmission between the flash memories and the host apparatus, and a power supply circuit that converts an external power supply voltage into an internal power supply voltage, all mounted on a substrate. A fuse that protects at least the flash memories from an overcurrent is also provided on the substrate.

Abstract: A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.

Abstract: A mold surface (6) of an upper mold (1) with which a fluid resin comes into contact has an oxide (3) therein. The oxide (3) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface (6), releasability between the cured resin and the mold surface (6) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface (6) is established. With this evaluation method, a material with high releasability (3) can readily be provided. Further, if the material with high releasability (3) is used for the mold surface (6) of the upper mold (1), a mold for molding a resin having excellent releasability can be obtained.

Abstract: A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.

Abstract: A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

Abstract: An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).

Abstract: A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

Abstract: A resin molding die has a molding surface formed of a low adhesion material formed of a solid solution of La—Y2O3 produced from Y2O3 and an other oxide of La2O3. La2O3 contains La, which has an ionic radius larger than Y3+, and is larger in basicity than Y2O3. The low adhesion material contains La2O3 at a predetermined ratio relative to a total of Y2O3 and La2O3. The low adhesion material thus has a large iconic radius contributing to a smaller number of sites per unit area than Y2O3, a larger basicity contributing to a smaller force binding the low adhesion material with a basic substance than Y2O3, and a ratio contributing to shape retention. The low adhesion material thus less adhesive and more shape-retentive than Y2O3 configures the molding surface. A low adhesion material that is less adhesive to a basic substance than Y2O3 is and excellently shape-retentive, and an excellently releasable and shape-retentive resin molding die can thus be obtained.

Abstract: A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.