Patents by Inventor Keiko Hada

Keiko Hada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210159096
    Abstract: A substrate cleaning apparatus, includes a vaporizer configured to generate water vapor, a first heating part configured to heat a nitrogen gas to a first temperature, a second heating part configured to heat the nitrogen gas to a second temperature, wherein the second temperature is higher than the first temperature, and at least one cleaning chamber connected to the vaporizer, the first heating part, and the second heating part, wherein the at least one cleaning chamber is configured so that at least one substrate is exposed to the water vapor, the nitrogen gas having the first temperature, or the nitrogen gas having the second temperature under an atmospheric pressure.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 27, 2021
    Inventors: Toshimitsu SAKAI, Keiko HADA
  • Publication number: 20210104412
    Abstract: There is provided a substrate processing method which includes: treating a substrate using a fluorine-containing gas; and exposing the substrate to a moisture-containing atmosphere.
    Type: Application
    Filed: November 13, 2020
    Publication date: April 8, 2021
    Inventors: Keiko HADA, Akitaka SHIMIZU, Koichi NAGAKURA, Mitsuhiro TACHIBANA
  • Patent number: 10903083
    Abstract: There is provided a substrate processing method which includes: treating a substrate using a fluorine-containing gas; and exposing the substrate to a moisture-containing atmosphere.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: January 26, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Keiko Hada, Akitaka Shimizu, Koichi Nagakura, Mitsuhiro Tachibana
  • Publication number: 20200048134
    Abstract: There is provided a method of processing an oxygen-containing workpiece. The method of processing an oxygen-containing workpiece includes controlling a fluorine concentration in the oxygen-containing workpiece based on at least one of a kind of a fluorine-containing processing gas, a processing temperature and a processing pressure used for processing the oxygen-containing workpiece.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 13, 2020
    Inventors: Reiko SASAHARA, Yasuo NAKATANI, Keiko HADA
  • Patent number: 10213076
    Abstract: A particle collecting apparatus is provided with a case, an ultrasonic generator, a gas supplying unit, a suction unit and a seal member. The case has one end, and defines a space at the one end. The ultrasonic generator is provided in the case, and generates ultrasonic waves towards the opening defined by the one end of the case. The gas supplying unit supplies gas to the space. The suction unit exhausts the space. The seal member has elasticity, and is provided at the one end so as to surround the opening.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: February 26, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Nobuhiro Takahashi, Keiko Hada
  • Publication number: 20170200618
    Abstract: There is provided a substrate processing method which includes: treating a substrate using a fluorine-containing gas; and exposing the substrate to a moisture-containing atmosphere.
    Type: Application
    Filed: January 10, 2017
    Publication date: July 13, 2017
    Inventors: Keiko HADA, Akitaka SHIMIZU, Koichi NAGAKURA, Mitsuhiro TACHIBANA
  • Patent number: 7497482
    Abstract: A pipe joint comprises a first joint member of synthetic resin having an annular recessed portion in an end face thereof, and a second joint member of synthetic resin having an annular ridge on an end face thereof. The ridge is fitted in the opening of the recessed portion, with a synthetic resin gasket fitted in the recessed portion. When the pipe joint is properly tightened up, the outer surface of the ridge of the second joint member is pressed against the inner surface of the recessed portion of the first joint member with the gasket interposed therebetween in intimate contact with the surfaces approximately over the entire areas thereof.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: March 3, 2009
    Assignee: Fujikin Incorporated
    Inventors: Kazuhiko Sugiyama, Keiko Hada, Eiji Ideta, Nobukazu Ikeda, Naofumi Yasumoto, Michio Yamaji
  • Publication number: 20050179259
    Abstract: A pipe joint 1 comprises a first joint member 2 of synthetic resin having an annular recessed portion 7 in an end face thereof, and a second joint member 3 of synthetic resin having an annular ridge 8 on an end face thereof. The ridge 8 is fitted in the opening of the recessed portion 7, with a synthetic resin gasket 4 fitted in the recessed portion 7.
    Type: Application
    Filed: March 19, 2003
    Publication date: August 18, 2005
    Inventors: Kazuhiko Sugiyama, Keiko Hada, Eiji Ideta, Nobukazu Ikeda, Naofumi Yasumoto, Michio Yamaji
  • Patent number: 6617095
    Abstract: A HMDS gas is supplied to a surface of a wafer W to perform a hydrophobic process, thereafter the wafer W is contained in an airtight container on a cassette stage, and is transferred to an analyzer provided at an external portion of a resist pattern forming apparatus. The analyzer performs mass spectrometry of the quantity of an ionic species such as CH9Si+, C3H9Si+, C3H9Osi− and the like on the surface of the wafer W using an analyzing section, for example, TOF-SIMS, whereby measuring a HMDS quantity (hexamethyldisilazane) on the surface of the wafer W. This method makes it possible to measure the HMDS quantity on the surface of the wafer W and to evaluate a hydrophobic process state with high reliability.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: September 9, 2003
    Assignee: Tokyo Electron Limited
    Inventors: Junichi Kitano, Keiko Hada, Yuko Ono, Takayuki Katano, Hidefumi Matsui
  • Publication number: 20020009592
    Abstract: A HMDS gas is supplied to a surface of a wafer W to perform a hydrophobic process, thereafter the wafer W is contained in an airtight container on a cassette stage, and is transferred to an analyzer provided at an external portion of a resist pattern forming apparatus. The analyzer performs mass spectrometry of the quantity of an ionic species such as CH9Si+, C3H9Si+, C3H9Osi− and the like on the surface of the wafer W using an analyzing section, for example, TOF-SIMS, whereby measuring a HMDS quantity (hexamethyldisilazane) on the surface of the wafer W. This method makes it possible to measure the HMDS quantity on the surface of the wafer W and to evaluate a hydrophobic process state with high reliability.
    Type: Application
    Filed: April 6, 2001
    Publication date: January 24, 2002
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Junichi Kitano, Keiko Hada, Yuko Ono, Takayuki Katano, Hidefumi Matsui