Abstract: To provide an erosion characteristics database and a method for constructing the same, an erosion prediction method and an erosion prediction system using the database for predicting a widespread erosion amount of a fluid machine or the like in a short time without the need for an operation of a model machine or an actual machine.

Abstract: To provide an erosion characteristics database and a method for constructing the same, an erosion prediction method and an erosion prediction system using the database for predicting a widespread erosion amount of a fluid machine or the like in a short time without the need for an operation of a model machine or an actual machine.

Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.

Abstract: A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.

Abstract: A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.

Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.

Abstract: An object of the present invention is to provide a boundary element analytic method and a boundary element analytic program, which are capable of coping with the problem of diversity in symmetric property to be encountered when carrying out an analytic operation by taking advantage of the symmetric property of a subject to be analyzed, and thus providing an efficient analysis. Various types of data for the use in the boundary element analysis, which have been previously input at step S101, are stored at step S102. To carry out this operation, at least boundary element definition information for defining a boundary element in the subject to be analyzed and state quantity information in which boundary element identification information for identifying the defined boundary element is associated with the boundary element for each state quantity thereof.