Patents by Inventor Keiko Miura

Keiko Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable resin composition
    Publication number: 20050171318
    Abstract: A curable resin composition includes a silane compound (a) having an epoxy group, and at least one selected from a silane compound (b) having an amino group, a silane compound (c) having a mercapto group, and a silane compound (d) having an acid anhydride group. At least a part of at least one selected from the silane compounds (a) to (d) includes a condensate. This composition has excellent heat resistance with a small change in storage modulus due to temperatures.
    Type: Application
    Filed: February 2, 2005
    Publication date: August 4, 2005
    Inventors: Hiroyuki Okuhira, Tomoyuki Matsumura, Kazunori Ishikawa, Natsuki Hamada, Keiko Miura, Hiroyuki Hosoda, Mitsukazu Ochi