Patents by Inventor Keiko Yasukawa

Keiko Yasukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Article and active energy ray-curable resin composition
    Patent number: 9718910
    Abstract: Provided is an article having high scratch resistance and satisfactory fingerprint wipeability. Disclosed is an article having a microrelief structure containing a cured product of a resin composition on the surface, in which the indentation elastic modulus (X) [MPa] and the creep deformation ratio (Y) [%] of the cured product satisfy the following formulas (1) and (2): 80?X?560??(1) Y?(0.00022X?0.01)×100??(2).
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: August 1, 2017
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Go Otani, Seiichiro Mori, Masashi Ikawa, Yusuke Nakai, Keiko Yasukawa, Shinji Makino
  • Article and Active Energy Ray-Curable Resin Composition
    Publication number: 20150166704
    Abstract: Provided is an article having high scratch resistance and satisfactory fingerprint wipeability. Disclosed is an article having a microrelief structure containing a cured product of a resin composition on the surface, in which the indentation elastic modulus (X) [MPa] and the creep deformation ratio (Y) [%] of the cured product satisfy the following formulas (1) and (2): 80?X?560??(1) Y?(0.00022X?0.01)×100??(2).
    Type: Application
    Filed: June 17, 2013
    Publication date: June 18, 2015
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Go Otani, Seiichiro Mori, Masashi Ikawa, Yusuke Nakai, Keiko Yasukawa, Shinji Makino