Abstract: A p-type thermoelectric converting substance used as a p-type semiconductor in a thermoelectric converting module consisting essentially of a substance expressed by a chemical formula CoSbxSny or CoSbxGey (2.7<x<3.4, 0<y<0.4, x+y>3), and containing a small amount of oxygen z defined by 2(x+y−3)≧z. The amount of oxygen z is preferably limited such that it is not higher than 0.1 molecules per 1 molecule of Co. An alloy ingot consisting essentially of CoSbxSny or CoSbxGey (2.7<x<3.4, 0<y<0.4, x+y>3) is ground to obtain a raw material powder. Then, the powder is cast into a mold, and the mold is sintered under a non-oxidizing or reducing atmosphere. The thus obtained substance reveals p-conductivity in a stable manner over a wide temperature range, and has excellent thermoelectric converting properties.

Abstract: An electric energy supply system for a vehicle includes a power output shaft electric power generation unit and an exhaust gas electric power generation unit for generating electric power by utilizing a power energy and an exhaust gas energy. A storage battery, a driving condition judgment unit for judging a driving condition of the vehicle, an electricity storage condition judgment unit for judging an electricity storage condition of the storage battery, and an electric power control unit for controlling a supply amount of electric energy to be used in the vehicle are provided. Under the control of the electricity power control unit, the amount of electric power generated by each of the power output shaft electric power generation unit and the exhaust gas electric power generation unit is controlled in accordance with information obtained from the driving condition judgement unit and the electricity storage condition judgement unit.

Abstract: An apparatus for generating a thermoelectric power and method for driving the same.

Abstract: A thermoelectric conversion module including a honeycomb structural body 3 made of an electrically insulating material, N type and P type semiconductor elements 1 and 2 inserted into through holes formed in the honeycomb structural body 3, electrically insulating filler members 4 filled in spaces between the semiconductor elements and inner walls of the through holes such that the semiconductor elements are fixed in position within respective through holes, and electrodes 7 connecting end surfaces of the semiconductor elements on polished end surfaces of the honeycomb structural body such that N type and P type semiconductor elements are alternately connected in series. According to the invention, the electrically insulating filler members are made of an inorganic adhesive of alkali metal silicate or sol-gel glass.

Abstract: A thermoelectric conversion module having a large capacity and a curved surface is manufactured by immersing a honeycomb structural body having a number of through holes, openings of every other through holes being closed by clogging members, into a semiconductor material melt of one conductivity type to suck the semiconductor material melt into through holes whose openings are not closed, cooling the thus sucked semiconductor material melt to form semiconductor elements of one conductivity type, immersing again the honeycomb structural body after removing said clogging members into a semiconductor material melt of the other conductivity type to suck the semiconductor material melt into the through holes, cooling the thus sucked semiconductor material melt to form semiconductor elements of the other conductivity type, cutting the honeycomb structural body into a plurality of thermoelectric conversion module main bodies, and providing metal electrodes of both surfaces of a thermoelectric conversion module main

Abstract: A thermoelectric conversion module having a large capacity and a curved surface which can be secured to a corresponding curved surface of a base member is manufactured by inserting N type and P type semiconductor strips into through holes formed in a honeycomb structural body, filling spaces between walls defining the through holes and the semiconductor strips with an electrically insulating filler members made of an easily deformable material such as polyimide resin and silicone resin, cutting the honeycomb structural body into a plurality of thermoelectric conversion module main bodies each having a desired surface configuration, and providing metal electrodes on both surfaces of a thermoelectric conversion module main body such that alternate N type and P type semiconductor elements are connected in cascade.

Abstract: A thermoelectric conversion module having a large capacity and a curved surface is manufactured by immersing a honeycomb structural body having a number of through holes, openings of every other through holes being closed by clogging members, into a semiconductor material melt of one conductivity type to suck the semiconductor material melt into through holes whose openings are not closed, cooling the thus sucked semiconductor material melt to form semiconductor elements of one conductivity type, immersing again the honeycomb structural body after removing the clogging members into a semiconductor material melt of the other conductivity type to suck the semiconductor material melt into the through holes, cooling the thus sucked semiconductor material melt to form semiconductor elements of the other conductivity type, cutting the honeycomb structural body into a plurality of thermoelectric conversion module main bodies, and providing metal electrodes of both surfaces of a thermoelectric conversion module main

Abstract: A thermoelectric conversion module having a large capacity and a curved surface which can be secured to a corresponding curved surface of a base member is manufactured by inserting N type and P type semiconductor strips into through holes formed in a honeycomb structural body, filling spaces between walls defining the through holes and the semiconductor strips with filler members, cutting the honeycomb structural body into a plurality of thermoelectric conversion module main bodies each having a desired surface configuration, providing metal electrodes on both surfaces of a thermoelectric conversion module main body such that alternate N type and P type semiconductor elements are connected in cascade, and removing the filler members or the honeycomb structural body and filler members.