Patents by Inventor Keiji Takano
Keiji Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230356511Abstract: The present invention provides a multilayer film which is provided with a vinylidene fluoride resin-containing layer that has less waviness, while having excellent tensile properties. A multilayer film which is obtained by superposing, on one surface of a layer B that contains a vinylidene fluoride resin, a layer A in a removable manner, said layer A being composed of a thermoplastic resin film that has a dimensional change rate of 5% or less in the MD direction and a dimensional change rate of 3% or less in the TD direction after being left at rest at 120° C. for 5 minutes as determined in accordance with JIS K7133 (1999). With respect to this multilayer film, the arithmetic mean height Sa1 of a 4.8 mm×3.7 mm region of a surface of the layer B after separation of the layer A, said surface having been in contact with the layer A, is 80 nm or less as measured by means of a non-contact interferometric microscope in accordance with ISO 25178-604; and the nominal tensile strain at break is 100% or more at 25° C.Type: ApplicationFiled: July 14, 2021Publication date: November 9, 2023Inventors: Kota NAGAOKA, Noriaki YASUMOTO, Keiji TAKANO
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Publication number: 20230348678Abstract: Provided is a resin film containing a polyvinylidene fluoride-based resin which is highly transparent and less likely to be cloudy even when it is heated and cooled. A resin film is composed of a resin composition containing 50 to 80 parts by mass of a polyvinylidene fluoride-based resin and 20 to 50 parts by mass of a polymethacrylic acid ester-based resin with respect to a total of 100 parts by mass of the polyvinylidene fluoride-based resin and the polymethacrylic acid ester-based resin, wherein a crystallinity of the resin composition is 15% to 35%; a ratio of ?-type crystal to a total mass of ?-type crystal and ?-type crystal in the resin composition is 0 to 15% by mass; an average thickness of the resin film is 5 to 200 ?m; and a HAZE measured according to JIS K7136: 2000 of the resin film is 20% or less.Type: ApplicationFiled: February 4, 2021Publication date: November 2, 2023Inventors: Takumi BABA, Kota NAGAOKA, Keiji TAKANO
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Patent number: 11685815Abstract: To provide a vinylidene-fluoride resin film having low cloudiness and good visibility of a pattern and the like of a decorative film of a lower layer although having a matte tone with low glossiness. The vinylidene-fluoride resin film comprises crosslinked acrylic acid ester resin particles, in which the crosslinked acrylic acid ester resin particles have an average particle diameter of 5% or more and 40% or less to the thickness of the vinylidene-fluoride resin film and the arithmetic average surface roughness (Ra) of the vinylidene-fluoride resin film is 0.4 ?m or more and less than 2 ?m.Type: GrantFiled: May 31, 2018Date of Patent: June 27, 2023Assignee: DENKA COMPANY LIMITEDInventors: Kouta Nagaoka, Tadashi Sawasato, Keiji Takano
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Publication number: 20220274388Abstract: A vinylidene fluoride resin multilayer film including two layers in which a back layer and a surface layer are laminated, in which the surface layer contains 80% by mass or more of a vinylidene fluoride resin on the basis of the total amount of resin components of the surface layer, the back layer contains 85% by mass or more of a methacrylic ester resin on the basis of the total amount of resin components of the back layer, and the back layer contains 7 parts by mass or less of a triazine ultraviolet absorber having a molecular weight of 500 or more with respect to 100 parts by mass of total resin components of the back layer.Type: ApplicationFiled: August 19, 2020Publication date: September 1, 2022Inventors: Kota NAGAOKA, Keiji TAKANO, Yasushi MIYAMURA, Noriaki YASUMOTO
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Patent number: 11207872Abstract: The present invention provides a decorative film for film insert molding, the decorative film having: a fluorine-based resin layer containing 100 to 80 parts by mass of a fluorine-based resin and 0 to 20 parts by mass of a methacrylic acid ester-based resin; an acrylic-based resin layer containing 50 to 0 parts by mass of a fluorine-based resin and 50 to 100 parts by mass of a methacrylic acid ester-based resin; and a decorative layer containing a thermoplastic resin, laminated therein in this order, wherein the fluorine-based resin layer has a thickness of 10 ?m to 200 ?m, and surface unevenness is formed on a surface of the fluorine-based resin layer, the surface being on the side that is not in contact with the acrylic-based resin layer. The present invention also provides a method for manufacturing the decorative film for film insert molding.Type: GrantFiled: June 19, 2019Date of Patent: December 28, 2021Assignee: Denka Company LimitedInventors: Kouta Nagaoka, Keiji Takano
