Patents by Inventor Keisuke Hara
Keisuke Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11937024Abstract: A projection system includes a projection device that projects drawings individually onto a plurality of work spots in a work site. The projection device includes a driver that changes an orientation of the projection device. When drawings are individually projected onto a first work spot and a second work spot in a stated sequence, and the second work spot is outside a projection angle that is projectable by the projection device, the driver changes the orientation of the projection device to include the second work spot within the projection angle after work at the first work spot is finished. The first work spot and the second work spot are included in the plurality of work spots.Type: GrantFiled: January 23, 2020Date of Patent: March 19, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki Hayashi, Tetsuya Nishi, Keisuke Hara
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Publication number: 20230398484Abstract: [Problem] To improve a strength and productivity of a filter having a filtration member in a pleated shape. [Solution] A filter (40) includes a filtration member (41) having partitioned surfaces (43) that are partitioned by mountain-fold pleats (42) and valley-fold pleats (42), and end plates (48, 49) fixed to two end portions of the filtration member (41) and configured to maintain the filtration member (41) in a pleated shape. The filtration member (41) includes a plurality of filtration portions (45a, 45b, and 45c) and intermediate portions (46a, 46b) each provided between the adjacent filtration portions. In the filtration portions (45), an angle formed by the adjacent partitioned surfaces (43, 43) is greater than 0°, and in the intermediate portions (46a, 46b), an angle formed by the adjacent partitioned surfaces (43, 43) is 0°.Type: ApplicationFiled: October 26, 2021Publication date: December 14, 2023Applicant: Valeo Japan Co., Ltd.Inventors: Hiroshi Kobinata, Keisuke Hara, Ryosuke Kanamori, Hisayoshi Yoshizaki
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Patent number: 11812203Abstract: A projection system includes: a projection device that includes a laser scanner and projects one or more drawings individually onto work spots in a work site; and an adjustment unit configured to adjust at least one of (i) a quantity of the one or more drawings to be simultaneously projected by the projection device or (ii) a setting parameter regarding a mode of projection performed by the projection device.Type: GrantFiled: August 13, 2020Date of Patent: November 7, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Keisuke Hara, Tetsuya Nishi, Yuki Hayashi
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Patent number: 11803109Abstract: A projection method, which is executed by a projection device, for projecting drawing data for a building onto a projection plane of the building under construction includes: measuring a distance from each of three or more points which are not aligned in a straight line and are on either of two non-parallel straight lines on the projection plane to the projection device using a distance meter included in the projection device; and projecting the drawing data onto a projection position on the projection plane which is determined based on the distance measured and the angle of the distance meter at the time at which the distance is measured.Type: GrantFiled: August 4, 2020Date of Patent: October 31, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tetsuya Nishi, Yuki Hayashi, Keisuke Hara
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Publication number: 20230326748Abstract: A manufacturing method of a semiconductor device, includes: forming a gas vent recess in a first surface of a compound semiconductor substrate, which includes a plurality of device regions adjacent to the first surface, along an interface between the plurality of device regions; forming an altered layer inside the compound semiconductor substrate to extend along the first surface at a depth corresponding to a range of a depth of the gas vent recess by applying a laser beam; dividing the compound semiconductor substrate at the altered layer into a first part including the first surface and a second part including a second surface of the compound semiconductor substrate opposite to the first surface; and forming a metal film to cover a divided surface of the first part while exposing the gas vent recess.Type: ApplicationFiled: March 23, 2023Publication date: October 12, 2023Inventors: SHOSUKE NAKABAYASHI, MASATAKE NAGAYA, CHIAKI SASAOKA, SHOICHI ONDA, JUN KOJIMA, DAISUKE KAWAGUCHI, RYUJI SUGIURA, TOSHIKI YUI, KEISUKE HARA, TOMOMI ARATANI
