Abstract: Optical communication apparatuses capable of performing appropriate communication according to a distance to a receiving apparatus, optical communication methods, and an optical communication system are provided. A transmitting apparatus transmits an optical signal corresponding to data. The transmitting apparatus modulates intensity of the optical signal into intensity corresponding to a distance over which the data is to be delivered and outputs this intensity-modulated optical signal. This allows the transmitting apparatus to change the intensity of the optical signal corresponding to the data according to a distance to a receiving apparatus that receives the data, which thus allows the receiving apparatus to surely receive the data.

Abstract: Optical communication apparatuses capable of performing appropriate communication according to a distance to a receiving apparatus, optical communication methods, and an optical communication system are provided. A transmitting apparatus transmits an optical signal corresponding to data. The transmitting apparatus modulates intensity of the optical signal into intensity corresponding to a distance over which the data is to be delivered and outputs this intensity-modulated optical signal. This allows the transmitting apparatus to change the intensity of the optical signal corresponding to the data according to a distance to a receiving apparatus that receives the data, which thus allows the receiving apparatus to surely receive the data.

Abstract: The invention relates to a thermal head which comprises: a plurality of heating elements arranged at regular intervals on the top surface of an electrically insulating substrate; a common electrode connected to one ends of the respective heating elements; a plurality of discrete lead wires connected to the other ends of the respective heating elements and led out in directions at predetermined angles with respect to the direction of arrangement of the heating elements; and driving IC including a plurality of connecting pads arranged nearly parallel with the direction of arrangement of the heating elements and with intervals smaller than the intervals of arrangement of the heating elements, the connecting pads connected to lead-out sections of the discrete lead wires, wherein the connecting pads of the driving IC are arranged with intervals between the neighboring connecting pads which vary depending on the sine values of angles between the direction of arrangement of the heating elements and the lead-out dire

Abstract: In a thermal head comprising a ceramic substrate, a glaze layer partially formed on the ceramic substrate, heat-generating resistors and electrodes connected to both the ends of the heat-generating resistors, if the width of individual electrodes located outside the glaze layer is made narrower than the width of corresponding electrodes on the glaze layer, formation of a short circuit between adjacent individual electrodes because of the presence of voids on the ceramic substrate can be effectively prevented.

Abstract: In an IC-loaded thermal head, a flip chip is used as IC, and respective terminals of IC elements are directly connected by wireless bonding to terminals of heat generators of the head and terminals for external connection.

Abstract: Disclosed is a thermal head comprising a protecting film composed of tantalum silicon oxynitride. An undercoat film may be formed between this protecting film and heat-generating resistors and electrodes. This protecting film is excellent in the abrasion resistance and oxygen barrier property and acts as an excellent barrier to alkali metal ions to be injected into the head from a heat-sensitive recording paper.

Abstract: A thermal head composed of an electrically insulative substrate, a resistive film made of TiO.sub.x (0<x<2) formed on the substrate, and an electrode made of a metal such as Au, Al, and Cu etc. The resistive film is produced by an electron beam vapor deposition method employing an apparatus having a vacuum chamber wherein an evaporation source composed of Ti is irradiated with an electron beam to evaporate Ti so as to deposit a resultant TiO.sub.x on the substrate.

Abstract: A thermal head composed of an electrically insulative substrate, a resistive film made of TiO.sub.x (0<x<2) formed on the substrate, and an electrode made of a metal such as Au, Al, and Cu etc. The resistive film is produced by an electron beam vapor deposition method employing an apparatus having a vacuum chamber wherein an evaporation source composed of Ti is irradiated with an electron beam to evaporate Ti so as to deposit a resultant TiO.sub.x on the substrate.