Abstract: The invention provides an S1P ligand-binding nucleic acid complex that is delivered to a target organ to regulate expression or editing of a target gene or a transcription or translation product thereof. The S1P ligand-binding nucleic acid complex includes a nucleic acid with an antisense oligonucleotide 12 to 30 nucleotides in length, and has a nucleic acid sequence complementary to a target transcription product, bound to a S1P ligand. The nucleic acid complex is useful for the treatment of a disease caused by such gene. The ligand-binding nucleic acid complex can be delivered to an organ, tissue, or cell in which the S1P receptor is expressed, such as the skeletal muscle, cardiac muscle, liver, kidney, lung, mammary gland, fat, podocyte, lymphocyte, or vascular endothelial cell.

Abstract: On each of the contact terminals of a test socket, one or more contact projections having a radius of curvature within a specified range, such as 0.03 to 0.3 mm, are formed in the portion of the contact terminals which contacts the corresponding external connection terminal of an electronic device. Further, a plurality of protuberances and recesses are formed on the surface of the contact projection, and each of the protuberances is formed to assume a substantially spherical surface having a radius of curvature of 2 to 15 microns. The test socket is for use in testing an electrical characteristics of an electronic device or a semiconductor package, and stable electrical contact is ensured between contact terminals of the test socket and external connection terminals of an electronic device or a semiconductor package.

Abstract: A semiconductor device socket prevents adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. A positioning base of the socket supports external leads of the semiconductor device such that the lead ends of the leads do not contact a body of the socket. Movable contact terminals of the socket disposed opposite the external leads can move into and out of contact with the external leads.

Abstract: A semiconductor device test socket for connecting an external circuit to external leads of a semiconductor device to permit testing of the semiconductor device includes a body having a positioning base for supporting roots of external leads of a semiconductor device to be tested. A plurality of movable contact terminals are supported by the body and disposed opposite to the external leads of the semiconductor device when the semiconductor device is supported by the positioning base. The contact terminals are movable between a first position electrically contacting the external leads and a second position spaced from the external leads. The contact terminals are configured so as to be moved to their second positions when a conveyance tool for supporting the semiconductor device to be tested is moved towards the test socket and pressed against the contact terminals, and so as to move to their first positions when the conveyance tool is moved away from the test socket out of contact with the contact terminals.

Abstract: A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.

Abstract: A safety apparatus is mounted to the side of a bed of a power press machine on which an operator is positioned for ensuring safety of the operator of the power press machine. The safety apparatus includes a table, for supporting the front end portion of a workpiece, fitted so as to be movable toward and away from the bed at substantially the same height as a fixed mold set to the bed side and on the side of the bed where the operator is positioned. A pair of two-hand operation type switches are fitted to the front side portion of the table with a gap between them, and are operated by both hands of the operator. A deactivating switch is provided for deactivating the pair of two-hand operation type switches when a movable mold set to slide portion side of the power press machine approaches to within predetermined distance of the fixed mold set to the bed side to provide a safety state.

Abstract: A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.