Patents by Inventor Keiji MAEO

Keiji MAEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230110863
    Abstract: Provided is a thermosetting resin composition that has high reactivity, can be adapted to various curing conditions, and has extremely high versatility. The thermosetting resin composition contains a resin component (A) containing —COOR (R is an alkyl group having 50 or less carbon atoms) and a hydroxy group, and a transesterification catalyst (B). A curing start temperature is 130° C. or lower, and a gel fraction when cured under a condition of baking at 150° C. for 30 minutes is 80% or more.
    Type: Application
    Filed: February 24, 2021
    Publication date: April 13, 2023
    Applicant: KYOEISHA CHEMICAL CO., LTD.
    Inventors: Yuya MORIWAKI, Tomoya MATSUDA, Kosuke ASADA, Masaru DONKAI, Hiroki NAKAGAWA, Keiji MAEO, Narutoshi YOSHIDA, Naomi TAKENAKA
  • Publication number: 20230087596
    Abstract: Provided is a thermosetting resin composition, from which a cured product having excellent transparency with less yellowing than that in the related art can be obtained, and which is advantageous in cost because a monomer obtained by using an inexpensive raw material is used. An ester compound contains, in one molecule, at least one functional group represented by the following general formula (1) or (2). (In both the general formulae (1) and (2), R1 is an alkyl group having 50 or less carbon atoms. R2 is an alkylene group having 50 or less carbon atoms that may contain an oxygen atom and a nitrogen atom as a portion thereof.
    Type: Application
    Filed: December 22, 2020
    Publication date: March 23, 2023
    Applicant: KYOEISHA CHEMICAL CO., LTD.
    Inventors: Masaru DONKAI, Yuya MORIWAKI, Tomoya MATSUDA, Kosuke ASADA, Hiroki NAKAGAWA, Keiji MAEO, Narutoshi YOSHIDA, Naomi TAKENAKA
  • Publication number: 20230002530
    Abstract: [Problem] To obtain a thermosetting resin composition that has curing performance at a lower temperature and uses transesterification capable of also suitably coping with conversion into an aqueous form as a curing reaction. [Solution] A thermosetting resin composition containing a resin component (A), which includes a structure (a) represented by the following general formula (1) and a hydroxy group (b), and a transesterification catalyst (B). n=0 to 20 R1 is an alkyl group having 50 or less carbon atoms. R3 is hydrogen or an alkyl group having 10 or less carbon atoms.
    Type: Application
    Filed: November 14, 2019
    Publication date: January 5, 2023
    Applicant: KYOEISHA CHEMICAL CO., LTD.
    Inventors: Yuya MORIWAKI, Tomoya MATSUDA, Kosuke ASADA, Masaru DONKAI, Hiroki NAKAGAWA, Keiji MAEO, Narutoshi YOSHIDA, Naomi TAKENAKA