Patents by Inventor Keiji Yoshida
Keiji Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240405695Abstract: A power conversion device includes an inverter and a controller that controls the inverter. The inverter includes a first inverter circuit and a second inverter circuit that are connected in parallel to a power source. A first output terminal of a full-bridge inverter unit and a first terminal are connected to each other. A second output terminal of the full-bridge inverter unit and a second terminal are connected to each other. The second output terminal of the full-bridge inverter unit and the first output terminal of the full-bridge inverter unit are connected to each other at a connecting point. The connecting point and a neutral point terminal are connected to each other.Type: ApplicationFiled: May 1, 2024Publication date: December 5, 2024Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kazuya OKABE, Keiji YOSHIDA, Masahiro ICHIGO
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Publication number: 20240296997Abstract: An electrolytic capacitor element that includes: an anode having a front end face and a base end face; a dielectric layer on at least one main face of the anode but excluding the base end face; a mask layer on the dielectric layer adjacent the base end face; and a cathode on the dielectric layer on the front end face side from the mask layer, wherein the cathode includes a solid electrolyte layer and a conductive layer, the solid electrolyte layer includes a first layer including a first conductive polymer doped with a first dopant and a second layer including a second conductive polymer doped with a second dopant, the second layer is partially disposed in the plane of the solid electrolyte layer, and the second conductive polymer is more likely to be dedoped than the first conductive polymerType: ApplicationFiled: May 15, 2024Publication date: September 5, 2024Inventors: Yasuo TANAKA, Keiji YOSHIDA
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Patent number: 11972907Abstract: A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t1<t2, t3<t4, t1<t3, and t4/t3<t2/t1, where t1 is the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; t2 is the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; t3 is the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and t4 is the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.Type: GrantFiled: June 15, 2022Date of Patent: April 30, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Tani, Kenichi Oshiumi, Kazutoyo Horio, Junichi Sato, Keiji Yoshida
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Publication number: 20220310327Abstract: A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t1<t2, t3<t4, t1<t3, and t4/t3<t2/t1, where t1 is the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; t2 is the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; t3 is the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and t4 is the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.Type: ApplicationFiled: June 15, 2022Publication date: September 29, 2022Inventors: Satoshi TANI, Kenichi OSHIUMI, Kazutoyo HORIO, Junichi SATO, Keiji YOSHIDA
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Patent number: 8999485Abstract: A liquid silicone rubber composition comprising an alkenyl group-containing liquid organopolysiloxane, a reinforcing silica filler, an organohydrogenpolysiloxane, a platinum group catalyst, a liquid organopolysiloxane that is free of crosslinking groups and is compatible with the alkenyl group-containing liquid organopolysiloxane, and a liquid organopolysiloxane that is free of crosslinking groups and is incompatible with the alkenyl group-containing liquid organopolysiloxane, wherein the cured material therefrom has a JIS type A durometer hardness of 15 to 26 and a tensile stress at 100% elongation of 0.25 to 0.60 MPa. Also, a through hole-containing sealing member comprising this cured material.Type: GrantFiled: December 28, 2010Date of Patent: April 7, 2015Assignee: Dow Corning Toray Co., Ltd.Inventors: Takayoshi Otomo, Keiji Yoshida, Yuji Saito
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Publication number: 20130011606Abstract: A liquid silicone rubber composition comprising an alkenyl group-containing liquid organopolysiloxane, a reinforcing silica filler, an organohydrogenpolysiloxane, a platinum group catalyst, a liquid organopolysiloxane that is free of crosslinking groups and is compatible with the alkenyl group-containing liquid organopolysiloxane, and a liquid organopolysiloxane that is free of crosslinking groups and is incompatible with the alkenyl group-containing liquid organopolysiloxane, wherein the cured material therefrom has a JIS type A durometer hardness of 15 to 26 and a tensile stress at 100% elongation of 0.25 to 0.60 MPa. Also, a through hole-containing sealing member comprising this cured material.Type: ApplicationFiled: December 28, 2010Publication date: January 10, 2013Inventors: Takayoshi Otomo, Keiji Yoshida, Yuji Saito
