Patents by Inventor Keinosuke YAMAOKA

Keinosuke YAMAOKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240073657
    Abstract: A target object management system includes a first device attached to a target object and configured to transmit and receive data to and from an access point in a predetermined first communication range by a communication system of a LPWA, a second device attached to the target object and configured to transmit and receive data to and from a predetermined terminal in a second communication range narrower than the first communication range of the first device by a communication system different from the LPWA, and a management server configured to detect a position of the target object from a first installation position at which the access point is installed and a second installation position at which the terminal is installed. The management server is configured to manage first identification information for identifying the first device and second identification information for identifying the second device in association with each other.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Applicant: TOPPAN INC.
    Inventors: Keinosuke YAMAOKA, Takamitsu NAKABAYASHI
  • Patent number: 10878304
    Abstract: A sticker with IC tag comprises: an antenna portion; and an IC chip coupled to the antenna portion and having a function of communicating through the antenna portion. The sticker with IC tag is installed on a covered container. The sticker with IC tag comprises a single-stroke line portion, which is coupled to the IC chip and adhered to an upper surface of a cover portion of the covered container. The IC chip detects disconnection of the single-stroke line portion.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: December 29, 2020
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke Yamaoka, Takamitsu Nakabayashi
  • Patent number: 10534993
    Abstract: A cap seal includes a cylindrical member covering a side face of the container, and a top face including an IC tag and connected to a first end that is one of two axial ends of the cylindrical member to close the cylindrical member at the first end. The cylindrical member includes a metal portion disposed on the side face of the container, and at least one insulating portion extending from the first end. The cylindrical member forms a closed annular shape in a circumferential direction of the cylindrical member, and the metal portion and the insulating portion are joined to each other.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: January 14, 2020
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Kenji Shinohara, Takamitsu Nakabayashi, Keinosuke Yamaoka
  • Patent number: 10489699
    Abstract: A sticker with IC tag and an installation method thereof. The sticker with IC tag comprises: an antenna portion; and an IC chip coupled to the antenna portion and having a function of communicating through the antenna portion. The sticker with IC tag is installed on a covered container. The sticker with IC tag further comprises a disconnection detection portion, which is constituted by a ring conductor. The disconnection detection portion is installed so as to stretch across both a cover portion and a container body of the covered container. The IC chip is connected to the disconnection detection portion and has a function of detecting on and off of the disconnection detection portion.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: November 26, 2019
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke Yamaoka, Takamitsu Nakabayashi
  • Patent number: 10467519
    Abstract: An IC tag label includes: an IC chip; a communication antenna element having a first end and a second end, the first end being electrically connected to the IC chip, the communication antenna element including a planar coil extending on a first surface and having a shape suitable for positioning on a bottle mouth; and a bridge wiring including a wiring element which is located in an opposed region on a second surface which is opposed to the first surface, the bridge wiring electrically connecting the second end to the IC chip. The communication antenna element has an air core section which includes a center of the planar coil, and the wiring element is a single wire including a plurality of bent sections and having a folded line shape which traverses the air core section a plurality of times in plan view perpendicular to the first surface.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: November 5, 2019
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke Yamaoka, Takamitsu Nakabayashi, Shosei Asaka
  • Patent number: 10435215
    Abstract: A metal decorative product has a metallic luster decoration coated packaging on at least one side of a substrate and encloses a part disposed with electromagnetic wave device. The metallic luster decoration coated packaging is formed by coating an ink mixed with metal powder. In the metallic luster decoration coated packaging, the ink is used to make the metal powder and metal powder connection formed by the metal powder insulated and independent from each other.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: October 8, 2019
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke Yamaoka, Takamitsu Nakabayashi, Rena Kudo
  • Publication number: 20190236429
    Abstract: A cap seal includes a cylindrical member covering a side face of the container, and a top face including an IC tag and connected to a first end that is one of two axial ends of the cylindrical member to close the cylindrical member at the first end. The cylindrical member includes a metal portion disposed on the side face of the container, and at least one insulating portion extending from the first end. The cylindrical member forms a closed annular shape in a circumferential direction of the cylindrical member, and the metal portion and the insulating portion are joined to each other.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Kenji SHINOHARA, Takamitsu NAKABAYASHI, Keinosuke YAMAOKA
  • Publication number: 20190236430
    Abstract: An IC tag label includes: an IC chip; a communication antenna element having a first end and a second end, the first end being electrically connected to the IC chip, the communication antenna element including a planar coil extending on a first surface and having a shape suitable for positioning on a bottle mouth; and a bridge wiring including a wiring element which is located in an opposed region on a second surface which is opposed to the first surface, the bridge wiring electrically connecting the second end to the IC chip. The communication antenna element has an air core section which includes a center of the planar coil, and the wiring element is a single wire including a plurality of bent sections and having a folded line shape which traverses the air core section a plurality of times in plan view perpendicular to the first surface.
