Abstract: Heat emitted from a plurality of stacked coils forming a coil body can be dissipated from the coils on all the layers. A coil device includes a core mounted on a mounting surface of a cooler, a coil body formed by stacking, on the mounting surface, a lower-layer coil and an upper-layer coil having winding portions wound about a winding axis of the core, and heat dissipation members provided on the cooler. The upper-layer coil positioned on a layer other than the lowermost layer has extending portions extending in directions away from the winding axis. The extending portions, and the winding portion of the lower-layer coil positioned on the lowermost layer abut on the heat dissipation members.

Abstract: A coil device includes a core portion whose longitudinal direction is along a winding axis of a conductive wire and a core portion other than the core portion. In a core, the core portion is provided on an attachment surface of a housing 3, the core portion is stacked on the core portion, and the combined surfaces where the core portions are combined with each other are parallel to the winding axis.

Abstract: An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.

Abstract: An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.