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Publication number: 20230230829Abstract: A method of manufacturing a semiconductor element includes formation of a modified layer, detection of a first region, and cutting of a semiconductor wafer. In the formation of the modified layer, a laser is irradiated on the semiconductor wafer to form the modified layer extending along a surface of the semiconductor wafer inside the semiconductor wafer. The surface of the semiconductor wafer includes a peripheral portion having the first region and a second region. The first region is a region in which the modified layer is not located, and the second region is a region in which the modified layer is formed. In the cutting of the semiconductor wafer, the semiconductor wafer is cut at the modified layer starting from the second region.Type: ApplicationFiled: December 29, 2022Publication date: July 20, 2023Inventors: SHOSUKE NAKABAYASHI, JUNJI OHARA, MASATAKE NAGAYA, CHIAKI SASAOKA, SHOICHI ONDA, JUN KOJIMA, DAISUKE KAWAGUCHI, RYUJI SUGIURA, TOSHIKI YUI, KEISUKE HARA
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Publication number: 20230197442Abstract: A method of manufacturing a semiconductor device includes irradiation of laser on a semiconductor substrate and cutting of the semiconductor substrate. The laser is irradiated on the semiconductor substrate while moving a focal point of the laser inside the semiconductor substrate. The semiconductor includes a specific crystal plane that is easier to be cleaved, and that is tilted to the surface of the semiconductor substrate. The irradiation of the laser includes repetition of a specific modified layer formation process in which one of the specific modified layers along the specific crystal plane is formed by moving the focal point along the specific crystal plane. In the irradiation of the laser, the specific modified layers are arranged in a direction parallel to the surface of the semiconductor substrate. In the cutting of the semiconductor substrate, the semiconductor substrate is cut along the specific modified layers.Type: ApplicationFiled: December 5, 2022Publication date: June 22, 2023Inventors: TAKASHI USHIJIMA, MASATAKE NAGAYA, DAISUKE KAWAGUCHI, KEISUKE HARA
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Publication number: 20230116302Abstract: A semiconductor chip includes a chip-constituting substrate having one surface, the other surface opposite to the one surface, and two pairs of opposing side surfaces connecting the one surface and the other surface. The one surface and the other surface are along one of a {0001} c-plane, a {1-100} m-plane, and a {11-20} a-plane. One of the two pairs of opposing side surfaces is along another one of the {0001} c-plane, the {1-100} m-plane, and the {11-20} a-plane. The other of the two pairs of opposing side surfaces is along the other of the {0001} c-plane, the {1-100} m-plane, and the {11-20} a-plane. The side surface includes an altered layer containing gallium oxide and gallium metal in a surface layer portion in a depth direction which is a normal direction to the side surface.Type: ApplicationFiled: September 20, 2022Publication date: April 13, 2023Inventors: MASATAKE NAGAYA, Hiroki Watanabe, Junji Ohara, Daisuke Kawaguchi, Keisuke Hara, Chiaki Sasaoka, Jun Kojima, Shoichi Onda
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Publication number: 20230116208Abstract: A method of manufacturing a semiconductor device includes a trench forming step, a laser irradiation step and a peeling step. In the trench forming step, a trench is formed on a first main surface of a semiconductor substrate having a device structure formed thereon. In the laser irradiation step, a laser is irradiated from a second main surface of the semiconductor substrate to a plane surface that is positioned and extends at a predetermined depth of the semiconductor substrate. In the peeling step, a device layer is peeled off from the semiconductor substrate along the plane surface on which the laser is irradiated. The peeling step may be performed in a state in which the trenches are either unfilled or filled with a material having a lower coefficient of thermal expansion than the semiconductor substrate.Type: ApplicationFiled: October 6, 2022Publication date: April 13, 2023Inventors: TAKASHI USHIJIMA, KOZO KATO, YOSHITAKA NAGASATO, MASATAKE NAGAYA, SHINICHI HOSHI, DAISUKE KAWAGUCHI, KEISUKE HARA
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Publication number: 20220352027Abstract: A semiconductor chip includes a chip constituent substrate having a first surface and a second surface, and including a layer containing gallium nitride. The chip constituent substrate is provided with a semiconductor element, and components constituting the semiconductor element are located more in an area adjacent to the first surface than in an area adjacent to the second surface. The chip constituent substrate is formed with a through hole penetrating the chip constituent substrate from the first surface to the second surface. The through hole defines a first opening adjacent to the first surface and a second opening adjacent to the second surface, and the first opening is larger than the second opening.Type: ApplicationFiled: March 30, 2022Publication date: November 3, 2022Inventors: Shinichi Hoshi, Masatake Nagaya, Chiaki Sasaoka, Daisuke Kawaguchi, Keisuke Hara
