Patents by Inventor Keiji Ooi

Keiji Ooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phenolic resin molding materials
    Patent number: 5336723
    Abstract: Disclosed is a phenolic resin molding material which is mainly composed of (1) 25-55 parts by weight of a phenolic resin containing 60% by weight or more of a resol-type phenolic resin, (2) 2-10 parts by weight of a partially crosslinked NBR, and (3) 35-70 parts by weight of an inorganic filler, on the basis of 100 parts by weight in total of these components.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: August 9, 1994
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Shinji Ikeda, Keiji Ooi, Ken Katoh
  • Phenolic resin composition
    Patent number: 5162428
    Abstract: A phenolic resin composition comprising (a) 30-55% by weight of an alkylbenzene-modified novolac type phenolic resin, (b) 30-55% by weight of a novolac type phenolic resin and (c) 15-30% by weight of a dimethylene ether resole type phenolic resin, and a phenolic resin molding material comprising said composition.
    Type: Grant
    Filed: August 21, 1990
    Date of Patent: November 10, 1992
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Ken Katoh, Keiji Ooi
  • Phenolic resin composition with excellent impact strength
    Patent number: 5141992
    Abstract: A phenolic resin composition comprising 20-40 parts by weight of a resole type phenolic resin, 5-15 parts by weight of a novolac type phenolic resin, 3-10 parts by weight of a carboxy-modified acrylonitrile-butadiene rubber and 35-65 parts by weight of an inorganic filler.
    Type: Grant
    Filed: October 18, 1990
    Date of Patent: August 25, 1992
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Ken Katoh, Keiji Ooi, Shinji Ikeda