Patents by Inventor Keiji Sawada

Keiji Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7312883
    Abstract: An image forming system comprises a request analysis section which analyzes an input image forming process request and specifies a peripheral device for use in executing an image forming process and a judgment section to judge whether or not a version upgrade is performed in the peripheral device. A process execution control section executes the process when it is judged that no version upgrade is being performed in the peripheral device, and instructs an input/output section to display, via a report section, a message indicating a version upgrade being performed when it is judged that a version upgrade is being performed. In this manner, user convenience during version upgrade time is enhanced.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: December 25, 2007
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Yoshinobu Nakamura, Keiji Sawada, Tsuyoshi Seto
  • Publication number: 20030231333
    Abstract: An image forming system comprises a request analysis section which analyzes an input image forming process request and specifies a peripheral device for use in executing an image forming process and a judgment section to judge whether or not a version upgrade is performed in the peripheral device. A process execution control section executes the process when it is judged that no version upgrade is being performed in the peripheral device, and instructs an input/output section to display, via a report section, a message indicating a version upgrade being performed when it is judged that a version upgrade is being performed. In this manner, user convenience during version upgrade time is enhanced.
    Type: Application
    Filed: October 15, 2002
    Publication date: December 18, 2003
    Applicant: Fuji Xerox Co., Ltd.
    Inventors: Yoshinobu Nakamura, Keiji Sawada, Tsuyoshi Seto
  • Publication number: 20030231895
    Abstract: In the image forming apparatus, when a RECEIVE PROCESSING UNIT receives program data downloaded from the outside, a transfer control unit judges whether the program data corresponds to the peripheral device connected to the image forming apparatus by comparing a type of the peripheral device identified by a peripheral device identification unit and the type of the peripheral device which can be specified with the downloaded program data. The transfer control unit judges that the program data is program data which corresponds to the connected peripheral device and transfers the program data to the peripheral device. In the peripheral device, a write control unit updates program data by writing the transferred program data to a data storage unit.
    Type: Application
    Filed: October 30, 2002
    Publication date: December 18, 2003
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Seto, Yoshinobu Nakamura, Keiji Sawada
  • Patent number: 6429138
    Abstract: In manufacturing a semiconductor device, a metal polymer film and photoresist film are removed with an amine-based organic solvent subsequent to anisotropic etching of an insulating film on a bonding pad, an organic polymer film is removed with the oxygen plasma, and a wire is bonded to the bonding pad. In removal with the amine-based organic solvent, no aluminum oxide film is formed on the surface of the bonding pad. Pores are formed in the surface of the bonding pad upon removal, and the material of a wire bond enters these holes. As a result, a semiconductor device in which the wire bonded to the bonding pad hardly peels off can be manufactured.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: August 6, 2002
    Assignee: Sony Corporation
    Inventor: Keiji Sawada
  • Publication number: 20020034870
    Abstract: In manufacturing a semiconductor device, a metal polymer film and photoresist film are removed with an amine-based organic solvent subsequent to anisotropic etching of an insulating film on a bonding pad, an organic polymer film is removed with the oxygen plasma, and a wire is bonded to the bonding pad. In removal with the amine-based organic solvent, no aluminum oxide film is formed on the surface of the bonding pad. Pores are formed in the surface of the bonding pad upon removal, and the material of a wire bond enters these holes. As a result, a semiconductor device in which the wire bonded to the bonding pad hardly peels off can be manufactured.
    Type: Application
    Filed: November 10, 1998
    Publication date: March 21, 2002
    Inventor: KEIJI SAWADA