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Patent number: 11173693Abstract: Disclosed is a vinylidene fluoride-based resin multi-layered film including two layers composed of a front surface layer laminated on a rear surface layer, in which the front surface layer contains 80% by mass or more of a vinylidene fluoride-based resin and 20% by mass or less of a methacrylic acid ester-based resin, the degree of crystallization of the front surface layer is 45% or higher, the ratio occupied by ?-crystals in the entire crystal component of the vinylidene fluoride-based resin is 60% or higher, the thickness of the front surface layer is 15 ?m or more, and the rear surface layer contains 90% by mass or more of a methacrylic acid ester-based resin.Type: GrantFiled: November 26, 2018Date of Patent: November 16, 2021Assignee: Denka Company LimitedInventors: Kouta Nagaoka, Keiji Takano
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Patent number: 11141964Abstract: Provided is a fluorine-based resin multilayer film for vacuum forming which does not cause wrinkles and the like when a three-dimensional surface decoration method is applied. The fluorine-based resin multilayer film for vacuum forming includes a front surface layer containing 60% by mass to 85% by mass of a vinylidene fluoride-based resin and 40% by mass to 15% by mass of a methacrylate ester-based resin; and a back surface layer containing 0% by mass to 50% by mass of a vinylidene fluoride-based resin and 100% by mass to 50% by mass of a methacrylate ester-based resin, wherein the thermal dimensional change in a film flow direction when heated at 120° C. for 30 minutes, which is measured based on JIS K7133, is ?15% to ?2%.Type: GrantFiled: September 21, 2018Date of Patent: October 12, 2021Assignee: Denka Company LimitedInventors: Kouta Nagaoka, Keiji Takano
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Publication number: 20210268780Abstract: The present invention provides a decorative film for film insert molding, the decorative film having: a fluorine-based resin layer containing 100 to 80 parts by mass of a fluorine-based resin and 0 to 20 parts by mass of a methacrylic acid ester-based resin; an acrylic-based resin layer containing 50 to 0 parts by mass of a fluorine-based resin and 50 to 100 parts by mass of a methacrylic acid ester-based resin; and a decorative layer containing a thermoplastic resin, laminated therein in this order, wherein the fluorine-based resin layer has a thickness of 10 ?m to 200 ?m, and surface unevenness is formed on a surface of the fluorine-based resin layer, the surface being on the side that is not in contact with the acrylic-based resin layer. The present invention also provides a method for manufacturing the decorative film for film insert molding.Type: ApplicationFiled: June 19, 2019Publication date: September 2, 2021Applicant: DENKA COMPANY LIMITEDInventors: Kouta NAGAOKA, Keiji TAKANO
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Publication number: 20210245484Abstract: Disclosed is a vinylidene fluoride-based resin multi-layered film including two layers composed of a front surface layer laminated on a rear surface layer, in which the front surface layer contains 80% by mass or more of a vinylidene fluoride-based resin and 20% by mass or less of a methacrylic acid ester-based resin, the degree of crystallization of the front surface layer is 45% or higher, the ratio occupied by ?-crystals in the entire crystal component of the vinylidene fluoride-based resin is 60% or higher, the thickness of the front surface layer is 15 ?m or more, and the rear surface layer contains 90% by mass or more of a methacrylic acid ester-based resin.Type: ApplicationFiled: November 26, 2018Publication date: August 12, 2021Applicant: DENKA COMPANY LIMITEDInventors: Kouta NAGAOKA, Keiji TAKANO
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Publication number: 20200230932Abstract: Provided is a fluorine-based resin multilayer film for vacuum forming which does not cause wrinkles and the like when a three-dimensional surface decoration method is applied. The fluorine-based resin multilayer film for vacuum forming includes a front surface layer containing 60% by mass to 85% by mass of a vinylidene fluoride-based resin and 40% by mass to 15% by mass of a methacrylate ester-based resin; and a back surface layer containing 0% by mass to 50% by mass of a vinylidene fluoride-based resin and 100% by mass to 50% by mass of a methacrylate ester-based resin, wherein the thermal dimensional change in a film flow direction when heated at 120° C. for 30 minutes, which is measured based on JIS K7133, is ?15% to ?2%.Type: ApplicationFiled: September 21, 2018Publication date: July 23, 2020Applicant: DENKA COMPANY LIMITEDInventors: Kouta NAGAOKA, Keiji TAKANO
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Publication number: 20200140636Abstract: To provide a vinylidene-fluoride resin film having low cloudiness and good visibility of a pattern and the like of a decorative film of a lower layer although having a matte tone with low glossiness. The vinylidene-fluoride resin film comprises crosslinked acrylic acid ester resin particles, in which the crosslinked acrylic acid ester resin particles have an average particle diameter of 5% or more and 40% or less to the thickness of the vinylidene-fluoride resin film and the arithmetic average surface roughness (Ra) of the vinylidene-fluoride resin film is 0.4 ?m or more and less than 2 ?m.Type: ApplicationFiled: May 31, 2018Publication date: May 7, 2020Applicant: DENKA COMPANY LIMITEDInventors: Kouta NAGAOKA, Tadashi SAWASATO, Keiji TAKANO
