Abstract: An exemplary embodiment of the present invention provides a planar inductor including a substrate, a first magnetic layer, a conductive coil, and a second magnetic layer. The first magnetic layer can be disposed on at least a portion of the substrate. The conductive coil can be disposed on a first portion of the first magnetic layer. The second magnetic layer can be disposed on a second portion of the first magnetic layer and on at least a portion of the conductive coil.

Abstract: A patchable biosensor includes a substrate extending in a longitudinal direction and being stretchable for being patched to a surface of a living body and an electronic component disposed on a one-side surface in a thickness direction of the substrate and extending in the longitudinal direction. The longitudinal direction of the electronic component crosses the longitudinal direction of the substrate.

Abstract: An exemplary embodiment of the present invention provides a planar inductor including a substrate, a first magnetic layer, a conductive coil, and a second magnetic layer. The first magnetic layer can be disposed on at least a portion of the substrate. The conductive coil can be disposed on a first portion of the first magnetic layer. The second magnetic layer can be disposed on a second portion of the first magnetic layer and on at least a portion of the conductive coil.

Abstract: A patchable biosensor includes a substrate extending in a longitudinal direction and being stretchable for being patched to a surface of a living body and an electronic component disposed on a one-side surface in a thickness direction of the substrate and extending in the longitudinal direction. The longitudinal direction of the electronic component crosses the longitudinal direction of the substrate.

Abstract: A biosensor includes a pressure-sensitive adhesive layer for attaching to a surface of a living body, a substrate layer disposed on an upper face of the pressure-sensitive adhesive layer and having a stretching property, a probe disposed on the lower face of the pressure-sensitive adhesive layer, and an electronic component mounted on the substrate layer so as to be connected to the probe, wherein a total thickness of the pressure-sensitive adhesive layer and the substrate layer is 1 ?m or more and less than 100 ?m.

Abstract: The present invention relates to an anode of a lithium secondary battery containing a current collector layer and an active material layer laminated on the current collector layer, wherein the current collector layer has a layer made of NixCu6-xSn5 (x is 0.30-2.0). The anode can achieve a lithium secondary battery showing superior charge-discharge cycle characteristic.

Abstract: A producing method of a wired circuit board includes the steps of preparing a two-layer base material including a metal supporting layer and an insulating layer, covering an upper surface of the insulating layer and respective side end surfaces of the insulating layer and the metal supporting layer with a photoresist, placing a photomask so as to light-shield an end portion and a portion where a conductive layer is to be formed of the upper surface, exposing to light the photoresist covering the upper surface from above the photoresist via the photomask, exposing to light the photoresist covering the respective side end surfaces from below the photoresist, forming an exposed portion of the photoresist into a pattern by removing an unexposed portion thereof to form a plating resist, and forming an end-portion conductive layer and the conductive layer.

Abstract: A method of manufacturing a wiring circuit board includes: preparing an insulating layer; forming conductive thin films on the upper surface and the side end surface of the insulating layer; covering the conductive thin films formed on the upper surface and the side end surface of the insulating layer with photoresists; arranging a photomask so that an end portion and a portion to be provided with a conductive layer in the conductive thin film formed on the upper surface of the insulating layer are shaded and exposing the photoresist covering the conductive thin film formed on the upper surface of the insulating layer from above through the photomask; exposing the photoresist covering the conductive thin film formed on the side end surface of the insulating layer from below; forming plating resists by removing unexposed portions of the photoresists so as to form exposed portions into patterns; forming an end portion conductive layer on the end portion of the conductive thin film formed on the upper surface of

Abstract: A method of manufacturing a wiring circuit board includes: preparing an insulating layer; forming conductive thin films on the upper surface and the side end surface of the insulating layer; covering the conductive thin films formed on the upper surface and the side end surface of the insulating layer with photoresists; arranging a photomask so that an end portion and a portion to be provided with a conductive layer in the conductive thin film formed on the upper surface of the insulating layer are shaded and exposing the photoresist covering the conductive thin film formed on the upper surface of the insulating layer from above through the photomask; exposing the photoresist covering the conductive thin film formed on the side end surface of the insulating layer from below; forming plating resists by removing unexposed portions of the photoresists so as to form exposed portions into patterns; forming an end portion conductive layer on the end portion of the conductive thin film formed on the upper surface of

Abstract: A producing method of a wired circuit board includes the steps of preparing a two-layer base material including a metal supporting layer and an insulating layer, covering an upper surface of the insulating layer and respective side end surfaces of the insulating layer and the metal supporting layer with a photoresist, placing a photomask so as to light-shield an end portion and a portion where a conductive layer is to be formed of the upper surface, exposing to light the photoresist covering the upper surface from above the photoresist via the photomask, exposing to light the photoresist covering the respective side end surfaces from below the photoresist, forming an exposed portion of the photoresist into a pattern by removing an unexposed portion thereof to form a plating resist, and forming an end-portion conductive layer and the conductive layer.