Abstract: An integrated optical transmission board in accordance with one embodiment of the invention includes: a first optical transmission board having a first optical transmission line; a second optical transmission board having a second optical transmission line; and an optical coupling structure which is disposed between the first optical transmission board and the second optical transmission board and has a third optical transmission line for providing optical connection between the first optical transmission line and the second optical transmission line. The first optical transmission board further has a first engagement portion provided in an area thereof opposed to the optical coupling structure. The optical coupling structure further has a second engagement portion provided in an area thereof opposed to the first optical transmission board so as to make engagement with the first engagement portion.

Abstract: An integrated optical transmission board in accordance with one embodiment of the invention includes: a first optical transmission board having a first optical transmission line; a second optical transmission board having a second optical transmission line; and an optical coupling structure which is disposed between the first optical transmission board and the second optical transmission board and has a third optical transmission line for providing optical connection between the first optical transmission line and the second optical transmission line. The first optical transmission board further has a first engagement portion provided in an area thereof opposed to the optical coupling structure. The optical coupling structure further has a second engagement portion provided in an area thereof opposed to the first optical transmission board so as to make engagement with the first engagement portion.

Abstract: An integrated optical transmission board in accordance with one embodiment of the invention includes: a first optical transmission board having a first optical transmission line; a second optical transmission board having a second optical transmission line; and an optical coupling structure which is disposed between the first optical transmission board and the second optical transmission board and has a third optical transmission line for providing optical connection between the first optical transmission line and the second optical transmission line. The first optical transmission board further has a first engagement portion provided in an area thereof opposed to the optical coupling structure. The optical coupling structure further has a second engagement portion provided in an area thereof opposed to the first optical transmission board so as to make engagement with the first engagement portion.

Abstract: In a mounting structure of an optical module, an optical semiconductor device such as a light emitting device or a photo sensing device and an optical fiber are mounted. The optical fiber is directly mounted in a mounting groove formed on a top face of the substrate. The optical semiconductor device is mounted on a front face of a carrier corresponding to {110} surface or {100} surface equivalent to (110) surface or (100) surface of a single crystalline silicon. The carrier has a slanted first positioning face corresponding to {111} surface equivalent to (111) surface of the single crystalline silicon. The substrate has a slanted second positioning face corresponding to {111} surface equivalent to (111) surface of the single crystalline silicon with respect to the top face corresponding to {110} surface or {100} surface of the single crystalline silicon. Thus, the front face of the carrier becomes perpendicular to the top face of the substrate.

Abstract: In a mounting structure of an optical module, an optical semiconductor device such as a light emitting device or a photo sensing device and an optical fiber are mounted. The optical fiber is directly mounted in a mounting groove formed on a top face of the substrate. The optical semiconductor device is mounted on a front face of a carrier corresponding to {110} surface or {100} surface equivalent to (110) surface or (100) surface of a single crystalline silicon. The carrier has a slanted first positioning face corresponding to {111} surface equivalent to (111) surface of the single crystalline silicon. The substrate has a slanted second positioning face corresponding to {111} surface equivalent to (111) surface of the single crystalline silicon with respect to the top face corresponding to {110} surface or {100} surface of the single crystalline silicon. Thus, the front face of the carrier becomes perpendicular to the top face of the substrate.