Patents by Inventor Keisuke Iwashita

Keisuke Iwashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11989663
    Abstract: A non-transitory computer-readable recording medium stores therein a prediction program that causes a computer to execute a process including receiving input data to be predicted, generating a tree structure data based on a plurality of pieces of rule information each indicated by an association of a combination of attribute values of a plurality of attributes with a label according to a predetermined order condition for the plurality of attributes, the tree structure data being obtained by aggregating the plurality of pieces of rule information, the tree structure data including an attribute value as a branch, and determining a degree of contribution to make a determination result on a predetermined value of a predetermined attribute reach a predetermined label based on a likelihood of obtaining a value of the predetermined label as the determination result, when the attribute value of the predetermined attribute is determined to be the predetermined value.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 21, 2024
    Assignee: FUJITSU LIMITED
    Inventors: Takuya Takagi, Hiroaki Iwashita, Keisuke Goto, Kotaro Ohori
  • Patent number: 6749703
    Abstract: In order to weld a reinforcing tape piece formed of a synthetic resin to a separable bottom stop attachment portion of a slide fastener chain by ultrasonic heating over a core portion and a main tape portion in a fastener tape, a welding time and/or an amplitude which are/is suitable for welding the reinforcing tape piece to the core portion and the vicinity of the core portion, and a welding time and/or an amplitude which are/is suitable for welding the reinforcing tape piece to the main tape portion are preset respectively. The welding of the reinforcing tape piece to the core portion and the vicinity of the core portion and the welding of the reinforcing tape piece to the main tape portion are carried out in two stages in accordance with the welding time or the amplitude which is set.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: June 15, 2004
    Assignee: YKK Corporation
    Inventors: Keisuke Iwashita, Hideji Maeda, Satoshi Matsumura
  • Publication number: 20030121589
    Abstract: In order to weld a reinforcing tape piece formed of a synthetic resin to a separable bottom stop attachment portion of a slide fastener chain by ultrasonic heating over a core portion and a main tape portion in a fastener tape, a welding time and/or an amplitude which are/is suitable for welding the reinforcing tape piece to the core portion and the vicinity of the core portion, and a welding time and/or an amplitude which are/is suitable for welding the reinforcing tape piece to the main tape portion are preset respectively. The welding of the reinforcing tape piece to the core portion and the vicinity of the core portion and the welding of the reinforcing tape piece to the main tape portion are carried out in two stages in accordance with the welding time or the amplitude which is set.
    Type: Application
    Filed: November 20, 2002
    Publication date: July 3, 2003
    Applicant: YKK CORPORATION
    Inventors: Keisuke Iwashita, Hideji Maeda, Satoshi Matsumura
  • Patent number: 6544364
    Abstract: With the ultrasonic adhering method and apparatus, ultrasonic adhesion can be made appropriately, regardless of external environments and a simple structure. The apparatus includes an ultrasonic oscillator for generating ultrasonic vibration, a horn provided in this ultrasonic oscillator for oscillating ultrasonically, and a temperature sensor for sensing the temperature of the horn. A controlling unit is provided for detecting the temperature of the horn and controlling oscillation time of the ultrasonic oscillator in a state of the horn being contact with an object to be adhered in such a manner that the oscillation time has a negative correlation with respect to the temperature of the horn.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: April 8, 2003
    Assignee: YKK Corporation
    Inventors: Hideji Maeda, Keisuke Iwashita, Satoshi Matsumura
  • Publication number: 20010004913
    Abstract: With the ultrasonic adhering method and apparatus, ultrasonic adhesion can be made appropriately, regardless of external environments and a simple structure. The apparatus includes an ultrasonic oscillator for generating ultrasonic vibration, a horn provided in this ultrasonic oscillator for oscillating ultrasonically, and a temperature sensor for sensing the temperature of the horn. A controlling unit is provided for detecting the temperature of the horn and controlling oscillation time of the ultrasonic oscillator in a state of the horn being contact with an object to be adhered in such a manner that the oscillation time has a negative correlation with respect to the temperature of the horn.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 28, 2001
    Applicant: YKK Corporation
    Inventors: Hideji Maeda, Keisuke Iwashita, Satoshi Matsumura