Abstract: A board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in the model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) have one end(s) and are brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) are brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42). Each support pin is held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin (42), held in the direction substantially perpendicular to the surface of the support table (27), is brought into contact with the bottom face of the circuit board (14), and thereby, the support pins support the circuit board (14).

Abstract: The present invention provides a board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) having one end(s) brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42) is or are held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin(s) (42) held in the direction substantially perpendicular to the surface of the support table (27) is or are brought into contact with the bottom face of the circuit board (14); thus, the support pin(s) (42) support(s) the circuit board (14).

Abstract: A method of and apparatus for feeding electronic components are provided in which a group of electronic components joined to each other and stored in a stick are separated from each other before being supplied, regardless of the configuration at the joining ends of the electronic components as well as the presence of burrs developed during a molding process of the electronic components. In particular, a separating unit (6) comprises a step (20) which is dropped in level at the front end of a tilted chute (4) for receiving the forefront electronic component (2) and an arm (22) for holding down the succeeding electronic component (2) from above and causing the same to move backward along the tilted chute (4).

Abstract: In an electronic component transfer method and apparatus, an electronic component is placed on a suctional top surface of a suction nozzle brought into a protruded posture relative to a component fixing block while the electronic component is drawn by suction by a transfer nozzle which is movable up and down, the electronic component placed on the component fixing block is pressed from above with the transfer nozzle so that the electronic component is sandwiched between the transfer nozzle and the suction nozzle, a position of the suction nozzle is fixed by the suction nozzle fixing stopper, and, in this state, the electronic component is held on the component fixing block by the holding members.