Patents by Inventor Keiko Shichijo
Keiko Shichijo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6399683Abstract: A resin composition for extruded forms that has improved workability, and excellent properties with respect to transparency, heat resistance, low-temperature resistance, etc. The composition contains 50 to 99% by weight of component A, which is a copolymer of ethylene and &agr;-olefin, and 1 to 50% by weight of component B, which is an ethylene-containing polymer. The component A has: (a) a melt flow rate (MFR) of 0.1 to 5 g/10 min.; (b) a density D of 0.88 to 0.Type: GrantFiled: November 10, 1997Date of Patent: June 4, 2002Assignee: Mitsubishi Chemical CorporationInventors: Koji Yamamoto, Hajime Ikeno, Keiko Shichijo
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Patent number: 6087429Abstract: The present invention provides a propylene resin composition having an excellent balance between low-temperature impact resistance and rigidity, and which is suitable for automobile interior and exterior trim parts.The resin composition contains the following components A, B, and C:Component A: 50 to 80% by weight of a crystalline propylene-ethylene block copolymer having an ethylene content of 1 to 15% by weight, and a melt flow rate of 10 to 100 g/10 min.Component B: 5 to 40% by weight of an ethylene-.alpha.-olefin copolymer containing 25 to 70% by weight of an .alpha.-olefin having 4 to 18 carbon atoms, a melt flow rate of 0.01 to 7 g/10 min., and a density of 0.850 to 0.890 g/cm.sup.3Component C: 1 to 30% by weight of talc having an average particle size of 0.1 to 5.mu..Type: GrantFiled: April 21, 1997Date of Patent: July 11, 2000Assignee: Mitsubishi Chemical CorporationInventors: Koji Yamamoto, Keiko Shichijo, Hajime Ikeno
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Patent number: 5811163Abstract: An in-mold label which has a thermoplastic resin film base layer (I) having printed matter on its front side and, formed on the back side of the thermoplastic resin base layer (I), a heat sealable resin layer (II) having a lower melting point than the constituent resin of the thermoplastic resin film base layer (I), the constituent resin of the heat sealable resin layer (II) having as its main component an ethylene/.alpha.-olefin copolymer obtained by copolymerizing from 40 to 98 wt % ethylene and from 60 to 2 wt % of an .alpha.-olefin having from 3 to 30 carbon atoms using a metallocene catalyst.Type: GrantFiled: August 13, 1996Date of Patent: September 22, 1998Assignee: Oji-Yuka Synthetic Paper Co., Ltd.Inventors: Akihiko Ohno, Takatoshi Nishizawa, Masaki Shiina, Junichi Yasuda, Hajime Ikeno, Keiko Shichijo
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Patent number: 5741861Abstract: A resin composition containing 50 to 99% by weight of component A, which is a copolymer of ethylene and .alpha.-olefin, and 1 to 50% by weight of component B, which is a high-pressure low-density polyethylene. The component A has (a) a melt flow rate (MFR) of 2 to 30 g/10 min., (b) a density of not more than 0.935 g/cm.sup.3, and (c) a single peak of elution volume indicated by an elution curve obtained by temperature rising elution fractionation, the peak corresponding to a temperature within a range of from 20.degree. C. to 85.degree. C., and the elution curve satisfying a relationship in which the ratio H/W is not less than 1 when H represents the height of the peak and W represents the width of the elution curve at half of the height H. The component B has (a') a melt flow rate of 0.1 to 20 g/10 min., (b') a density of 0.915 to 0.93 g/cm.sup.3, ('c) a memory effect (ME) of not less than 1.6, and (d') a melt tension (MT) of not less than 1.5 g.Type: GrantFiled: March 23, 1995Date of Patent: April 21, 1998Assignee: Mitsubishi Chemical CorporationInventors: Koji Yamamoto, Hajime Ikeno, Keiko Shichijo
