Patents by Inventor Keiji Yoshida

Keiji Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240405695
    Abstract: A power conversion device includes an inverter and a controller that controls the inverter. The inverter includes a first inverter circuit and a second inverter circuit that are connected in parallel to a power source. A first output terminal of a full-bridge inverter unit and a first terminal are connected to each other. A second output terminal of the full-bridge inverter unit and a second terminal are connected to each other. The second output terminal of the full-bridge inverter unit and the first output terminal of the full-bridge inverter unit are connected to each other at a connecting point. The connecting point and a neutral point terminal are connected to each other.
    Type: Application
    Filed: May 1, 2024
    Publication date: December 5, 2024
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Kazuya OKABE, Keiji YOSHIDA, Masahiro ICHIGO
  • Publication number: 20240296997
    Abstract: An electrolytic capacitor element that includes: an anode having a front end face and a base end face; a dielectric layer on at least one main face of the anode but excluding the base end face; a mask layer on the dielectric layer adjacent the base end face; and a cathode on the dielectric layer on the front end face side from the mask layer, wherein the cathode includes a solid electrolyte layer and a conductive layer, the solid electrolyte layer includes a first layer including a first conductive polymer doped with a first dopant and a second layer including a second conductive polymer doped with a second dopant, the second layer is partially disposed in the plane of the solid electrolyte layer, and the second conductive polymer is more likely to be dedoped than the first conductive polymer
    Type: Application
    Filed: May 15, 2024
    Publication date: September 5, 2024
    Inventors: Yasuo TANAKA, Keiji YOSHIDA
  • Patent number: 11972907
    Abstract: A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t1<t2, t3<t4, t1<t3, and t4/t3<t2/t1, where t1 is the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; t2 is the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; t3 is the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and t4 is the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: April 30, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Tani, Kenichi Oshiumi, Kazutoyo Horio, Junichi Sato, Keiji Yoshida
  • Publication number: 20220310327
    Abstract: A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t1<t2, t3<t4, t1<t3, and t4/t3<t2/t1, where t1 is the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; t2 is the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; t3 is the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and t4 is the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.
    Type: Application
    Filed: June 15, 2022
    Publication date: September 29, 2022
    Inventors: Satoshi TANI, Kenichi OSHIUMI, Kazutoyo HORIO, Junichi SATO, Keiji YOSHIDA
  • Patent number: 8999485
    Abstract: A liquid silicone rubber composition comprising an alkenyl group-containing liquid organopolysiloxane, a reinforcing silica filler, an organohydrogenpolysiloxane, a platinum group catalyst, a liquid organopolysiloxane that is free of crosslinking groups and is compatible with the alkenyl group-containing liquid organopolysiloxane, and a liquid organopolysiloxane that is free of crosslinking groups and is incompatible with the alkenyl group-containing liquid organopolysiloxane, wherein the cured material therefrom has a JIS type A durometer hardness of 15 to 26 and a tensile stress at 100% elongation of 0.25 to 0.60 MPa. Also, a through hole-containing sealing member comprising this cured material.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: April 7, 2015
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Takayoshi Otomo, Keiji Yoshida, Yuji Saito
  • Publication number: 20130011606
    Abstract: A liquid silicone rubber composition comprising an alkenyl group-containing liquid organopolysiloxane, a reinforcing silica filler, an organohydrogenpolysiloxane, a platinum group catalyst, a liquid organopolysiloxane that is free of crosslinking groups and is compatible with the alkenyl group-containing liquid organopolysiloxane, and a liquid organopolysiloxane that is free of crosslinking groups and is incompatible with the alkenyl group-containing liquid organopolysiloxane, wherein the cured material therefrom has a JIS type A durometer hardness of 15 to 26 and a tensile stress at 100% elongation of 0.25 to 0.60 MPa. Also, a through hole-containing sealing member comprising this cured material.