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Publication number: 20220295024Abstract: A projection system includes: a projection device that includes a laser scanner and projects one or more drawings individually onto work spots in a work site; and an adjustment unit configured to adjust at least one of (i) a quantity of the one or more drawings to be simultaneously projected by the projection device or (ii) a setting parameter regarding a mode of projection performed by the projection device.Type: ApplicationFiled: August 13, 2020Publication date: September 15, 2022Inventors: Keisuke HARA, Tetsuya NISHI, Yuki HAYASHI
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Publication number: 20220276548Abstract: A projection method, which is executed by a projection device, for projecting drawing data for a building onto a projection plane of the building under construction includes: measuring a distance from each of three or more points which are not aligned in a straight line and are on either of two non-parallel straight lines on the projection plane to the projection device using a distance meter included in the projection device; and projecting the drawing data onto a projection position on the projection plane which is determined based on the distance measured and the angle of the distance meter at the time at which the distance is measured.Type: ApplicationFiled: August 4, 2020Publication date: September 1, 2022Inventors: Tetsuya NISHI, Yuki HAYASHI, Keisuke HARA
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Publication number: 20220260580Abstract: The present invention relates to a method for evaluating the state of cell differentiation during the process of inducing differentiation of human induced pluripotent stem cells (iPS cells) into retinal pigment epithelial cells. The present invention further relates to a method for evaluating the state of cell differentiation during the process of inducing differentiation of human embryonic stem cells (ES cells) into retinal pigment epithelial cells.Type: ApplicationFiled: July 19, 2019Publication date: August 18, 2022Applicants: TOKYO ELECTRON LIMITED, SHIMADZU CORPORATION, FOUNDATION FOR BIOMEDICAL RESEARCH AND INNOVATION AT KOBEInventors: Keisuke HARA, Shinichi GOMI, Tomohisa NAGATA, Kenichi KAGAWA, Yasuhiro OSHIMA, Takashi SUZUKI, Masatoshi TAKAHASHI, Takako YAMAMOTO, Shin KAWAMATA
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Publication number: 20220201259Abstract: A projection system includes a projection device that projects drawings individually onto a plurality of work spots in a work site. The projection device includes a driver that changes an orientation of the projection device. When drawings are individually projected onto a first work spot and a second work spot in a stated sequence, and the second work spot is outside a projection angle that is projectable by the projection device, the driver changes the orientation of the projection device to include the second work spot within the projection angle after work at the first work spot is finished. The first work spot and the second work spot are included in the plurality of work spots.Type: ApplicationFiled: January 23, 2020Publication date: June 23, 2022Inventors: Yuki HAYASHI, Tetsuya NISHI, Keisuke HARA
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Patent number: 11271789Abstract: The present invention is a transmission/reception method in which a reception device measures propagation path characteristics of a communication propagation path, a transmission device generates, based on a measurement result of the propagation path characteristics, a plurality of pseudo propagation path characteristics having propagation path characteristics similar to the propagation path characteristics so as to have low mutual correlation, the transmission device generates a data group including a plurality of parallel and independent data in the same number as the plurality of pseudo propagation path characteristics in a baseband on a transmitting side, obtains a transmission signal by synthesizing a plurality of superimposed data generated by superimposing the pseudo propagation path characteristics on the data one by one, and transmits a plurality of pseudo propagation path characteristic information relating to the plurality of pseudo propagation path characteristics and the transmission signal, andType: GrantFiled: June 18, 2019Date of Patent: March 8, 2022Inventors: Maria Takigawa, Keisuke Hara, Genichiro Ohta
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Publication number: 20210278413Abstract: Disclosed is a method for evaluating if there are genomic abnormalities in cells being tested, the cells being tested being pluripotent stem cells cultivated in a culture medium or cells resulting from the induced differentiation of pluripotent stem cells, the method including a step of measuring the amount of an indicator present in the culture supernatant of the test cells, and a step of evaluating, on the basis of the amount of the indicator present, if there are genomic abnormalities in the test cells, wherein the indicator is at least one selected from the group consisting of deoxycytidine, kynurenine, putrescine, alanine, cysteine, cystathionine, and threonic acid, and whether or not there are genomic abnormalities in the test cells is evaluated on the basis of the amount of the at least one indicator present.Type: ApplicationFiled: June 17, 2019Publication date: September 9, 2021Applicants: Shimadzu Corporation, Tokyo Electron LimitedInventors: Takashi SUZUKI, Kenichi TOYODA, Masatoshi TAKAHASHI, Keisuke HARA, Tomohisa NAGATA, Yasuhiro OSHIMA