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Patent number: 5656696Abstract: A resin composition for injection molding that has excellent transparency, and also has excellent strength and sufficient flexibility. The composition contains 50 to 99% by weight of component A, which is a copolymer of ethylene and .alpha.-olefin having a carbon number of not less than 4, and 1 to 50% by weight of component B, which is an olefin-containing polymer. The component A has: (a) a melt flow rate (MFR) of 10 to 120 g/10 min.; (b) a density (D) of not more than 0.915 g/cm.sup.3 ; and (c) at least one peak of elution volume indicated by an elution curve obtained by temperature rising elution fractionation (TREF), wherein the peak corresponds to a temperature of not more than 85.degree. C., and the elution curve may also indicate substantial elution volume at temperatures other than the temperature to which the peak corresponds.Type: GrantFiled: February 23, 1994Date of Patent: August 12, 1997Assignee: Mitsubishi Chemical CorporationInventors: Koji Yamamoto, Keiko Shichijo, Norikazu Komiya
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Patent number: 5391618Abstract: A propylene resin composition comprising:50 to 97% by weight of component (A) which is a propylene polymer having an MFR of 5 to 200 g/10 min, and50 to 3% by weight of component (B) which is an ethylene-.alpha.-olefin copolymer of an .alpha.-olefin content of 10 to 60% by weight and of an .alpha.-olefin having 4 to 18 carbon atoms, said ethylene-.alpha.-olefin copolymer having the following properties (a) to (c):(a): a density of 0.913 g/cm.sup.3 or less,(b): an MFR of 0.01 to 20 g/10 min, and(c): a flexural rigidity according to ASTM D747 of 2,000 kg/cm.sup.2 or less.The composition has improved impact resistance at both room temperature and low temperatures, a good property balance between rigidity and impact resistance, and high moldability.Type: GrantFiled: October 14, 1993Date of Patent: February 21, 1995Assignee: Mitsubishi Petrochemical Company LimitedInventors: Koji Yamamoto, Hajime Ikeno, Keiko Shichijo
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Patent number: 5385972Abstract: A filler-containing resin composition containingcomponent A, which is an ethylene copolymer having (a) a melt flow rate (MFR) of 0.01 to 20 g/10 min.; (b) a density D of not more than 0.935 g/cm.sup.3 ; (c) a single peak of elution volume corresponding to a temperature within a range from 30 to 100.degree. C. with the elution curve satisfying a relationship in which the ratio H/W is not less than 1 when H represents the height of the peak and W represents the width of the elution curve at 1/2 H; and (d) an elution volume Y wherein (1) Y.ltoreq.-4500D+4105 when the density D of the component A is less than 0.91 g/cm.sup.3, but Y.ltoreq.100; or (2) Y.ltoreq.10 when the density D of the component A is not less than 0.91 g/cm.sup.3 ; andcomponent B, which is a particulate inorganic filler having an average particle size of not more than 10 .mu.m, and a bulk density of 0.1 to 0.7 g/cm.sup.Type: GrantFiled: December 14, 1993Date of Patent: January 31, 1995Assignee: Mitsubishi Petrochemical Co., Ltd.Inventors: Koji Yamamoto, Hajime Ikeno, Keiko Shichijo
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Patent number: 5262233Abstract: An agricultural film comprising a thermoplastic resin film containing an ethylene copolymer with a hindered amine in its side chain and having coated thereon an anti-fogging agent comprising an inorganic hydrophilic colloidal substance and a hydrophilic organic compound and an anti-fogging agricultural film comprising a thermoplastic resin film containing an ethylene copolymer with a hindered amine in its side chain and, if desired, further containing a hydrotalcite compound, with an anti-fogging agent coated on the inside surface thereof or incorporated therein. The agricultural films have excellent weather resistance, anti-fogging properties, heat-retaining properties, and transparency.Type: GrantFiled: February 19, 1992Date of Patent: November 16, 1993Assignee: Mitsubishi Petrochemical Co., Ltd.Inventors: Kiyomaro Sudo, Seiya Mori, Tadao Okada, Hajime Ikeno, Keiko Shichijo, Shunichi Ohnishi