Patents by Inventor Keiji Ueyama

Keiji Ueyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964517
    Abstract: A tire 12 includes: a tread surface 34; seat contact surfaces 58 each to be in contact with a seat S of a rim R; and side surfaces 60 extending on and between the tread surface 34 and the seat contact surfaces 58. Each side surface 60 includes a flange contact surface 62 to be in contact with a flange F of the rim R, and a flange opposed surface 64 which is located radially outward of the flange contact surface 62 and is to be opposed to the flange F. The flange opposed surface 64 is formed to be a surface having a diameter increasing outward in an axial direction. A shape of the flange opposed surface 64 is represented by a circular arc, and a radius of the circular arc is not less than 11.0 mm and not greater than 20.0 mm.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: April 23, 2024
    Assignee: Sumitomo Rubber Industries, Ltd.
    Inventors: Keiji Higuchi, Kenji Kodama, Kazuma Ujigawa, Kiyotaka Ueyama
  • Patent number: 4971651
    Abstract: This invention relates to a microwave plasma processing method and apparatus.An electromagnetic field intensity distribution of a microwave, which is incident into a plasma generation chamber and is again incident due to irregular reflection, is made uniform by uniforming means fixed inside a waveguide, a processing gas is converted to plasma by use of the microwave having the uniformed electromagnetic field intensity distribution, and a sample is plasma-processed by the resulting plasma. Accordingly, the electro-magnetic field of the microwave, which is incident, and is again incident, into the plasma generation region and locally increases a plasma density, is absorbed, attenuated or diffused by the uniforming means so that the distribution of the plasma density is made uniform and uniform processing can be effected.
    Type: Grant
    Filed: February 5, 1990
    Date of Patent: November 20, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Seiichi Watanabe, Makoto Nawata, Ryooji Fukuyama, Yutaka Kakehi, Saburo Kanai, Keiji Ueyama
  • Patent number: 4904155
    Abstract: A vacuum pump with a heating portion for preventing adhesion of reaction products on a discharge side thereof.
    Type: Grant
    Filed: July 12, 1988
    Date of Patent: February 27, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Nagaoka, Ichiro Gyobu, Kimio Muramatsu, Keiji Ueyama, Masahiro Mase, Yoshihisa Awada, Akira Nishiuchi