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Publication number: 20210273839Abstract: The present invention is a transmission/reception method in which a reception device measures propagation path characteristics of a communication propagation path, a transmission device generates, based on a measurement result of the propagation path characteristics, a plurality of pseudo propagation path characteristics having propagation path characteristics similar to the propagation path characteristics so as to have low mutual correlation, the transmission device generates a data group including a plurality of parallel and independent data in the same number as the plurality of pseudo propagation path characteristics in a baseband on a transmitting side, obtains a transmission signal by synthesizing a plurality of superimposed data generated by superimposing the pseudo propagation path characteristics on the data one by one, and transmits a plurality of pseudo propagation path characteristic information relating to the plurality of pseudo propagation path characteristics and the transmission signal, andType: ApplicationFiled: June 18, 2019Publication date: September 2, 2021Inventors: Maria Takigawa, Keisuke Hara, Genichiro Ohta
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Patent number: 10694881Abstract: A heating cooker includes an inner pot (7) for accommodating therein a heating object to be heated, a heating cooker body (1) for accommodating the inner pot (7) therein, a heating part (10) attached to the heating cooker body (1) and serving for heating the heating object, a lid (2) which is openably/closably attached on top of the heating cooker body (1) and which can be closed so as to cover the inner pot (7), a rotator (11) rotatably placed between the heating cooker body (1) and the lid (2), stirrers (12A, 12B) which are attached to the rotator (11) and which are switchable between a stirring state of being in contact with the heating object set in the inner pot (7) and a non-stirring state of being apart from the heating object set in the inner pot (7), and a notification part (5) for notifying which the stirrers (12A, 12B) are in the stirring state or in the non-stirring state while the lid (2) is closed.Type: GrantFiled: February 14, 2013Date of Patent: June 30, 2020Assignee: SHARP KABUSHIKI KAISHAInventor: Keisuke Hara
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Publication number: 20190116725Abstract: A fertilization map creating system includes a growth sensor, a GPS device, and a growth information accumulating part that stores data, a fertilization map being created based on growth data and position data stored in the growth information accumulating part, and the growth information accumulating part storing the position data and the growth data while a tractor drives in a field. The system further includes a growth condition calculation part that obtains a growth condition of previously set each area in the field based on the data stored in the memory; a fertilization amount calculation part that obtains an amount of fertilization of each area based on the growth condition of each area; and a map creating part that creates the fertilization map showing the amount of fertilization of each area obtained by the fertilization calculation part.Type: ApplicationFiled: March 31, 2017Publication date: April 25, 2019Applicant: Topcon CorporationInventors: Issei HANYA, Shinkai SHU, Peng ZHAO, Shugo AKIYAMA, Hiroshi OKAMOTO, Keisuke HARA
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Publication number: 20150020694Abstract: A heating cooker includes an inner pot (7) for accommodating therein a heating object to be heated, a heating cooker body (1) for accommodating the inner pot (7) therein, a heating part (10) attached to the heating cooker body (1) and serving for heating the heating object, a lid (2) which is openably/closably attached on top of the heating cooker body (1) and which can be closed so as to cover the inner pot (7), a rotator (11) rotatably placed between the heating cooker body (1) and the lid (2), stirrers (12A, 12B) which are attached to the rotator (11) and which are switchable between a stirring state of being in contact with the heating object set in the inner pot (7) and a non-stirring state of being apart from the heating object set in the inner pot (7), and a notification part (5) for notifying which the stirrers (12A, 12B) are in the stirring state or in the non-stirring state while the lid (2) is closed.Type: ApplicationFiled: February 14, 2013Publication date: January 22, 2015Applicant: Sharp Kabushiki KaishaInventor: Keisuke Hara