Abstract: Provided is a illumination device having a sufficiently wide irradiation angle and a uniform light intensity within a predetermined range even when using a light source that emits light similar to light with a small spread angle, such as a laser, or to parallel light. This illumination device includes a light source including at least one light emitting portion; a first optical element that receives light output from the light source and outputs the light while expanding an output angle thereof and a second optical element that receives light output from the first optical element and outputs the light while further expanding an irradiation angle thereof.

Abstract: An illumination device includes: a light source that emits parallel light or divergent light; a diffusion element that receives the light emitted from the light source and emits the light at a diffusion angle of 50° or more and 110° or less; and a lens group that has negative power, receives the light from the diffusion element by a first surface, and emits the light from a second surface at a light distribution angle of 140 ° or more.

Abstract: Provided is a illumination device having a sufficiently wide irradiation angle and a uniform light intensity within a predetermined range even when using a light source that emits light similar to light with a small spread angle, such as a laser, or to parallel light. This illumination device includes a light source including at least one light emitting portion; a first optical element that receives light output from the light source and outputs the light while expanding an output angle thereof and a second optical element that receives light output from the first optical element and outputs the light while further expanding an irradiation angle thereof.

Abstract: A radiation angle changing element bonded to a housing includes: a glass substrate; and a resin layer provided on the glass substrate and having an optically functioning part. In a bonding portion bonded to the housing, the resin layer is not formed on the glass substrate.

Abstract: A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength ?1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength ?1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).

Abstract: A radiation angle changing element bonded to a housing includes: a glass substrate; and a resin layer provided on the glass substrate and having an optically functioning part. In a bonding portion bonded to the housing, the resin layer is not formed on the glass substrate.

Abstract: An image sensor unit includes: a linear light source that illuminates a document with a light; a first erecting equal-magnification lens array and a second erecting equal-magnification lens array arranged in the stated order away from the document so as to receive a light reflected from the document and form an erecting equal-magnification image; a slit provided on an intermediate imaging plane between the first erecting equal-magnification lens array and the second erecting equal-magnification lens array; a diffraction grating that disperses a light output from the second erecting equal-magnification lens array; and a linear image sensor that receives a light dispersed by the diffraction grating.

Abstract: A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

Abstract: A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

Abstract: An optical receiver is an optical receiver that receives, through a light receiving element, a light beam having a spiral wavefront propagated through a multimode fiber. The optical receiver includes a reception side vortex optical element arranged between the multimode fiber and the light receiving element.

Abstract: An image sensor unit includes: a linear light source that illuminates a document with a light; a first erecting equal-magnification lens array and a second erecting equal-magnification lens array arranged in the stated order away from the document so as to receive a light reflected from the document and form an erecting equal-magnification image; a slit provided on an intermediate imaging plane between the first erecting equal-magnification lens array and the second erecting equal-magnification lens array; a diffraction grating that disperses a light output from the second erecting equal-magnification lens array; and a linear image sensor that receives a light dispersed by the diffraction grating.

Abstract: A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength ?1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength ?1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).

Abstract: An optical component includes: a first layer made of a first material having a first refractive index, the first layer including a first principal surface and a second principal surface opposite to the first principal surface; and a second layer made of a second material having a second refractive index different from the first refractive index, the second layer including a third principal surface and a fourth principal surface opposite to the third principal surface, and the first layer and the second layer are stacked such that the second principal surface and the third principal surface are in contact. A lens is formed on the first principal surface of the first layer, and a vortex profile is formed on the third principal surface of the second layer.

Abstract: A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength ?1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength ?1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).

Abstract: The present invention provides a low-alkali or alkali-free glass for laser processing, the glass reducing occurrence of laser irradiation-induced cracks and allowing formation of circular through holes. The present invention relates to the glass for laser processing, the glass having a glass composition including, in mol %: 45.0%?SiO2?70.0%; 2.0%?B2O3?20.0%; 3.0%?Al2O3?20.0%; 0%?ZnO?9.0%; and (I) 0.1%?CuO?2.0% and 0%?TiO2?15.0%; or (II) 0.1%?TiO2<5.0% and 0%?CuO<0.1%, wherein, in the case of (II), a metal oxide serving as a coloring component is further included, a relationship of 0?Li2O+Na2O+K2O<2.0% is satisfied, either of principal surfaces of the glass has a layer containing fine particles, and the fine particles have an average particle diameter of 10 nm or more and less than 1.0 ?m.

Abstract: A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

Abstract: A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

Abstract: A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

Abstract: A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength ?1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength ?1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).

Abstract: A glass substrate processing method includes irradiating laser light L onto a glass substrate 1 such that the laser light L is focused within the glass substrate 1, thereby forming a high density area 3 that has a higher density than areas where the laser light L is not irradiated around the portion where the laser light L is focused; and performing chemical etching on the glass substrate 1 using an etching solution such that at least a portion of the high density area is allowed to remain, thereby forming a projection 2 on a surface 1a of the glass substrate 1.