Patents by Inventor Keiji Takamura

Keiji Takamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding apparatus and bonding method having process for judging bonding state
    Patent number: 6962281
    Abstract: In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3, and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 and an indicator 8 for displaying an output signal from the ultrasonic detector 7, there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: November 8, 2005
    Assignee: NEC Corporation
    Inventors: Mitsunori Kanemoto, Hiromi Sueda, Keiji Takamura
  • Bonding apparatus and bonding method having process for judging bonding state
    Publication number: 20030218050
    Abstract: In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3, and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 and an indicator 8 for displaying an output signal from the ultrasonic detector 7, there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.
    Type: Application
    Filed: May 13, 2003
    Publication date: November 27, 2003
    Applicant: NEC CORPORATION
    Inventors: Mitsunori Kanemoto, Hiromi Sueda, Keiji Takamura