Abstract: A flat, solid counter electrode is formed on an organic passivation film. Before forming an interlayer insulating film on the counter electrode, plasma ashing is performed. A surface of the organic passivation film is trimmed by the plasma ashing, forming an overhang. The plasma ashing not only trims a surface of the organic passivation film but also roughens a surface of the counter electrode. This increases a contact area between the interlayer insulating film and the organic passivation film or counter electrode, increasing the adhesiveness therebetween. Further, the plasma ashing eliminates the remainder of a resist on the counter electrode, increasing the adhesiveness of the interlayer insulating film.

Abstract: A flat, solid counter electrode is formed on an organic passivation film. Before forming an interlayer insulating film on the counter electrode, plasma ashing is performed. A surface of the organic passivation film is trimmed by the plasma ashing, forming an overhang. The plasma ashing not only trims a surface of the organic passivation film but also roughens a surface of the counter electrode. This increases a contact area between the interlayer insulating film and the organic passivation film or counter electrode, increasing the adhesiveness therebetween. Further, the plasma ashing eliminates the remainder of a resist on the counter electrode, increasing the adhesiveness of the interlayer insulating film.