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Publication number: 20120044117Abstract: A ground conductor is formed by a conductor pattern placed to a surface of a dielectric substrate, and includes a first and a second opening. A transmission line is formed over the dielectric substrate by the conductor pattern. The transmission line supplies a signal to a first and a second peripheral conductor respectively surrounding the first and the second opening. The first and second opening are arranged axis-symmetrically with respect to the transmission line. Opening areas of the first and the second opening are determined so that, due to loop currents supplied by the transmission line flowing through the first and the second peripheral conductor, a region including the first opening and the first peripheral conductor operates as a magnetic field radiation first loop radiating element, and a region including the second opening and the second peripheral conductor operates as a magnetic field radiation second loop radiating element.Type: ApplicationFiled: February 16, 2011Publication date: February 23, 2012Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Hiroshi MATSUKUMA, Keiji YOSHIDA, Haruichi KANAYA
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Patent number: 8106847Abstract: A communication circuit is provided with an antenna section, such as a nonresonant antenna, and a matching section which connects with the antenna section and adjusts impedance, for example. The matching section has a transmission line, and the electric length and characteristic impedance of the transmission line are determined based on the frequency or the frequency band in which the antenna section and the transmission line resonate. For example, since it is not necessary to unite resonance frequency with center frequency if it is a nonresonant antenna, it becomes possible to attain the miniaturization of an antenna. Wide band-ization is realizable by changing the characteristic impedance of the transmission line.Type: GrantFiled: March 3, 2006Date of Patent: January 31, 2012Assignees: Kyushu University, National University Corporation, Fukuoka Industry, Science and Technology FoundationInventors: Keiji Yoshida, Haruichi Kanaya
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Patent number: 7842400Abstract: The present invention provides a surface treated steel sheet including a steel sheet; a plating layer containing at least one metal selected from the group consisting of zinc and aluminum on a surface of the steel sheet; and a film on the plating layer, the film containing at least one metal selected from the group consisting of Al, Mg, and Zn, a tetravalent vanadium compound, and a phosphoric acid group. This surface treated steel sheet exhibits excellent corrosion resistance and excellent surface appearance without containing hazardous substances, such as hexavalent chromium, in the film.Type: GrantFiled: July 28, 2004Date of Patent: November 30, 2010Assignee: JFE Steel CorporationInventors: Takafumi Yamaji, Reiko Yamaji, legal representative, Akira Matsuzaki, Kazuhisa Okai, Keiji Yoshida, Masaaki Yamashita, Yuichi Fukushima, Toshiyuki Okuma
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Publication number: 20090295671Abstract: Communication circuit 1 is provided with antenna sections 3, such as a nonresonant antenna, and matching section 5 which connects with antenna section 3 and adjusts impedance, for example. Matching section 5 has a transmission line and the electric length and characteristic impedance of a transmission line are determined based on the frequency or the frequency band in which antenna section 3 and a transmission line resonate. For example, since it is not necessary to unite resonance frequency with center frequency if it is a nonresonant antenna, it becomes possible to attain the miniaturization of an antenna. Wide band-ization is realizable by changing the characteristic impedance of a transmission line.Type: ApplicationFiled: March 3, 2006Publication date: December 3, 2009Inventors: Keiji Yoshida, Haruichi Kanaya
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Publication number: 20090289738Abstract: When an attenuation pole produces, highly-efficient-izing and a miniaturization of a filter are enabled by changing the electric length between a branch point and each filter. The 1st band pass filter 5 that has the characteristics of center frequency f1, and the 2nd band pass filter 7 that has the characteristics of different center frequency f2 from center frequency f1, In co-planer filter 3 provided with transmission line 9 which connects the 1st band pass filter 5 and the 2nd band pass filter 7, and branch point 11 formed in transmission line 9. It is designed so that an attenuation pole may produce in either [at least] the 1st band pass filter 5 or the 2nd band pass filter 7, and the frequency region which the formation position of branch point 11 is adjusted and an attenuation pole produces is adjusted.Type: ApplicationFiled: March 3, 2006Publication date: November 26, 2009Applicants: Kyushi University National University Corporation, Fukuoka Industry Science & Technology FoundationInventors: Keiji Yoshida, Haruichi Kanaya
