Abstract: An adhesive for a semiconductor, the adhesive containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound having an acid group, in which an exothermic calorific value at 60 to 155° C. of a DSC curve obtained by differential scanning calorimetry in which the adhesive for a semiconductor is heated at a temperature increase rate of 10° C./min is 20 J/g or less, and a minimum melt viscosity of a viscosity curve obtained by shear viscosity measurement in which the adhesive for a semiconductor is heated at a temperature increase rate of 10° C./min is 2000 Pa·s or more.

Abstract: An adhesive composition contains a resin component, a thermal crosslinking agent, and a curing agent, in which the resin component contains a resin having a maleimide group. In a method for producing a semiconductor device having a plurality of connection units for connecting a semiconductor chip and a wiring circuit substrate to each other, or for connecting a plurality of semiconductor chips to each other, a first connection unit is electrically connected to a second connection unit, and at least a portion of the first and second connection units is sealed using the adhesive composition.

Abstract: An electronic control device capable of improving cooling performance by air cooling is provided. The electronic control device includes a circuit board 6 (board), a heat-generating component 7 (heating element) mounted on the circuit board 6, a heat dissipation material 12 (thermally conductive material) that is in contact with the heat-generating component 7 and conducts heat of the heat-generating component 7, a fin-integrated housing 3 (housing) that is in contact with the heat dissipation material 12 and covers the circuit board 6, and a cover 1 that covers the fin-integrated housing 3. The cover 1 has a hole (2) 8 and a hole (3) 9 as intake holes, and a hole (1) 2 as an exhaust hole. The hole (1) 2 is formed at a position close to the heat-generating component 7 relative to the hole (2) 8 and the hole (3) 9. The hole (2) 8 and the hole (3) 9 are formed at positions away from the heat-generating component 7 relative to the hole (1) 2.

Abstract: Disclosed is an adhesive composition containing a resin component, a thermal crosslinking agent, and a curing agent, in which the resin component includes a resin having a maleimide group.