Patents by Inventor Keisuke Eiki

Keisuke Eiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6726793
    Abstract: The present invention provides a thermal transfer sheet, a thermal transfer method and a thermal transfer system using said thermal transfer sheet. The thermal transfer sheet provided with a coloring layer disposed on the substrate, wherein the coloring layer is formed of a mixture comprising a copolymerization product (A) obtainable by polymerizing an &agr;-olefin/a maleic acid anhydride copolymer with a maleic acid anhydride monoester and an ethylene/vinyl acetate copolymer (B). The thermal transfer sheet is superior in storage stability in a coiled state, anti-background soiling property and the adaptability to high-speed printing, and also capable of forming a print products having excellent functions as to durability such as wear resistance and heat resistance.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: April 27, 2004
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Keisuke Eiki
  • Publication number: 20020119282
    Abstract: The present invention provides a thermal transfer sheet, a thermal transfer method and a thermal transfer system using said thermal transfer sheet. The thermal transfer sheet provided with a coloring layer disposed on the substrate, wherein the coloring layer is formed of a mixture comprising a copolymerization product (A) obtainable by polymerizing an &agr;-olefin/a maleic acid anhydride copolymer with a maleic acid anhydride monoester and an ethylene/vinyl acetate copolymer (B). The thermal transfer sheet is superior in storage stability in a coiled state, anti-background soiling property and the adaptability to high-speed printing, and also capable of forming a print products having excellent functions as to durability such as wear resistance and heat resistance.
    Type: Application
    Filed: November 13, 2001
    Publication date: August 29, 2002
    Inventor: Keisuke Eiki