Patents by Inventor Keisuke Fukaya

Keisuke Fukaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210163856
    Abstract: The purpose of the present invention is to provide a cleaning liquid composition useful in cleaning substrates, etc., which have undergone treatment such as chemical mechanical polishing (CMP) in a process for manufacturing electronic devices such as semiconductor elements. This cleaning liquid composition for cleaning substrates having Cu wiring includes one or more basic compounds and one or more heteromonocyclic aromatic compounds containing a nitrogen atom, and has a hydrogen ion concentration (pH) of 8-11.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 3, 2021
    Applicant: Kanto Kagaku Kabushiki Kaisha
    Inventors: Kikue Morita, Chiyoko Horike, Keisuke Fukaya, Takuo Ohwada
  • Publication number: 20160083675
    Abstract: The purpose of the present invention is to provide a cleaning liquid composition useful in cleaning substrates, etc., which have undergone treatment such as chemical mechanical polishing (CMP) in a process for manufacturing electronic devices such as semiconductor elements. This cleaning liquid composition for cleaning substrates having Cu wiring includes one or more basic compounds and one or more heteromonocyclic aromatic compounds containing a nitrogen atom, and has a hydrogen ion concentration (pH) of 8-11.
    Type: Application
    Filed: April 7, 2014
    Publication date: March 24, 2016
    Applicant: Kanto Kagaku Kabushiki Kaisha
    Inventors: Kikue Morita, Chiyoko Horike, Keisuke Fukaya, Takuo Ohwada