Patents by Inventor Keishi Oku

Keishi Oku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer, socket, socket assembly, and wiring board assembly
    Patent number: 11327093
    Abstract: The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: May 10, 2022
    Assignee: ADVANTEST Corporation
    Inventors: Takashi Kawashima, Akihiko Ito, Keishi Oku, Natsuki Shiota
  • Load board and electronic component testing apparatus
    Patent number: 10942218
    Abstract: A load board to which a socket is mounted is electrically connected to a tester. The load board includes a first optical communication unit capable of transmitting and/or receiving signals by optical wireless communication with an electronic component handling apparatus that presses a DUT against the socket.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 9, 2021
    Assignee: ADVANTEST Corporation
    Inventors: Takashi Hashimoto, Keishi Oku, Hiroaki Takeuchi, Takatoshi Yoshino
  • INTERPOSER, SOCKET, SOCKET ASSEMBLY, AND WIRING BOARD ASSEMBLY
    Publication number: 20200300890
    Abstract: The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.
    Type: Application
    Filed: January 15, 2020
    Publication date: September 24, 2020
    Applicant: ADVANTEST Corporation
    Inventors: Takashi Kawashima, Akihiko Ito, Keishi Oku, Natsuki Shiota
  • LOAD BOARD AND ELECTRONIC COMPONENT TESTING APPARATUS
    Publication number: 20200033402
    Abstract: A load board to which a socket is mounted is electrically connected to a tester. The load board includes a first optical communication unit capable of transmitting and/or receiving signals by optical wireless communication with an electronic component handling apparatus that presses a DUT against the socket.
    Type: Application
    Filed: March 12, 2019
    Publication date: January 30, 2020
    Applicant: ADVANTEST Corporation
    Inventors: Takashi Hashimoto, Keishi Oku, Hiroaki Takeuchi, Takatoshi Yoshino