Patents by Inventor Keiji Senoo

Keiji Senoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-acid battery plate and its manufacturing method
    Patent number: 5223354
    Abstract: This invention provides a lead-acid battery plate and its manufacturing method. In a lead-acid battery plate making use of an expanded metal comprising copper or copper alloy electroplated with lead or lead alloy for its grid; this invention is characterized by that a protector is provided on a side of the grid. And in a manufacturing method for a lead acid battery plate in which the expanded metal comprising copper or copper alloy electroplated with lead or lead alloy is used for its grid, and a plate lug comprising lead or lead alloy is connected by casting to an upper part of the grid; this invention is characterized by that the plate lug is first connected by casting to the upper part of the copper expanded metal, and lead or lead alloy is then electroplated on the copper expanded metal to which the plate lug is connected.
    Type: Grant
    Filed: June 19, 1992
    Date of Patent: June 29, 1993
    Assignee: Yuasa Battery Co., Ltd.
    Inventors: Keiji Senoo, Takamasa Yoshida, Hideharu Ishikawa, Masao Takura
  • Lead-acid battery plate and its manufacturing method
    Patent number: 5093970
    Abstract: This invention provides a lead-acid battery plate and its manufacturing method. In a lead-acid battery plate making use of an expanded metal comprising copper or copper alloy electroplated with lead or lead alloy for its grid; this invention is characterized by that a protector is provided on a side of the grid. And in a manufacturing method for a lead acid battery plate in which the expanded metal comprising copper or copper alloy electroplated with lead or lead alloy is used for its grid, and a plate lug comprising lead or lead alloy is connected by casting to an upper part of the grid; this invention is characterized by that the plate lug is first connected by casting to the upper part of the copper expanded metal, and lead or lead alloy is then electroplated on the copper expanded metal to which the plate lug is connected.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: March 10, 1992
    Inventors: Keiji Senoo, Takamasa Yoshida, Hideharu Ishida, Masao Takura