Patents by Inventor Keisuke Enomoto

Keisuke Enomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210130654
    Abstract: A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan ?) at 11 Hz in a range of ?50 to ?20° C. of 3×10?2 or more.
    Type: Application
    Filed: April 12, 2019
    Publication date: May 6, 2021
    Applicant: KURARAY CO., LTD.
    Inventors: Keisuke ENOMOTO, Kazuki IISHIBA, Satoru AKIHO, Daisuke KONISHI
  • Publication number: 20190136092
    Abstract: The present disclosure is a layered product (20) comprising a base layer (10) and a pressure sensitive adhesive layer (11), which is in contact with the base layer (10). The base layer (10) comprises a (meth)acrylic resin (M), an acrylonitrile-butadiene-styrene resin, or a polyester resin. The pressure sensitive adhesive layer (11) contains a block copolymer (A) containing an aromatic vinyl compound polymer block (S) and a conjugated diene compound polymer block (D). The aromatic vinyl compound polymer block (S) forms a membrane structure phase (17) along the interface (12) between the base layer (10) and the pressure sensitive adhesive layer (11).
    Type: Application
    Filed: May 17, 2017
    Publication date: May 9, 2019
    Applicant: KURARAY CO., LTD.
    Inventors: Kirihiro NAKANO, Keisuke ENOMOTO, Ryota HASHIMOTO, Yoshirou KOUDOU, Yoshiki MUKOO, Hiromitsu SASAKI
  • Patent number: 9865965
    Abstract: The present invention provides a waterproof structure for a terminal of a wire with a terminal fitting provided with a waterproof block made of resin, the waterproof block covering an end portion of an insulation coated wire which is coupled to a terminal fitting. The waterproof block includes a waterproof portion covering a coupling portion coupling the end portion of the wire and the terminal fitting, the waterproof portion adhering to an outer circumferential surface of an end of an outer skin of the wire, and a cylindrical portion projecting cylindrically from the waterproof portion along the outer skin of the wire. The cylindrical portion has a smaller cross sectional area than the waterproof portion and has rigidity more similar to the outer skin than the waterproof portion in desired bending and torsional directions of the wire and is adhered to an end-adjacent outer circumferential surface of the outer skin.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 9, 2018
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Keisuke Enomoto, Kenichi Inokoshi, Atsushi Ishikawa
  • Publication number: 20170271811
    Abstract: The present invention provides a waterproof structure for a terminal of a wire with a terminal fitting provided with a waterproof block made of resin, the waterproof block covering an end portion of an insulation coated wire which is coupled to a terminal fitting. The waterproof block includes a waterproof portion covering a coupling portion coupling the end portion of the wire and the terminal fitting, the waterproof portion adhering to an outer circumferential surface of an end of an outer skin of the wire, and a cylindrical portion projecting cylindrically from the waterproof portion along the outer skin of the wire. The cylindrical portion has a smaller cross sectional area than the waterproof portion and has rigidity more similar to the outer skin than the waterproof portion in desired bending and torsional directions of the wire and is adhered to an end-adjacent outer circumferential surface of the outer skin.
    Type: Application
    Filed: December 2, 2015
    Publication date: September 21, 2017
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Keisuke ENOMOTO, Kenichi INOKOSHI, Atsushi ISHIKAWA
  • Patent number: 4056661
    Abstract: The pigment layer side of a base sheet having a layer of tacky adhesive on one side and a layer of pigment and a binder therefor on the opposed side is coated with a silicon composition. The coarse surface texture of the pigment layer contributes to the formation of a discontinuous silicon composition layer. The discontinuities in the silicon layer enable the side of the base sheet associated therewith to be printable and strippable with respect to the tacky adhesive.
    Type: Grant
    Filed: July 15, 1976
    Date of Patent: November 1, 1977
    Assignee: Kabushiki Kaisha Sato
    Inventors: Yo Sato, Keisuke Enomoto
  • Patent number: D759595
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: June 21, 2016
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Keisuke Enomoto, Kenichi Inokoshi, Hisayoshi Yaita, Keisuke Yoshida, Atsushi Sakatani