Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: An LED drive method drives an LED by a drive current. The LED drive method uses a voltage conversion unit, which includes a coil and a first switch, and converts an external voltage into a first voltage, which is a DC voltage, by controlling the first switch to be on in an on-pulse period of a first drive signal. A constant current drive unit is provided with the first voltage and generates a drive current based on a second drive signal.

Abstract: An LED lighting device 2 according to this embodiment includes a lighting circuit that supplies a current to an LED, and a dimmer 7 that generates a PWM signal for controlling the supply of the current to the LED from the lighting circuit, in which the dimmer 7 feedback-controls the PWM signal that controls the supply of the current to the LED by comparing the output current to be output to the LED with a target current and feedforward-controls the PWM signal according to a fluctuation of an input voltage from a commercial power supply 1.

Abstract: A semiconductor device configured to perform an A/D conversion of a wide range of signals is provided. A semiconductor device includes: an input voltage detection unit configured to detect an analog input voltage; a reference voltage setting unit configured to set a reference voltage based on the detected input voltage; an amplifier configured to amplify a difference between the input voltage and the reference voltage; an ADC configured to perform an A/D conversion of an amplified signal; and an arithmetic processing unit configured to calculate a digital voltage corresponding to the input voltage based on a result of the A/D conversion and the reference voltage.

Abstract: A semiconductor device configured to perform an A/D conversion of a wide range of signals is provided. A semiconductor device includes: an input voltage detection unit configured to detect an analog input voltage; a reference voltage setting unit configured to set a reference voltage based on the detected input voltage; an amplifier configured to amplify a difference between the input voltage and the reference voltage; an ADC configured to perform an A/D conversion of an amplified signal; and an arithmetic processing unit configured to calculate a digital voltage corresponding to the input voltage based on a result of the A/D conversion and the reference voltage.

Abstract: An LED drive method drives an LED by a drive current. The LED drive method uses a voltage conversion unit, which includes a coil and a first switch, and converts an external voltage into a first voltage, which is a DC voltage, by controlling the first switch to be on in an on-pulse period of a first drive signal. A constant current drive unit is provided with the first voltage and generates a drive current based on a second drive signal.

Abstract: A voltage conversion unit including a coil and a first switch converts an AC voltage into a first voltage, which is a DC voltage, by controlling the first switch to be on in an on-pulse period of a first drive signal. A constant current drive unit is supplied with the first voltage and generates a drive current Id having a current value according to light control information. An LED control unit compares brightness based on the light control information and reference brightness, generates a first drive signal based on an error between the first voltage and a target voltage representing a target of the first voltage, when the brightness is higher than the reference brightness, and generates the first drive signal having a predetermined fixed on-pulse period when the brightness is lower than the reference brightness.

Abstract: An LED lighting device 2 according to this embodiment includes a lighting circuit that supplies a current to an LED, and a dimmer 7 that generates a PWM signal for controlling the supply of the current to the LED from the lighting circuit, in which the dimmer 7 feedback-controls the PWM signal that controls the supply of the current to the LED by comparing the output current to be output to the LED with a target current and feedforward-controls the PWM signal according to a fluctuation of an input voltage from a commercial power supply 1.

Abstract: Methods and systems therefrom for improved learning via electrophysiological assessment of learning are provided. The method includes generating, during a first time period, at least one sensory stimulus for a learner, collecting, during a second time period after the first time period, first electroencephalogram (EEG) signals for at least one first electrode site and second EEG signals for at least one second electrode site, calculating a first characterization value based on the first EEG signals and a second characterization value based on the second EEG signals, determining whether the first characterization value and the second characterization value fail to meet respective first and second conditions, and, in response to determining that the first characterization value and the second characterization value fail to meet the respective first and second conditions, regenerating the at least one sensory stimulus for the user.

Abstract: Reduction of flicker when an LED is in a low brightness state and reduction of size of an LED drive device are realized. A voltage conversion unit includes a coil and a first switch and converts an AC voltage into a first voltage which is a DC voltage by controlling the first switch to be on in an on-pulse period of a first drive signal. The constant current drive unit is supplied with the first voltage and generates a drive current Id having a current value according to light control information. An LED control unit compares brightness based on the light control information and reference brightness, generates a first drive signal based on an error between the first voltage and a target voltage representing a target of the first voltage when the brightness is higher than the reference brightness, and generates the first drive signal having a predetermined fixed on-pulse period when the brightness is lower than the reference brightness.

Abstract: A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Abstract: A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Abstract: A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Abstract: A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Abstract: A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Abstract: A two-part curing high-durable polyurethane elastomer composition having excellent heat resistance and wet heat resistance, and excellent workability such that a viscosity after two-part mixing is suitable for casting workability which comprises (i) a polyisocyanate component, and (ii) an active hydrogen-containing compound comprising (A) a polyol having a hydroxyl value of from 25 to 55 obtained by reacting a castor oil fatty acid, 12-hydroxystearic acid, or a condensate of their fatty acids, with a polyol (X) having a molecular weight of from 400 to 1,500, and (B) a polyol having a hydroxyl value of from 100 to 500 obtained by ring opening an epoxidized fatty acid ester with a polyhydric alcohol.

Abstract: A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.

Abstract: A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Abstract: A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.