Patents by Inventor Keiji Miyauchi

Keiji Miyauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110125939
    Abstract: A disclosed function expansion apparatus for expanding a function of an information processing apparatus by connecting the information processing apparatus to an external storage apparatus via a first interface includes a first storage unit that stores first setup information used for connecting the information processing apparatus to the external storage apparatus, a connection module unit that is operated based on the first setup information and connects the information processing apparatus to the external storage apparatus via the first interface, a control unit that is connected to the first storage unit, and the connection module unit or a second storage unit, and stores second setup information stored in the second storage unit into the first storage unit, wherein the second storage unit is exchangeable with the connection module unit and stores the second setup information in connecting to the connection module unit.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 26, 2011
    Applicant: FUJITSU LIMITED
    Inventor: Keiji Miyauchi
  • Patent number: 4303903
    Abstract: A pressure transducer comprising a silicon diaphragm on which a semiconductor strain gauge is formed and which has a diaphragm portion deformable in response to a pressure, an insulating support which is made of borosilicate glass having the silicon diaphragm rigidly mounted thereon and which is provided with a pressure introducing hole in its central part, a metallic support which is cylindrical, which is made of an iron-nickel alloy similar in the thermal expansion coefficient to the borosilicate glass and on which the glass insulating support is rigidly mounted, and a metallic housing within which the integrated structure consisting of the silicon diaphragm, the glass insulating support and the metallic support is arranged; the silicon diaphragm, the insulating support and the metallic support being joined by the anodic bonding, the metallic support being rigidly welded to the metallic housing at its lower end part.
    Type: Grant
    Filed: September 21, 1979
    Date of Patent: December 1, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Yoshitaka Matsuoka, Michitaka Shimazoe, Yoshimi Yamamoto, Mitsuo Ai, Keiji Miyauchi, Hideyuki Nemoto, Masatoshi Tsuchiya, Masanori Tanabe