Patents by Inventor Keiko Ishizaki

Keiko Ishizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170051380
    Abstract: The present invention provides a homogenization method of a Cu alloy containing Ru, which method comprises a step of adding at least one substance selected from the group consisting of Fe, Ni, FeSi, and Si to a Cu alloy containing at least Ru to homogenize Ru that is segregated within the Cu alloy. The homogenization method improves solubility of Ru in a Cu alloy containing Ru and thus accurate measurement of a precious metal content in the Cu alloy can be performed.
    Type: Application
    Filed: February 12, 2015
    Publication date: February 23, 2017
    Inventors: Katsunori YAMAGUCHI, Ryo TAGAWA, Hirofumi SAKAMOTO, Mitsuharu FUJITA, Tetsuya UEDA, Keiko ISHIZAKI, Minoru KAWASAKI, Kiyoshi HIROSUE
  • Patent number: 9115418
    Abstract: Provided is a method of unevenly distributing a specific element in a copper phase out of platinum group elements that exist in the copper phase, including further adding copper into a molten copper phase containing the platinum group elements including at least rhodium, thereby increasing a distribution ratio of rhodium in the molten copper phase.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: August 25, 2015
    Assignees: TANAKA KIKINZOKU KOGYO K.K., DOWA METALS & MINING CO., LTD.
    Inventors: Yuzuru Nakamura, Minoru Kawasaki, Katsunori Yamaguchi, Tetsuya Ueda, Keiko Ishizaki
  • Publication number: 20140150608
    Abstract: Provided is a method of unevenly distributing a specific element in a copper phase out of platinum group elements that exist in the copper phase, including further adding copper into a molten copper phase containing the platinum group elements including at least rhodium, thereby increasing a distribution ratio of rhodium in the molten copper phase.
    Type: Application
    Filed: March 7, 2012
    Publication date: June 5, 2014
    Applicants: DOWA METALS & MINING CO., LTD., TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Yuzuru Nakamura, Minoru Kawasaki, Katsunori Yamaguchi, Tetsuya Ueda, Keiko Ishizaki