    Type: Application
    Filed: December 28, 2010
    Publication date: January 10, 2013
    Inventors: Takayoshi Otomo, Keiji Yoshida, Yuji Saito
  • Publication number: 20120044117
    Abstract: A ground conductor is formed by a conductor pattern placed to a surface of a dielectric substrate, and includes a first and a second opening. A transmission line is formed over the dielectric substrate by the conductor pattern. The transmission line supplies a signal to a first and a second peripheral conductor respectively surrounding the first and the second opening. The first and second opening are arranged axis-symmetrically with respect to the transmission line. Opening areas of the first and the second opening are determined so that, due to loop currents supplied by the transmission line flowing through the first and the second peripheral conductor, a region including the first opening and the first peripheral conductor operates as a magnetic field radiation first loop radiating element, and a region including the second opening and the second peripheral conductor operates as a magnetic field radiation second loop radiating element.
    Type: Application
    Filed: February 16, 2011
    Publication date: February 23, 2012
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Hiroshi MATSUKUMA, Keiji YOSHIDA, Haruichi KANAYA
  • Patent number: 8106847
    Abstract: A communication circuit is provided with an antenna section, such as a nonresonant antenna, and a matching section which connects with the antenna section and adjusts impedance, for example. The matching section has a transmission line, and the electric length and characteristic impedance of the transmission line are determined based on the frequency or the frequency band in which the antenna section and the transmission line resonate. For example, since it is not necessary to unite resonance frequency with center frequency if it is a nonresonant antenna, it becomes possible to attain the miniaturization of an antenna. Wide band-ization is realizable by changing the characteristic impedance of the transmission line.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: January 31, 2012
    Assignees: Kyushu University, National University Corporation, Fukuoka Industry, Science and Technology Foundation
    Inventors: Keiji Yoshida, Haruichi Kanaya
  • Patent number: 7842400
    Abstract: The present invention provides a surface treated steel sheet including a steel sheet; a plating layer containing at least one metal selected from the group consisting of zinc and aluminum on a surface of the steel sheet; and a film on the plating layer, the film containing at least one metal selected from the group consisting of Al, Mg, and Zn, a tetravalent vanadium compound, and a phosphoric acid group. This surface treated steel sheet exhibits excellent corrosion resistance and excellent surface appearance without containing hazardous substances, such as hexavalent chromium, in the film.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: November 30, 2010
    Assignee: JFE Steel Corporation
    Inventors: Takafumi Yamaji, Reiko Yamaji, legal representative, Akira Matsuzaki, Kazuhisa Okai, Keiji Yoshida, Masaaki Yamashita, Yuichi Fukushima, Toshiyuki Okuma
  • Publication number: 20090295671
    Abstract: Communication circuit 1 is provided with antenna sections 3, such as a nonresonant antenna, and matching section 5 which connects with antenna section 3 and adjusts impedance, for example. Matching section 5 has a transmission line and the electric length and characteristic impedance of a transmission line are determined based on the frequency or the frequency band in which antenna section 3 and a transmission line resonate. For example, since it is not necessary to unite resonance frequency with center frequency if it is a nonresonant antenna, it becomes possible to attain the miniaturization of an antenna. Wide band-ization is realizable by changing the characteristic impedance of a transmission line.
    Type: Application
    Filed: March 3, 2006
    Publication date: December 3, 2009
    Inventors: Keiji Yoshida, Haruichi Kanaya
  • Publication number: 20090289738
    Abstract: When an attenuation pole produces, highly-efficient-izing and a miniaturization of a filter are enabled by changing the electric length between a branch point and each filter. The 1st band pass filter 5 that has the characteristics of center frequency f1, and the 2nd band pass filter 7 that has the characteristics of different center frequency f2 from center frequency f1, In co-planer filter 3 provided with transmission line 9 which connects the 1st band pass filter 5 and the 2nd band pass filter 7, and branch point 11 formed in transmission line 9. It is designed so that an attenuation pole may produce in either [at least] the 1st band pass filter 5 or the 2nd band pass filter 7, and the frequency region which the formation position of branch point 11 is adjusted and an attenuation pole produces is adjusted.
