Patents by Inventor Keisuke IKENO

Keisuke IKENO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10256209
    Abstract: A component-mounted resin substrate includes a thermoplastic resin substrate and an electronic component. The resin substrate includes a surface including a mounting land conductor and a reinforcing resin member. A bump of the electronic component is joined to the mounting land conductor by ultrasonic joining. The reinforcing resin member is in contact with a side surface of the mounting land conductor and has a height smaller than a height of the mounting land conductor.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: April 9, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Keisuke Ikeno, Kuniaki Yosui
  • Patent number: 10166747
    Abstract: A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: January 1, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Keisuke Ikeno, Shigeru Tago, Hirohumi Shinagawa, Kuniaki Yosui, Yuki Ito
  • Patent number: 10103092
    Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly and being in a floating state. When the element assembly is viewed from a normal direction that is normal to the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and when the element assembly is viewed from the normal direction, an area within a circle with a center on the m-th external electrode and with a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am with a radius of Dm smaller than the average Dave when viewed from the normal direction.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: October 16, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Keisuke Ikeno, Yuki Ito
  • Publication number: 20180211934
    Abstract: A component-mounted resin substrate includes a thermoplastic resin substrate and an electronic component. The resin substrate includes a surface including a mounting land conductor and a reinforcing resin member. A bump of the electronic component is joined to the mounting land conductor by ultrasonic joining. The reinforcing resin member is in contact with a side surface of the mounting land conductor and has a height smaller than a height of the mounting land conductor.
    Type: Application
    Filed: March 19, 2018
    Publication date: July 26, 2018
    Inventors: Keisuke IKENO, Kuniaki YOSUI
  • Publication number: 20180141321
    Abstract: A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.
    Type: Application
    Filed: January 18, 2018
    Publication date: May 24, 2018
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Keisuke IKENO, Shigeru TAGO, Hirohumi SHINAGAWA, Kuniaki YOSUI, Yuki ITO
  • Patent number: 9972567
    Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly in a floating state. When the element assembly is viewed from a normal direction of the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and an area within a circle having a center on the m-th external electrode and having a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am having a radius of Dm greater than the average Dave when viewed from the normal direction.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: May 15, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kuniaki Yosui, Keisuke Ikeno
  • Publication number: 20170338172
    Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly and being in a floating state. When the element assembly is viewed from a normal direction that is normal to the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and when the element assembly is viewed from the normal direction, an area within a circle with a center on the m-th external electrode and with a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am with a radius of Dm smaller than the average Dave when viewed from the normal direction.
    Type: Application
    Filed: August 10, 2017
    Publication date: November 23, 2017
    Inventors: Kuniaki YOSUI, Keisuke IKENO, Yuki ITO
  • Publication number: 20170271243
    Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly in a floating state. When the element assembly is viewed from a normal direction of the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and an area within a circle having a center on the m-th external electrode and having a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am having a radius of Dm greater than the average Dave when viewed from the normal direction.
    Type: Application
    Filed: June 8, 2017
    Publication date: September 21, 2017
    Inventors: Kuniaki YOSUI, Keisuke IKENO