Patents by Inventor Keisuke Furo

Keisuke Furo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11313005
    Abstract: The seamless steel pipe of the present embodiment consists of in mass %, C: 0.21 to 0.35%, Si: 0.10 to 0.50%, Mn: 0.05 to 1.00%, P: 0.025% or less, S: 0.010% or less, Al: 0.005 to 0.100%, N: 0.010% or less, Cr: 0.05 to 1.50%, Mo: 0.10 to 1.50%, Nb: 0.010 to 0.050%, B: 0.0003 to 0.0050%, and Ti: 0.002 to 0.050%, the balance being Fe and impurities. In a main body region of the seamless steel pipe, a grain size number of prior-austenite grain conforming to ASTM E112 is 7.0 or more, a difference between a maximum value and a minimum value of the grain size number is 1.0 or less, yield strength is 655 to less than 862 MPa, and a difference between a maximum value and a minimum value of tensile strength is 27.6 MPa or less.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: April 26, 2022
    Assignee: Nippon Steel Corporation
    Inventors: Atsushi Soma, Yuji Arai, Yosuke Tatebayashi, Keisuke Furo, Takenori Kuramoto, Hiroki Kamitani, Kouji Yamane
  • Publication number: 20190300979
    Abstract: The seamless steel pipe of the present embodiment consists of in mass %, C: 0.21 to 0.35%, Si: 0.10 to 0.50%, Mn: 0.05 to 1.00%, P: 0.025% or less, S: 0.010% or less, Al: 0.005 to 0.100%, N: 0.010% or less, Cr: 0.05 to 1.50%, Mo: 0.10 to 1.50%, Nb: 0.010 to 0.050%, B: 0.0003 to 0.0050%, and Ti: 0.002 to 0.050%, the balance being Fe and impurities. In a main body region of the seamless steel pipe, a grain size number of prior-austenite grain conforming to ASTM E112 is 7.0 or more, a difference between a maximum value and a minimum value of the grain size number is 1.0 or less, yield strength is 655 to less than 862 MPa, and a difference between a maximum value and a minimum value of tensile strength is 27.6 MPa or less.
    Type: Application
    Filed: May 18, 2017
    Publication date: October 3, 2019
    Inventors: Atsushi Soma, Yuji Arai, Yosuke Tatebayashi, Keisuke Furo, Takenori Kuramoto, Hiroki Kamitani, Kouji Yamane