Abstract: In an electronic component chip holder comprising a body of elastomer having a plurality of through holes which are so sized as to receive a plurality of electronic component chips one by one respectively and to hold the respective electronic component chips received therein, films of a metal, for example, providing higher slidability than elastomer are formed at least on inner peripheral surfaces of the through holes. Due to such metal films, a pressure for inserting the electronic component chips in the through holes can be reduced to inhibit the electronic component chips from chipping and cracking, whereby it is possible to improve rubber hardness of the elastomer so that the electronic component chip holder can be directed to a purpose requiring heat resistance with no problem.

Abstract: A chip electronic device wherein an electronic element such as an inductor and capacitor, and terminals are covered with a resin housing. Plated lower surfaces and edges of the terminals show on a bottom and sides of a housing respectively. The lower surfaces of the terminals are soldered onto conductive patterns of a printed wiring board, and fillets of solder are formed at the edges of the terminals.