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Patent number: 10001193Abstract: The present invention relates to a power transmission belt containing a tension member extending in a belt lengthwise direction, an adhesion rubber layer in contact with at least a part of the tension member, a compression rubber layer formed on one surface of the adhesion rubber layer, and a tension rubber layer formed on other surface of the adhesion rubber layer, in which the compression rubber layer is formed of a vulcanized rubber composition containing a rubber component, a polyolefin resin and a reinforcing material, the rubber component contains a chloroprene rubber, and the reinforcing material contains a short fiber.Type: GrantFiled: March 27, 2014Date of Patent: June 19, 2018Assignee: Mitsuboshi Belting Ltd.Inventors: Hisato Ishiguro, Keiji Takano, Yoshihiro Miura
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Publication number: 20160298725Abstract: The present invention relates to a power transmission belt containing a tension member extending in a belt lengthwise direction, an adhesion rubber layer in contact with at least a part of the tension member, a compression rubber layer formed on one surface of the adhesion rubber layer, and a tension rubber layer formed on other surface of the adhesion rubber layer, in which the compression rubber layer is formed of a vulcanized rubber composition containing a rubber component, a polyolefin resin and a reinforcing material, the rubber component contains a chloroprene rubber, and the reinforcing material contains a short fiber.Type: ApplicationFiled: March 27, 2014Publication date: October 13, 2016Applicant: MITSUBOSHI BELTING LTD.Inventors: Hisato Ishiguro, Keiji Takano, Yoshihiro Miura
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Patent number: 8071882Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it. A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 ?m to 450 ?m, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 ?m to 300 ?m; and a hybrid circuit board employing it.Type: GrantFiled: April 19, 2006Date of Patent: December 6, 2011Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Yoshihiko Okajima, Katsunori Yashima, Keiji Takano, Takuya Okada
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Publication number: 20100204389Abstract: To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.Type: ApplicationFiled: April 23, 2010Publication date: August 12, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Koichi TAGUCHI, Keiji Takano
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Patent number: 7772295Abstract: To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.Type: GrantFiled: February 2, 2006Date of Patent: August 10, 2010Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Koichi Taguchi, Keiji Takano
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Publication number: 20100035494Abstract: To provide a thermally conductive acrylic sheet having a high temperature conductivity and also a good adhesion characteristic. A double-sided, thermally conductive acrylic adhesive sheet, which is produced from a raw material mixture comprising (a) a monomer: an acrylate or methacrylate having a C2-12 alkyl group, (b) a monomer: an acrylic monomer which is represented by a formula (1) but which is different from the monomer (a), (c) a polythiol and (d) an inorganic powder, wherein the content of the inorganic powder in the raw material mixture is from 30 to 70 vol %, and the maximum particle diameter of the inorganic powder is from 5 to 70% of the thickness of the sheet.Type: ApplicationFiled: September 27, 2007Publication date: February 11, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Takuya Okada, Keiji Takano, Masami Yamashita
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Publication number: 20100027261Abstract: To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life. An LED light source unit comprising a printed board, at least one light emitting diode provided on the printed board, and an adhesive tape for fixing the printed board on the surface of a heat dissipating member, wherein the thermal conductivity of the adhesive tape is from 1 to 4 W/mK, and the withstand voltage between a rear side conductor circuit and a metal housing is at least 1.0 kV.Type: ApplicationFiled: July 20, 2007Publication date: February 4, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Katsunori Yashima, Takeshi Miyakawa, Kenji Miyata, Taiki Nishi, Yoshihiko Okajima, Takuya Okada, Keiji Takano, Toshikatsu Mitsunaga
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Publication number: 20090032295Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it. A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 ?m to 450 ?m, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 ?m to 300 ?m; and a hybrid circuit board employing it.Type: ApplicationFiled: April 19, 2006Publication date: February 5, 2009Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Yoshihiko Okajima, Katsunori Yashima, Keiji Takano, Takuya Okada
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Publication number: 20090023833Abstract: To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.Type: ApplicationFiled: February 2, 2006Publication date: January 22, 2009Inventors: Koichi Taguchi, Keiji Takano