Patents by Inventor Keisuke HIGASHITANI
Keisuke HIGASHITANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230343892Abstract: A method for manufacturing a light-emitting element includes: forming a semiconductor structure comprising a light-emitting layer on a first surface of a substrate, wherein the first surface comprising a plurality of protrusions and a second region; dividing the semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region of the substrate, wherein the second region is exposed from under the semiconductor structure in the exposed region; bonding a light-transmitting body to a second surface of the substrate that is opposite the first surface so as to form a bonded body, wherein the light-transmitting body comprises a fluorescer; forming a plurality of modified regions along the exposed region; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.Type: ApplicationFiled: June 28, 2023Publication date: October 26, 2023Applicant: NICHIA CORPORATIONInventors: Yoshiki INOUE, Shun KITAHAMA, Yoshiyuki AIHARA, Yoshiki MATSUSHITA, Keisuke HIGASHITANI
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Patent number: 11735686Abstract: A method for manufacturing a light-emitting element includes dividing a semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region, a first surface being exposed from under the semiconductor structure in the exposed region; etching protrusions formed in the exposed region; bonding a light-transmitting body to a second surface so as to form a bonded body; forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from the first surface side; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.Type: GrantFiled: December 7, 2020Date of Patent: August 22, 2023Assignee: NICHIA CORPORATIONInventors: Yoshiki Inoue, Shun Kitahama, Yoshiyuki Aihara, Yoshiki Matsushita, Keisuke Higashitani
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Patent number: 11101404Abstract: A method for manufacturing a semiconductor device includes: preparing a wafer including sapphire, the wafer having an upper surface that includes a first region and a second region, the second region surrounding the first region and located at a position at least 2 ?m higher or lower than the first region; and forming a semiconductor layer at the upper surface, the semiconductor layer including at least one layer that comprises AlzGa1?zN (0.03?z?0.15).Type: GrantFiled: March 14, 2019Date of Patent: August 24, 2021Assignee: NICHIA CORPORATIONInventors: Yoshinori Miyamoto, Tokutaro Okabe, Yuya Kagoshima, Keisuke Higashitani, Chiaki Ozaki
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Publication number: 20210193867Abstract: A method for manufacturing a light-emitting element includes dividing a semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region, a first surface being exposed from under the semiconductor structure in the exposed region; etching protrusions formed in the exposed region; bonding a light-transmitting body to a second surface so as to form a bonded body; forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from the first surface side; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.Type: ApplicationFiled: December 7, 2020Publication date: June 24, 2021Applicant: NICHIA CORPORATIONInventors: Yoshiki INOUE, Shun KITAHAMA, Yoshiyuki AIHARA, Yoshiki MATSUSHITA, Keisuke HIGASHITANI
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Patent number: 10461222Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.Type: GrantFiled: August 30, 2017Date of Patent: October 29, 2019Assignee: NICHIA CORPORATIONInventors: Makoto Abe, Keisuke Higashitani, Naoki Azuma, Akiyoshi Kinouchi
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Publication number: 20190296190Abstract: A method for manufacturing a semiconductor device includes: preparing a wafer including sapphire, the wafer having an upper surface that includes a first region and a second region, the second region surrounding the first region and located at a position at least 2 ?m higher or lower than the first region; and forming a semiconductor layer at the upper surface, the semiconductor layer including at least one layer that comprises AlzGa1-zN (0.03?z?0.15).Type: ApplicationFiled: March 14, 2019Publication date: September 26, 2019Applicant: NICHIA CORPORATIONInventors: Yoshinori MIYAMOTO, Tokutaro OKABE, Yuya KAGOSHIMA, Keisuke HIGASHITANI, Chiaki OZAKI
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Publication number: 20180062036Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.Type: ApplicationFiled: August 30, 2017Publication date: March 1, 2018Applicant: NICHIA CORPORATIONInventors: Makoto ABE, Keisuke HIGASHITANI, Naoki AZUMA, Akiyoshi KINOUCHI
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Patent number: 9773946Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.Type: GrantFiled: February 16, 2016Date of Patent: September 26, 2017Assignee: NICHIA CORPORATIONInventors: Makoto Abe, Keisuke Higashitani, Naoki Azuma, Akiyoshi Kinouchi
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Publication number: 20160240738Abstract: A light-emitting element includes: a sapphire substrate having a c-plane at a main surface thereof; and a semiconductor layer provided at the main surface side of the sapphire substrate. The sapphire substrate includes a first unit including a first region, a second region, and a third region, wherein, when viewed from the main surface side, the three regions together have a shape of a regular hexagon that is evenly divided into the three regions such that each region has a shape of a rhombus; and a plurality of second units disposed to be aligned with each side of the first unit, the second unit having mirror symmetry relative to the first unit. The first unit and the second units are arranged to make a space at the center of the unit.Type: ApplicationFiled: February 16, 2016Publication date: August 18, 2016Applicant: NICHIA CORPORATIONInventors: Makoto ABE, Keisuke HIGASHITANI, Naoki AZUMA, Akiyoshi KINOUCHI