    Type: Application
    Filed: March 3, 2006
    Publication date: November 26, 2009
    Applicants: Kyushi University National University Corporation, Fukuoka Industry Science & Technology Foundation
    Inventors: Keiji Yoshida, Haruichi Kanaya
  • Patent number: 7498897
    Abstract: An impedance matching circuit, a semiconductor element and a radio communication device using the same, adjusting bandwidth while permitting it to be constructed on the semiconductor element by reducing its occupation area. Since a reactance compensating distributed constant line (31) compensates reactance (BL, XS) of a load (6) and a quarter-wave transmission line (32) and an impedance inverting distributed constant line (33) composing an impedance inverting circuit (K inverter or J inverter) corresponding to the degree of impedance (ZL, ZS) of the load (6) match the impedance (ZL, ZS) of the compensated load (6) and output the input signals (SI1, SI2) at the preset bandwidth, adjustment of bandwidth can be made while miniaturizing the impedance matching circuit (7a) by shortening the line length of the reactance compensating distributed constant line (31) and the quarter-wave transmission line (32).
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: March 3, 2009
    Assignees: Japan Science and Technlogy Agency, Logic Research Co., Ltd.
    Inventors: Keiji Yoshida, Haruichi Kanaya, Tadaaki Tsuchiya
  • Patent number: 7452195
    Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: November 18, 2008
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Kazuhiko Ando, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
  • Publication number: 20070155893
    Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.
    Type: Application
    Filed: March 1, 2007
    Publication date: July 5, 2007
    Applicant: DOW CORNING TORAY COMPANY, LTD.
    Inventors: Kazuhiko Ando, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
  • Patent number: 7202301
    Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: April 10, 2007
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Kazuhiko Ando, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
  • Publication number: 20060182988
    Abstract: The present invention provides a surface treated steel sheet including a steel sheet; a plating layer containing at least one metal selected from the group consisting of zinc and aluminum on a surface of the steel sheet; and a film on the plating layer, the film containing at least one metal selected from the group consisting of Al, Mg, and Zn, a tetravalent vanadium compound, and a phosphoric acid group. This surface treated steel sheet exhibits excellent corrosion resistance and excellent surface appearance without containing hazardous substances, such as hexavalent chromium, in the film.
    Type: Application
    Filed: July 28, 2004
    Publication date: August 17, 2006
    Inventors: Takafumi Yamaji, Akira Matsuzaki, Kazuhisa Okai, Keiji Yoshida, Masaaki Yamashita, Yuichi Fukeshima, Toshiyuki Okuma
  • Publication number: 20060170515
    Abstract: An impedance matching circuit and a semiconductor element and a radio communication device using the same which is capable of adjusting bandwidth while permitting it to be constructed on the semiconductor element by reducing its occupation area. Since a reactance compensating distributed constant line (31) compensates reactance (BL, XS) of a load (6) and a quarter-wave transmission line (32) and an impedance inverting distributed constant line (33) composing an impedance inverting circuit (K inverter or J inverter) corresponding to the degree of impedance (ZL, ZS) of the load (6) match the impedance (ZL, ZS) of the compensated load (6) and output the input signals (SI1, SI2) at the preset bandwidth, adjustment of bandwidth can be made while miniaturizing the impedance matching circuit (7a) by shortening the line length of the reactance compensating distributed constant line (31) and the quarter-wave transmission line (32).
    Type: Application
    Filed: March 4, 2004
    Publication date: August 3, 2006
    Inventors: Keiji Yoshida, Haruichi Kanaya, Tadaaki Tsuchiya
  • Publication number: 20040156808
    Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.
    Type: Application
    Filed: April 2, 2004
    Publication date: August 12, 2004
    Inventors: Ando Kazuhiko, Keiji Yoshida, Toyohiko Yamadera, Yoshitsugu Morita, Mitsuo Hamada
  • Patent number: 6617048
    Abstract: A prepainted steel sheet has a chemically conversion-treated zinc-plated steel sheet and a coating formed on the surface of said zinc-plated steel sheet. The coating is formed by painting and baking of a solvent-type-paint composition. The paint composition contains a polyester resin.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: September 9, 2003
    Assignees: NKK Corporation, Dai Nippon Toryo Co., Ltd.
    Inventors: Keiji Yoshida, Kazumi Ito, Masaaki Yamashita, Hiroyuki Kato, Yasuhiro Toyoda, Yasuyuki Kajita, Susumu Ogawa, Nobuyoshi Kato
  • Patent number: D997871
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: September 5, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro Tamatani, Satoshi Tani, Kenichi Oshiumi, Junichi Sato, Kazutoyo Horio, Keiji Yoshida