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Patent number: 7498897Abstract: An impedance matching circuit, a semiconductor element and a radio communication device using the same, adjusting bandwidth while permitting it to be constructed on the semiconductor element by reducing its occupation area. Since a reactance compensating distributed constant line (31) compensates reactance (BL, XS) of a load (6) and a quarter-wave transmission line (32) and an impedance inverting distributed constant line (33) composing an impedance inverting circuit (K inverter or J inverter) corresponding to the degree of impedance (ZL, ZS) of the load (6) match the impedance (ZL, ZS) of the compensated load (6) and output the input signals (SI1, SI2) at the preset bandwidth, adjustment of bandwidth can be made while miniaturizing the impedance matching circuit (7a) by shortening the line length of the reactance compensating distributed constant line (31) and the quarter-wave transmission line (32).Type: GrantFiled: March 4, 2004Date of Patent: March 3, 2009Assignees: Japan Science and Technlogy Agency, Logic Research Co., Ltd.Inventors: Keiji Yoshida, Haruichi Kanaya, Tadaaki Tsuchiya
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Patent number: 7452195Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.Type: GrantFiled: March 1, 2007Date of Patent: November 18, 2008Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Kazuhiko Ando, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
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Publication number: 20070155893Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.Type: ApplicationFiled: March 1, 2007Publication date: July 5, 2007Applicant: DOW CORNING TORAY COMPANY, LTD.Inventors: Kazuhiko Ando, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
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Patent number: 7202301Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.Type: GrantFiled: April 26, 2002Date of Patent: April 10, 2007Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Kazuhiko Ando, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
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Publication number: 20060182988Abstract: The present invention provides a surface treated steel sheet including a steel sheet; a plating layer containing at least one metal selected from the group consisting of zinc and aluminum on a surface of the steel sheet; and a film on the plating layer, the film containing at least one metal selected from the group consisting of Al, Mg, and Zn, a tetravalent vanadium compound, and a phosphoric acid group. This surface treated steel sheet exhibits excellent corrosion resistance and excellent surface appearance without containing hazardous substances, such as hexavalent chromium, in the film.Type: ApplicationFiled: July 28, 2004Publication date: August 17, 2006Inventors: Takafumi Yamaji, Akira Matsuzaki, Kazuhisa Okai, Keiji Yoshida, Masaaki Yamashita, Yuichi Fukeshima, Toshiyuki Okuma
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Publication number: 20060170515Abstract: An impedance matching circuit and a semiconductor element and a radio communication device using the same which is capable of adjusting bandwidth while permitting it to be constructed on the semiconductor element by reducing its occupation area. Since a reactance compensating distributed constant line (31) compensates reactance (BL, XS) of a load (6) and a quarter-wave transmission line (32) and an impedance inverting distributed constant line (33) composing an impedance inverting circuit (K inverter or J inverter) corresponding to the degree of impedance (ZL, ZS) of the load (6) match the impedance (ZL, ZS) of the compensated load (6) and output the input signals (SI1, SI2) at the preset bandwidth, adjustment of bandwidth can be made while miniaturizing the impedance matching circuit (7a) by shortening the line length of the reactance compensating distributed constant line (31) and the quarter-wave transmission line (32).Type: ApplicationFiled: March 4, 2004Publication date: August 3, 2006Inventors: Keiji Yoshida, Haruichi Kanaya, Tadaaki Tsuchiya
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Publication number: 20040156808Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.Type: ApplicationFiled: April 2, 2004Publication date: August 12, 2004Inventors: Ando Kazuhiko, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
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Patent number: 6617048Abstract: A prepainted steel sheet has a chemically conversion-treated zinc-plated steel sheet and a coating formed on the surface of said zinc-plated steel sheet. The coating is formed by painting and baking of a solvent-type-paint composition. The paint composition contains a polyester resin.Type: GrantFiled: March 27, 2000Date of Patent: September 9, 2003Assignees: NKK Corporation, Dai Nippon Toryo Co., Ltd.Inventors: Keiji Yoshida, Kazumi Ito, Masaaki Yamashita, Hiroyuki Kato, Yasuhiro Toyoda, Yasuyuki Kajita, Susumu Ogawa, Nobuyoshi Kato
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Patent number: D997871Type: GrantFiled: June 17, 2020Date of Patent: September 5, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro Tamatani, Satoshi Tani, Kenichi Oshiumi, Junichi Sato, Kazutoyo Horio, Keiji Yoshida