    Type: Application
    Filed: April 9, 2019
    Publication date: August 1, 2019
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke YAMAOKA, Takamitsu NAKABAYASHI, Shosei ASAKA
  • Publication number: 20180201422
    Abstract: A metal decorative product has a metallic luster decoration coated packaging on at least one side of a substrate and encloses a part disposed with electromagnetic wave device. The metallic luster decoration coated packaging is formed by coating an ink mixed with metal powder. In the metallic luster decoration coated packaging, the ink is used to make the metal powder and metal powder connection formed by the metal powder insulated and independent from each other.
    Type: Application
    Filed: March 14, 2018
    Publication date: July 19, 2018
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke YAMAOKA, Takamitsu NAKABAYASHI, Rena KUDO
  • Publication number: 20180197065
    Abstract: A sticker with IC tag and an installation method thereof. The sticker with IC tag comprises: an antenna portion; and an IC chip coupled to the antenna portion and having a function of communicating through the antenna portion. The sticker with IC tag is installed on a covered container. The sticker with IC tag further comprises a disconnection detection portion, which is constituted by a ring conductor. The disconnection detection portion is installed so as to stretch across both a cover portion and a container body of the covered container. The IC chip is connected to the disconnection detection portion and has a function of detecting on and off of the disconnection detection portion.
    Type: Application
    Filed: March 7, 2018
    Publication date: July 12, 2018
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke YAMAOKA, Takamitsu NAKABAYASHI
  • Publication number: 20180197060
    Abstract: A sticker with IC tag comprises: an antenna portion; and an IC chip coupled to the antenna portion and having a function of communicating through the antenna portion. The sticker with IC tag is installed on a covered container. The sticker with IC tag comprises a single-stroke line portion, which is coupled to the IC chip and adhered to an upper surface of a cover portion of the covered container. The IC chip detects disconnection of the single-stroke line portion.
    Type: Application
    Filed: March 6, 2018
    Publication date: July 12, 2018
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke YAMAOKA, Takamitsu NAKABAYASHI
  • Patent number: 9443184
    Abstract: A sealing key includes a container and an IC tag component fixed inside the container. The container has a shape that includes a body part and an insertion part that protrudes from the body part. The IC tag component includes a base, an IC chip mounted on the base, and a circuit pattern formed on the base. The circuit pattern includes an antenna structure that is connected to the IC chip to enable the IC chip to perform non-contact communication in. A method for manufacturing the sealing key includes: arranging in a mold a support part that configures a portion of the container; arranging the IC tag component on the support part such that the circuit pattern is positioned being extended across a boundary between the insertion part and the body part; and pouring a resin into the mold to thereby form a resin seal part that configures a portion of the container and seals the IC tag component, such that the resin seal part is joined with the support part.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: September 13, 2016
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke Yamaoka, Takamitsu Nakabayashi
  • Publication number: 20160012328
    Abstract: A sealing key includes a container and an IC tag component fixed inside the container. The container has a shape that includes a body part and an insertion part that protrudes from the body part. The IC tag component includes a base, an IC chip mounted on the base, and a circuit pattern formed on the base. The circuit pattern includes an antenna structure that is connected to the IC chip to enable the IC chip to perform non-contact communication in. A method for manufacturing the sealing key includes: arranging in a mold a support part that configures a portion of the container; arranging the IC tag component on the support part such that the circuit pattern is positioned being extended across a boundary between the insertion part and the body part; and pouring a resin into the mold to thereby form a resin seal part that configures a portion of the container and seals the IC tag component, such that the resin seal part is joined with the support part.
    Type: Application
    Filed: September 18, 2015
    Publication date: January 14, 2016
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Keinosuke YAMAOKA, Takamitsu NAKABAYASHI