Abstract: To improve a performance of an electronic device. A substrate structure (electronic device) includes a terminal formed on a wiring layer, an insulating layer covering the wiring layer, and a bump electrode electrically connected to the terminal. The insulating layer includes an opening penetrating the insulating layer in a thickness direction. The terminal has an exposed surface exposed from the insulating layer in the opening. In plan view of the terminal viewed from above, at least one of the insulating layer, the bump electrode, and the terminal has a shape capable of identifying presence or absence the bump electrode.

Abstract: According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface, pressing the sapphire substrate toward the circuit board with the pressure jig, to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate.

Abstract: An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.

Abstract: According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

Abstract: An anisotropic conductive film in which conductive particles are dispersed in a resin includes a first region having a first pattern in which the conductive particles are discretely arranged, and a second region having a first shape by aggregating the conductive particles. Further, a display device includes a substrate provided with a plurality of electrodes arranged in a first pattern, the anisotropic conductive film, and a plurality of light emitting diodes. The plurality of light emitting diodes is electrically connected to the plurality of electrodes through the conductive particles in the first region.

Abstract: A display device includes a first substrate having a first surface and a plurality of LED elements mounted on the first surface of the first substrate. Each of the plurality of LED elements includes a main body portion having a second surface facing the first surface of the first substrate and a third surface on a side opposite to the second surface, an anode electrode and a cathode electrode provided on the second surface of the main body portion, and an organic film bonded to the third surface of the main body portion. The organic film has a fourth surface facing and bonded to the third surface and a fifth surface on a side opposite to the fourth surface. The fifth surface of the organic film has a plurality of depressions.

Abstract: A technique for more appropriately adjusting a temperature of an electronic apparatus is provided. Temperatures of a panel substrate are detected in a plurality of measurement regions set in the panel substrate, and temperatures in a plurality of adjustment regions set in the panel substrate are individually adjusted in accordance with the temperatures of the panel substrate detected in the plurality of measurement regions.

Abstract: A display device includes a substrate having a first main surface on which a plurality of light emitting elements spaced apart from each other are provided and a second main surface located on a side opposite to the first main surface, a cooling unit having a third main surface and a fourth main surface located on a side opposite to the third main surface, a heat dissipation sheet located between the second main surface and the third main surface and in contact with the second main surface and the third main surface, and a connection portion arranged at a position sandwiching the heat dissipation sheet in a direction along the second main surface and bonded to each of the substrate and the cooling unit, and the connection portion is made of a heat shrinkable resin.

Abstract: Performance of an electronic component including a plurality of elements is improved. A transfer substrate includes: a support substrate; an adhesive resin layer continuously provided on one surface of the support substrate and having a plurality of holding regions adhesively holding elements; and a coating film provided on a surface of the adhesive resin layer opposite to the support substrate to cover an outer region of the holding region of the adhesive resin layer and having lower surface adhesiveness than surface adhesiveness of the adhesive resin layer.

Abstract: According to one embodiment, a display device includes a substrate, a plurality of pixels, a resin layer and a common electrode. The pixels include a plurality of light emitting elements arranged on the substrate and having luminous colors different from each other, respectively. The resin layer is buried in a clearance part between the plurality of light emitting elements provided in each of the pixels. The common electrode is formed of a transparent conductive material covering the resin layer. The resin layer is provided in an island-like shape in each of the pixels.

Abstract: According to one embodiment, a lighting-emitting element includes a light-emitting portion, a first terminal electrode and a second terminal electrode. The first terminal electrode includes a first cavity portion at a position overlapping a first connection electrode in planar view when the first terminal electrode is brought into contact with the first connection electrode. The second terminal electrode includes a second cavity portion at a position overlapping a second connection electrode in planar view when the second terminal electrode is brought into contact with the second connection electrode.

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

Abstract: A display device capable of providing a high production efficiency LED display including: a wiring electrically connected to a transistor of a pixel circuit, a layer including a top surface of the wiring being formed of a first material; a connecting electrode electrically connected to the wiring, a layer including a top surface of the connecting electrode being formed of a second material; and an LED element mounted on the connecting electrode, wherein an absorption rate of the first material with respect to infrared radiation is smaller than an absorption rate of the second material with respect to infrared radiation.

Abstract: Performance of an electronic device is improved. A substrate for transfer includes a substrate having a surface and made of a visible light transmitting material, and an elastic deformation portion fixed on the surface of the substrate, transmitting visible light, and made of an elastically deformable material. The elastic deformation portion includes a plurality of element holding portions, and a plurality of protrusions arranged at positions not overlapping with the plurality of element holding portions, and protruding higher than the plurality of element holding portions when the surface of the substrate is a reference plane.

Abstract: Disclosed is a manufacturing method of a display device including: transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate; arranging a plurality of spacers configured to be elastically deformed over a substrate over which a pixel including a plurality of sub-pixels is arranged; and transforming the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate. The manufacturing method may further include removing the plurality of spacers.

Abstract: A method for manufacturing a display device includes preparing a circuit board including a drive circuit for driving a LED chip, forming a connecting electrode on the circuit board, forming an adhesive layer on the connecting electrode, adhering a terminal electrode of the LED chip on the adhesive layer and joining the connecting electrode and the terminal electrode by irradiating a laser light. The adhesive layer may be formed only on a upper surface of the connecting electrode.

Abstract: A display device includes a substrate, a first electrode and a second electrode on the substrate, and an LED chip disposed on the first electrode and the second electrode and having an n-side pad electrode and a p-side pad electrode. The n-side pad electrode has a first protruding portion, the first protruding portion protruding toward the substrate and in contact with the first electrode, and the p-side pad electrode has a second protruding portion, the second protruding portion protruding toward the substrate and in contact with the second electrode.

Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.